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公开(公告)号：US20180302060A1
公开(公告)日：2018-10-18
申请号：US15762995
申请日：2016-08-03
申请人： SNAPTRACK, INC.
发明人： Thomas KAUSCHKE
摘要： In order to suppress an interference frequency in a ladder-type filter, an additional resonator (RZ1) that acts as a capacitance is connected in parallel to a series resonator (S1). The antiresonance of the additional resonator creates an additional pole in order for the interference frequency to be attenuated more effectively.
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公开(公告)号：US20180294776A1
公开(公告)日：2018-10-11
申请号：US15915936
申请日：2018-03-08
发明人： Peter Harris Robert Popplewell , Jakub F. Pingot , Florinel G. Balteanu , Martin Wilson , Mark Tuckwell
CPC分类号： H03F1/0227 , H02M3/156 , H02M3/158 , H03F1/0211 , H03F1/025 , H03F3/19 , H03F3/193 , H03F3/195 , H03F3/21 , H03F3/211 , H03F2200/102 , H03F2200/451 , H03F2203/21106
摘要： Apparatus and methods for reducing inductor ringing of a voltage converter are provided. In certain configurations, a voltage converter includes an inductor connected between a first node and a second node, a plurality of switches, and a bypass circuit having an activated state and a deactivated state. The switches includes a first switch connected between a battery voltage and the first node, a second switch connected between the first node and a ground voltage, a third switch connected between the second node and the ground voltage, and a fourth switch connected between the second node and the output. The bypass circuit includes a first pair of transistors connected between the first node and the second node and configured to turn on to bypass the inductor in the activated state and to turn off in the deactivated state.
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公开(公告)号：US10097152B2
公开(公告)日：2018-10-09
申请号：US14653829
申请日：2012-12-21
申请人： Snaptrack Inc.
发明人： Gilles Moulard , Paul Muralt , Ramin Matloub
IPC分类号： H01L41/187 , H03H3/04 , H01L41/29 , H01L41/314 , H01L41/332 , H03H3/02 , H03H9/02 , H03H9/58
摘要： A MEMS component includes a lower electrode. The MEMS component also includes an upper electrode. The upper electrode overlies the lower electrode. The MEMS component also includes a first piezoelectric layer between the lower electrode and the upper electrode. The first piezoelectric layer has a first piezoelectric material comprising AlN and Sc.
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公开(公告)号：US10075134B2
公开(公告)日：2018-09-11
申请号：US14892501
申请日：2014-05-22
申请人： SnapTrack, Inc.
发明人： Nicholas Shute
CPC分类号： H03F1/0211 , H03F1/0222 , H03F1/0227 , H03F1/0244 , H03F3/19 , H03F3/21 , H03F2200/102 , H03F2200/451 , H03G3/30 , H03G3/3005 , H03G3/3015
摘要： There is disclosed an envelope tracking amplification stage comprising an input path and an envelope path and a delay stage in one of the input path and the envelope path, the delay of the delay stage being determined in dependence on the slope polarity of a signal representing the input and whether the signal in the input path leads or lags the signal in the envelope path.
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公开(公告)号：US20180145589A1
公开(公告)日：2018-05-24
申请号：US15574382
申请日：2016-05-26
申请人： SNAPTRACK, INC.
发明人： Benoit LABBE , Gerard WIMPENNY
CPC分类号： H02M3/156 , G05F1/56 , H02M2001/0009 , H02M2001/0025
摘要： There is disclosed a voltage regulator, including a switching stage, for generating an output voltage, the voltage regulator comprising a feedback path for controlling the switching stage, in which a feedback signal in the feedback path is ramp-compensated, the ramp for the ramp compensation being generated from an output of the switching stage.
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公开(公告)号：US20180097172A1
公开(公告)日：2018-04-05
申请号：US15820471
申请日：2017-11-22
申请人： SnapTrack, Inc.
