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47 条记录 (耗时 0.045 秒)

    DEFECT REDUCTION IN ELECTRODEPOSITED COPPER FOR SEMICONDUCTOR APPLICATIONS
    41.
    发明申请
    DEFECT REDUCTION IN ELECTRODEPOSITED COPPER FOR SEMICONDUCTOR APPLICATIONS 有权
    用于半导体应用的电沉积铜中的缺陷减少

    公开(公告)号：US20080121527A1

    公开(公告)日：2008-05-29

    申请号：US11971061

    申请日：2008-01-08

    申请人： John Commander ,  Richard Hurtubise ,  Vincent Paneccasio ,  Xuan Lin ,  Kshama Jirage

    发明人： John Commander ,  Richard Hurtubise ,  Vincent Paneccasio ,  Xuan Lin ,  Kshama Jirage

    IPC分类号： C25D7/12

    CPC分类号： C25D7/123 ,  C25D3/38 ,  C25D7/12 ,  H01L21/2885 ,  H01L21/76877 ,  H05K3/423

    摘要： A method for electroplating a copper deposit onto a semiconductor integrated circuit device substrate having submicron-sized features, and a concentrate for forming a corresponding electroplating bath. A substrate is immersed into an electroplating bath formed from the concentrate including ionic copper and an effective amount of a defect reducing agent, and electroplating the copper deposit from the bath onto the substrate to fill the submicron-sized reliefs. The occurrence of protrusion defects from superfilling, surface roughness, and voiding due to uneven growth are reduced, and macro-scale planarity across the wafer is improved.

    摘要翻译： 一种用于将铜沉积物电镀到具有亚微米尺寸特征的半导体集成电路器件衬底上的方法，以及用于形成相应的电镀浴的浓缩物。 将衬底浸入由包括离子铜和有效量的缺陷还原剂的浓缩物形成的电镀浴中，并将铜沉积物从浴中电镀到衬底上以填充亚微米尺寸的浮雕。 发生由于不均匀生长引起的超填充，表面粗糙度和空隙的突出缺陷的发生，并且提高了晶片上的宏观平面度。

    Method for applying a conductive paint coating and articles made thereby
    45.
    发明授权
    Method for applying a conductive paint coating and articles made thereby 失效
    用于涂覆导电涂料的方法和由此制成的制品

    公开(公告)号：US06375866B1

    公开(公告)日：2002-04-23

    申请号：US09478951

    申请日：2000-01-07

    申请人： Vincent Paneccasio, Jr. ,  Mark P. Chasse′

    发明人： Vincent Paneccasio, Jr. ,  Mark P. Chasse′

    IPC分类号： H01B122

    CPC分类号： H05K9/0092 ,  C09D5/24 ,  H01B1/22 ,  H05K1/095

    摘要： An electrically conductive paint for applying to substrates to make articles of manufacture including EMI/RFI shielded housings of electronic components and printing plates comprises a cross-linked organic resin binder containing cross-linkable functional groups such as OH groups, electrically conductive metallic particles, preferably a mixture of silver flakes and silver-coated copper flakes, a solvent, a cross-linking agent which cross-links with itself and with the functional groups of the organic binder and preferably a catalyst which accelerates cross-linking of the cross-linking agent and organic binder. Using such a paint formulation it has been found that thinner coatings can be used while still exceeding the properties needed for EMI/RFI shielding of housing for electronic components. A Theological additive which is an organic derivative of castor oil is preferably used to control the viscosity and spraying characteristics of the paint especially in a paint composition containing silver coated copper flakes. The conductive paint provides a sprayed coating which is durable, has low resistivity and is smooth and has both cohesive and adhesive strength. A method is also provided for forming EMI/RFI shielding on housings for electronic components and electronic components made using the method and paint composition of the invention. Another method is provided for making printing plates used to print a design on an article such as a beverage can. The printing plate is made by applying the conductive paint of the invention to a polymer imaged substrate such as a steel plate.

