公开(公告)号：US09748227B2

公开(公告)日：2017-08-29

申请号：US15057588

申请日：2016-03-01

Applicant: Apple Inc.

Inventor： Jun Zhai ,  Vidhya Ramachandran ,  Kunzhong Hu ,  Mengzhi Pang ,  Chonghua Zhong

IPC: H01L27/08 ,  H01L27/06 ,  H01L21/77 ,  H01L49/02

CPC classification number: H01L27/0641 ,  H01L21/77 ,  H01L23/642 ,  H01L23/645 ,  H01L24/19 ,  H01L24/20 ,  H01L25/16 ,  H01L28/10 ,  H01L28/40 ,  H01L28/90 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105

Abstract: In some embodiments, a system may include an integrated circuit. The integrated circuit may include a substrate including a first surface, a second surface substantially opposite of the first surface, and a first set of electrical conductors coupled to the first surface. The first set of electrical conductors may function to electrically connect the integrated circuit to a circuit board. The integrated circuit may include a semiconductor die coupled to the second surface of the substrate using a second set of electrical conductors. The integrated circuit may include a passive device dimensioned to be integrated with the integrated circuit. The passive device may be positioned between the second surface and at least one of the first set of electrical conductors. The die may be electrically connected to a second side of the passive device. A first side of the passive device may be available to be electrically connected to a second device.

公开(公告)号：US09633974B2

公开(公告)日：2017-04-25

申请号：US14638925

申请日：2015-03-04

Applicant: Apple Inc.

Inventor： Jun Zhai ,  Kunzhong Hu ,  Kwan-Yu Lai ,  Mengzhi Pang ,  Chonghua Zhong ,  Se Young Yang

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L25/0652 ,  H01L21/568 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/08167 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/81193 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2225/06572 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1461 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2224/27 ,  H01L2924/014

Abstract: Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), and a plurality of die attached to the front and back side of the first RDL. The first and second RDLs are coupled together with a plurality of conductive pillars extending from the back side of the first RDL to a front side of the second RDL.