发明人： Hans KRÜGER , Alois STELZL , Christian BAUER , Jürgen PORTMANN , Wolfgang PAHL
IPC分类号： H01L41/23 , H01L41/293 , H01L41/113 , H01L41/27 , H01L23/00 , H01L41/053 , H01L41/083 , B81B7/00
CPC分类号： H01L41/23 , B81B7/0035 , B81B7/007 , B81B2207/095 , H01L24/97 , H01L41/053 , H01L41/0533 , H01L41/083 , H01L41/1132 , H01L41/27 , H01L41/293 , H01L41/297 , H01L2224/11 , H01L2224/16225 , H03H9/0557
摘要： A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.
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公开(公告)号：US20180076846A1
公开(公告)日：2018-03-15
申请号：US15564675
申请日：2016-04-21
申请人： SNAPTRACK, INC.
发明人： Juha ELLÄ , Edgar SCHMIDHAMMER , Gabriele KOLB , Ratko JOVOVIC
IPC分类号： H04B1/52 , H04B1/04 , H04B1/00 , H04B1/403 , H04B1/48 , H04B1/18 , H01P1/15 , H01P1/18 , H01P1/20 , H03H7/01 , H03H7/46
摘要： The invention relates to an HF circuit, for example for use in front-end circuits, having improved signal quality in carrier aggregation. According to the invention, a signal path between a duplexer and a diplexer comprises a phase shifter.
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公开(公告)号：US20180019716A1
公开(公告)日：2018-01-18
申请号：US15715962
申请日：2017-09-26
申请人： SNAPTRACK, INC.
发明人： Martin Paul WILSON
CPC分类号： H03F3/193 , H03F1/02 , H03F1/0222 , H03F1/086 , H03F1/32 , H03F1/565 , H03F3/19 , H03F3/191 , H03F3/21 , H03F2200/391 , Y10T29/49002
摘要： A power amplifier circuit comprising a transistor for receiving a signal to be amplified at an input and for outputting an amplified signal at an output; a modulated power supply connected to the transistor output; and a resistive element connected at the transistor output such that a low impedance is maintained at the transistor output across a range of operational frequencies.
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公开(公告)号：US09858845B2
公开(公告)日：2018-01-02
申请号：US14521019
申请日：2014-10-22
申请人： SnapTrack, Inc.
CPC分类号： G09G3/2003 , G09G3/3466 , G09G5/02 , G09G5/06 , G09G2310/0235 , G09G2320/066 , G09G2320/0666 , G09G2320/0673 , G09G2330/021 , G09G2340/06 , G09G2360/16 , H04N1/52 , H04N1/54 , H04N1/6058 , H04N1/6063 , H04N9/3111
摘要： This disclosure provides systems, methods, and apparatus for generating images on a display. A multi-primary display can include control logic that converts input image data into the multi-primary color space employed by the display by mapping the input pixel values into the XYZ color space according to a gamut mapping function and then decomposing the XYZ tristimulus values into color subfields associated with the display's primary colors. For example, such a process can be used to covert image frames encoded in an RGB color space into a RGBW color space. In some implementations, the control logic can adapt the gamut mapping and/or the decomposition processes based on a saturation level of the image being processed.
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公开(公告)号：US09853204B2
公开(公告)日：2017-12-26
申请号：US14650538
申请日：2013-10-14
申请人： Snaptrack Inc.
发明人： Hans Krüger , Alois Stelzl , Christian Bauer , Jürgen Portmann , Wolfgang Pahl
IPC分类号： H01L29/84 , H01L41/23 , H01L41/113 , H01L41/083 , H01L41/053 , H01L41/27 , H01L41/293 , B81B7/00 , H01L23/00
CPC分类号： H01L41/23 , B81B7/007 , B81B2207/095 , H01L24/97 , H01L41/053 , H01L41/083 , H01L41/1132 , H01L41/27 , H01L41/293 , H01L2224/11 , H01L2224/16225
摘要： A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.
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