公开(公告)号：US20230393184A1

公开(公告)日：2023-12-07

申请号：US17952535

申请日：2022-09-26

Applicant: Microchip Technology Incorporated

Inventor： Gary Qu Jin ,  Chris du Quesnay ,  Ehsan Rahimi

IPC: G01R29/26

CPC classification number: G01R29/26

Abstract: A device for measuring phase noise, including a sampler to sample an input signal, an input filter to receive an input from the sampler, a noise generator to generate a noise signal, a combiner to receive input from, respectively, the input filter and the noise generator, the combiner to output an integrated noise output measurement. The input filter may operate in either the time domain or the frequency domain. The noise generate may generate a noise signal based on the sampler output, or may generate a noise estimate value based on the sampler output.

公开(公告)号：US11831340B2

公开(公告)日：2023-11-28

申请号：US17453119

申请日：2021-11-01

Applicant: Microchip Technology Incorporated

Inventor： Peter Graumann

IPC: H03M13/29 ,  H03M13/17 ,  G06F11/10

CPC classification number: H03M13/2906 ,  G06F11/1076 ,  H03M13/17

Abstract: Disclosed embodiments of the present disclosure relate, generally, to systems, methods, and devices for correction of burst-errors induced during transmission of encoded blocks of information. Some embodiments relate to decoders configured to test candidate corrections on a received block of information and select a candidate correction that best fits the characteristics of burst-errors expected for a type of transmission scheme. Such tested candidate corrections may be selected based on characteristics of burst-errors typically induced for a type of transmission scheme. Some embodiments relate to decoders configured to test candidate corrections for correcting burst-errors and perform standard error correcting techniques such as Reed-Solomon forward error correction techniques. Some embodiments relate to systems, such as serial/deserializer interfaces, that incorporate such decoders.

公开(公告)号：US11824536B2

公开(公告)日：2023-11-21

申请号：US18112812

申请日：2023-02-22

Applicant: Microchip Technology Incorporated

Inventor： Yong Yuenyongsgool ,  Stephen Bowling ,  Pedro Ovalle

IPC: H03K3/017 ,  G06F1/06 ,  H03K21/02

CPC classification number: H03K3/017 ,  G06F1/06 ,  H03K21/02

Abstract: An apparatus includes an adjustment circuit configured to receive a pulsed-width modulation (PWM) input, generate an adjusted PWM signal based upon the PWM input, and determine that a first pulse of the PWM input is shorter than a runt signal limit. The adjustment circuit is further configured to, in the adjusted PWM signal, extend the first pulse of the PWM input based on the determination that the PWM input is shorter than the runt signal limit, and output the adjusted PWM signal to an electronic device.

公开(公告)号：US11824080B2

公开(公告)日：2023-11-21

申请号：US17233342

申请日：2021-04-16

Applicant: Microchip Technology Incorporated

Inventor： Yaojian Leng

IPC: H01L23/532 ,  H01C17/075 ,  H01L49/02 ,  H01C7/00 ,  H01L23/00

CPC classification number: H01L28/24 ,  H01C7/006 ,  H01C17/075 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/05

Abstract: A thin film resistor (TFR) module may be formed in copper interconnect in an integrated circuit device. A pair of displacement-plated TFR heads may be formed by forming a pair of copper TFR head elements (e.g., damascene trench elements) spaced apart from each other in a dielectric region, and displacement plating a barrier region on each TFR head element to form a displacement-plated TFR head. A TFR element may be formed on the pair of displacement-plated TFR heads to define a conductive path between the pair of TFR head elements through the TFR element and through the displacement-plated barrier region on each metal TFR head. Conductive contacts may be formed connected to the pair of displacement-plated TFR heads. The displacement-plated barrier regions may protect the copper TFR heads from copper corrosion and/or diffusion, and may comprise CoWP, CoWB, Pd, CoP, Ni, Co, Ni—Co alloy, or other suitable material.

公开(公告)号：US11808641B2

公开(公告)日：2023-11-07

申请号：US17656595

申请日：2022-03-25

Applicant: Microchip Technology Incorporated

Inventor： Ajay Kumar ,  Hyunsoo Yeom

IPC: G01K7/00 ,  G01K7/01

CPC classification number: G01K7/01

Abstract: Systems, methods and devices relate to remote temperature sensing responsive to fractional currents used to bias a remote temperature diode. Fractional currents may be selected to simplify at least some temperature calculations performed using digital logic. Values of at least two voltage changes may be determined at least partially based on values of voltages generated across a pair of nodes at least partially responsive to excitation currents. Such pair of nodes associated with sensing paths coupled with a remote diode. A value of temperature may be determined at least partially based on the values of at least two voltage changes and a stored value of a fractional mirror ratio. The fractional mirror ratio represents a relationship between current magnitudes of excitation currents.

