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    ULTRASONIC IMAGING COMPRESSION METHODS AND APPARATUS
    45.
    发明申请
    ULTRASONIC IMAGING COMPRESSION METHODS AND APPARATUS 有权

    公开(公告)号：US20230000472A1

    公开(公告)日：2023-01-05

    申请号：US17841257

    申请日：2022-06-15

    Applicant: BFLY Operations, Inc.

    Inventor： Jonathan M. Rothberg ,  Tyler S. Ralston ,  Nevada J. Sanchez ,  Andrew J. Casper

    IPC: A61B8/00 ,  G01S7/52 ,  G01S15/89 ,  A61B8/08

    Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and an output data module may be used to move data for all received channels off-chip as a digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. The on-chip digitization of received signals also enables the on-chip integration of ultrasound processing and/or pre-processing to reduce the burden on off-chip computing. Data compression architectures are disclosed to facilitate the transfer of data off-chip as a digital data stream in accordance with the bandwidth requirements of standard commercially-available output interfaces.

    QUALITY INDICATORS FOR COLLECTION OF AND AUTOMATED MEASUREMENT ON ULTRASOUND IMAGES
    47.
    发明申请
    QUALITY INDICATORS FOR COLLECTION OF AND AUTOMATED MEASUREMENT ON ULTRASOUND IMAGES 有权

    公开(公告)号：US20220383482A1

    公开(公告)日：2022-12-01

    申请号：US17886616

    申请日：2022-08-12

    Applicant: BFLY Operations, Inc.

    Inventor： Alex Rothberg ,  Igor Lovchinsky ,  Jimmy Jia ,  Tomer Gafner ,  Matthew de Jonge ,  Jonathan M. Rothberg

    IPC: G06T7/00 ,  G01S17/00

    Abstract: Aspects of the technology described herein relate to techniques for calculating, during imaging, a quality of a sequence of images collected during the imaging. Calculating the quality of the sequence of images may include calculating a probability that a medical professional would use a given image for clinical evaluation and a confidence that an automated analysis segmentation performed on the given image is correct. Techniques described herein also include receiving a trigger to perform an automatic measurement on a sequence of images, calculating a quality of the sequence of images, determining whether the quality of the sequence of images exceeds a threshold quality, and performing the automatic measurement on the sequence of images based on determining that the quality of the sequence of images exceeds the threshold quality.

    Ultrasound apparatuses and methods for fabricating ultrasound devices
    48.
    发明授权
    Ultrasound apparatuses and methods for fabricating ultrasound devices 有权

    公开(公告)号：US11375980B2

    公开(公告)日：2022-07-05

    申请号：US16404672

    申请日：2019-05-06

    Applicant: BFLY Operations, Inc.

    Inventor： Kailiang Chen ,  Nevada J. Sanchez ,  Susan A. Alie ,  Tyler S. Ralston ,  Jonathan M. Rothberg ,  Keith G. Fife ,  Joseph Lutsky

    IPC: H04B1/06 ,  A61B8/08 ,  H04B11/00 ,  A61B8/00

    Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.

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