    摘要翻译： 用于施加到基板以制造包括电子部件和印刷板的EMI / RFI屏蔽外壳的制品的导电涂料包括含有可交联官能团如OH基，导电金属颗粒的交联有机树脂粘合剂，优选地 银薄片和银包铜薄片的混合物，溶剂，与其自身交联并与有机粘合剂的官能团交联的交联剂，优选加速交联剂交联的催化剂 和有机粘合剂。 已经发现使用这种涂料配方，可以使用更薄的涂层，同时仍然超过用于电子部件的外壳的EMI / RFI屏蔽所需的性能。 作为蓖麻油的有机衍生物的神学添加剂优选用于控制油漆的粘度和喷涂特性，特别是在含有银涂布的铜薄片的涂料组合物中。 导电涂料提供耐用的，具有低电阻率并且光滑并且具有粘结和粘合强度的喷涂。 还提供了一种用于在使用本发明的方法和涂料组合物制造的电子部件和电子部件的壳体上形成EMI / RFI屏蔽的方法。 提供另一种方法用于制造用于在诸如饮料罐的物品上印刷设计的印刷板。 印版通过将本发明的导电涂料施加到诸如钢板的聚合物成像基板上而制成。

    Electroplating bath and process for white palladium
    46.
    发明授权
    Electroplating bath and process for white palladium 失效
    电镀浴和白色钯的工艺

    公开(公告)号：US5415685A

    公开(公告)日：1995-05-16

    申请号：US106672

    申请日：1993-08-16

    申请人： Vincent Paneccasio, Jr. ,  Elena Too

    发明人： Vincent Paneccasio, Jr. ,  Elena Too

    IPC分类号： C07D213/02 ,  C07D471/04 ,  C25D3/50 ,  C25D3/52

    CPC分类号： C25D3/52

    摘要： The present invention relates to an improved metallic additive free palladium electroplating bath comprising the use of a sulfonic acid compound in combination with a special class of pyridine related nitrogen compounds to both stabilize the bath and to provide white palladium deposits over a wide range of plating thicknesses.

    摘要翻译： 本发明涉及一种改进的不含金属添加剂的钯电镀浴，其包括使用磺酸化合物与特殊类别的吡啶相关氮化合物的组合以稳定浴并在宽范围的电镀厚度上提供白色钯沉积物 。

    Zinc plating solutions and method utilizing ethoxylated/propoxylated polyhydric alcohols
    47.
    发明授权
    Zinc plating solutions and method utilizing ethoxylated/propoxylated polyhydric alcohols 失效
    镀锌溶液和使用乙氧基化/丙氧基化多元醇的方法

    公开(公告)号：US4512856A

    公开(公告)日：1985-04-23

    申请号：US614693

    申请日：1984-05-25

    申请人： Vincent Paneccasio

    发明人： Vincent Paneccasio

    IPC分类号： C25D3/22

    CPC分类号： C25D3/22

    摘要： Aqueous, acid zinc electroplating solutions and method for electroplating zinc coatings are provided. The plating solutions of the invention contain a source of zinc ions, an electrolyte, at least one organic acid or salt thereof, and a novel grain-refining agent comprising a substituted polyhydric alcohol having three or more ethoxylated and/or propoxylated hydroxyl groups. Bright and lustrous zinc coatings can be electroplated from such solutions at temperatures ranging from between about 50.degree. to 100.degree. F., with the plating solutions exhibiting no significant cloud point.

    摘要翻译： 提供了一种水性酸锌电镀溶液和电镀锌涂层的方法。 本发明的电镀液含有锌离子源，电解质，至少一种有机酸或其盐，以及包含具有三个或更多个乙氧基化和/或丙氧基化羟基的取代多元醇的新型晶粒细化剂。 明亮的光泽锌涂层可以在这种溶液中从约50°至100°F的范围内电镀，镀液不会显示明显的浊点。