公开(公告)号：US20230353108A1

公开(公告)日：2023-11-02

申请号：US18306117

申请日：2023-04-24

Applicant: Microchip Technology Incorporated

Inventor： Lei Zou

IPC: H03F3/45 ,  H03F1/48

CPC classification number: H03F3/45475 ,  H03F3/45273 ,  H03F1/486

Abstract: One or more examples relate to inverting current amplification and related touch systems. An apparatus includes a first transistor, a second transistor, and a feedback loop. The first transistor and the second transistor provide controlled current at the second transistor that is a copy of current at the first transistor when respective drain-source voltages of the first transistor and the second transistor are substantially equal. The feedback loop sets respective drain-source voltages of the first transistor and the second transistor to be substantially equal, wherein a responsiveness of the feedback loop is proportional to a set transconductance of the feedback loop.

公开(公告)号：US20230350743A1

公开(公告)日：2023-11-02

申请号：US18346718

申请日：2023-07-03

Applicant: Microchip Technology Incorporated

Inventor： Dixon Chen ,  Jiachi Yu ,  Kevin Yang

IPC: G06F11/07 ,  G06F11/32 ,  G06F11/16

CPC classification number: G06F11/076 ,  G06F11/322 ,  G06F11/1608 ,  G06F11/0793 ,  H04L1/20

Abstract: Physical layer devices and related methods for determining Bit Error Rates (BERs) and correcting errors in signals received through shared transmission media of wireless local area networks are disclosed. A physical layer device is configured to identify coding violations in received signal, determine a rate of the coding violations in the signal, and estimate a BER of the signal to be equal to the determined rate of the coding violations. A physical layer device is configured to invert a half symbol immediately preceding or immediately following a coding violation based, at least in part, on signal integrities of the half symbol immediately preceding and the half symbol immediately following the coding violation to correct a bit error.

公开(公告)号：US11781886B2

公开(公告)日：2023-10-10

申请号：US17446768

申请日：2021-09-02

Applicant: Microchip Technology Incorporated

Inventor： Mirko Loncaric

IPC: G01D5/24 ,  H02J7/00 ,  H02J7/34 ,  G01R27/26 ,  G01R19/165

CPC classification number: G01D5/24 ,  G01R19/16585 ,  G01R27/2605 ,  H02J7/0068 ,  H02J7/345

Abstract: A disclosed method includes: setting a connector of an acquisition circuit and an associated capacitor to a predetermined potential; providing an energy pulse of a predetermined first time duration to the connector; at a time occurring substantially at a predetermined second time duration after an end of the predetermined first time duration of the energy pulse, coupling the associated capacitor and the connector of the acquisition circuit; and sampling a voltage being exhibited across the associated capacitor.

公开(公告)号：US11775045B2

公开(公告)日：2023-10-03

申请号：US16781227

申请日：2020-02-04

Applicant: Microchip Technology Incorporated

Inventor： William T. Baggett ,  Venkatraman Iyer

IPC: G06F1/3234 ,  G06F13/20

CPC classification number: G06F1/3234 ,  G06F13/20 ,  G06F2213/40

Abstract: Described is an architecture for a physical layer device useable with single pair Ethernet in a multidrop bus topology that may operate in a sleep mode and control other devices in network segment to operate in a sleep mode. Some embodiments of the physical layer device may support partial networking in a multidrop network, and mixed networks including the same.

公开(公告)号：US20230303031A1

公开(公告)日：2023-09-28

申请号：US17964188

申请日：2022-10-12

Applicant: Microchip Technology Incorporated

Inventor： Carmelo Angelo De Mola

IPC: B60R25/10 ,  B60R25/104

CPC classification number: B60R25/1004 ,  B60R25/104

Abstract: A system having a theft event sensor; a primary alarm actuator; a display alarm actuator; and a vehicle security device to: receive a theft event signal from the theft event sensor, transmit a primary alarm signal to the primary alarm actuator, and transmit a display alarm signal to the display alarm actuator.