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公开(公告)号：US11330354B2
公开(公告)日：2022-05-10
申请号：US17071819
申请日：2020-10-15
Applicant: Apple Inc.
Inventor： Brett W. Degner , Christopher J. Stringer , Daniel R. Bloom , Michael E. Leclerc , David H. Narajowski , Kristopher P. Laurent , Daniele de Iuliis , Markus Diebel , Sung-Ho Tan
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号：US10539984B2
公开(公告)日：2020-01-21
申请号：US15234629
申请日：2016-08-11
Applicant: Apple Inc.
Inventor： Eugene A. Whang , Christopher J. Stringer , Brett W. Degner , David H. Narajowski , Patrick Kessler , Eric R. Prather , Caitlin Elizabeth Kalinowski , Adam T. Stagnaro , Daniel L. McBroom , Matthew P. Casebolt , Michael D. McBroom
IPC: H05K5/00 , G06F1/18 , G06F1/20 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18 , H05K7/00 , H05K1/18
Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.
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公开(公告)号：US20190222936A1
公开(公告)日：2019-07-18
申请号：US16362404
申请日：2019-03-22
Applicant: Apple Inc.
Inventor： Brett W. Degner , Michael E. Leclerc , David H. Narajowski , Kristopher P. Laurent , William K. Smith , Christopher J. Stringer , Daniele de Iuliis , Markus Diebel , Sung-Ho Tan
CPC classification number: H04R5/0335 , H04R1/1008 , H04R1/1041
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号：US10254805B2
公开(公告)日：2019-04-09
申请号：US15964973
申请日：2018-04-27
Applicant: Apple Inc.
Inventor： Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
IPC: H05K7/00 , G06F1/18 , G06F1/20 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US10248171B2
公开(公告)日：2019-04-02
申请号：US15965272
申请日：2018-04-27
Applicant: Apple Inc.
Inventor： Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
IPC: H05K7/00 , G06F1/18 , H05K7/20 , F21V8/00 , G06F1/20 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/40 , H05K1/02 , H05K5/03
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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Patent Agency Ranking
公开(公告)号：US10073499B2
公开(公告)日：2018-09-11
申请号：US15614354
申请日：2017-06-05
Applicant: Apple Inc.
Inventor： Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
IPC: H05K5/00 , G06F1/18 , G06F3/00 , H05K7/20 , G08B5/36 , G08B21/18 , H05K5/03 , F21V8/00 , H05K1/02 , G06F1/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US10069392B2
公开(公告)日：2018-09-04
申请号：US14728505
申请日：2015-06-02
Applicant: Apple Inc.
Inventor： Brett W. Degner , Bradley J. Hamel , David H. Narajowski , Jonah A. Harley , Michael E. Leclerc , Patrick Kessler , Samuel Bruce Weiss , Storrs T. Hoen
CPC classification number: H02K33/00 , G08B6/00 , H02K7/08 , H02K33/02 , H02K35/00 , H02K35/02 , H02K41/0356 , H04M19/047
Abstract: Embodiments described herein may take the form of an electromagnetic actuator that produces a haptic output during operation. Generally, an electromagnetic coil is wrapped around a central magnet array. A shaft passes through the central magnet array, such that the central array may move along the shaft when the proper force is applied. When a current passes through the electromagnetic coil, the coil generates a magnetic field. The coil is stationary with respect to a housing of the actuator, while the central magnet array may move along the shaft within the housing. Thus, excitation of the coil exerts a force on the central magnet array, which moves in response to that force. The direction of the current through the coil determines the direction of the magnetic field and thus the motion of the central magnet array.
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公开(公告)号：US09974206B2
公开(公告)日：2018-05-15
申请号：US15263222
申请日：2016-09-12
Applicant: Apple Inc.
Inventor： Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US09964999B2
公开(公告)日：2018-05-08
申请号：US15637940
申请日：2017-06-29
Applicant: Apple Inc.
Inventor： Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
IPC: H05K7/00 , G06F1/18 , G06F1/20 , G06F3/00 , F21V8/00 , H05K7/20 , H05K1/02 , H05K5/03 , G08B21/18 , G08B5/36
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US09913400B2
公开(公告)日：2018-03-06
申请号：US14721857
申请日：2015-05-26
Applicant: Apple Inc.
Inventor： Brett W. Degner , Eric R. Prather , David H. Narajowski , Frank F. Liang , Jay S. Nigen , Jesse T. Dybenko , Connor R. Duke , Eugene A. Whang , Christopher J. Stringer , Joshua D. Banko , Caitlin Elizabeth Kalinowski , Jonathan L. Berk , Matthew P. Casebolt , Kevin S. Fetterman , Eric J. Weirshauser
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.
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