Abstract:
Disclosed is a cache structure for use in implementing reconfigurable system configuration information storage, comprising: layered configuration information cache units: for use in caching configuration information that may be used by a certain or several reconfigurable arrays within a period of time; an off-chip memory interface module: for use in establishing communication; a configuration anagement unit: for use in managing a reconfiguration process of the reconfigurable arrays, in mapping each subtask in an algorithm application to a certain reconfigurable array, thus the reconfigurable array will, on the basis of the mapped subtask, load the corresponding configuration information to complete a function reconfiguration for the reconfigurable array. This increases the utilization efficiency of configuration information caches. Also provided is a method for managing the reconfigurable system configuration information caches, employing a mixed priority cache update method, and changing a mode for managing the configuration information caches in a conventional reconfigurable system, thus increasing the dynamic reconfiguration efficiency in a complex reconfigurable system.
Abstract:
The present invention discloses a circuit for improving process robustness of sub-threshold SRAM memory cells, which serves as an auxiliary circuit for a sub-threshold SRAM memory cell. The output of the circuit is connected to the PMOS tube of the sub-threshold SRAM memory cell and the substrate of a PMOS tube in the circuit. The circuit comprises a detection circuit for threshold voltage of PMOS tube and a differential input and single-ended output amplifier. The circuit changes the substrate voltage of the PMOS tubes in the sub-threshold SRAM memory cell and the substrate voltage of the PMOS tube in the circuit in a self-adapting manner by detecting threshold voltage fluctuations of PMOS tubes and NMOS tubes resulted from process fluctuations and thereby regulate the threshold voltages of the PMOS tubes, so that the threshold voltage of PMOS tubes matches the threshold voltage of NMOS tubes. The circuit improves the noise margin of sub-threshold SRAM memory cells and effectively improves the process robustness of sub-threshold SRAM memory cells.
Abstract:
A high-current, N-type silicon-on-insulator lateral insulated-gate bipolar transistor, including: a P-type substrate, a buried-oxide layer disposed on the P-type substrate, an N-type epitaxial layer disposed on the oxide layer, and an N-type buffer trap region. A P-type body region and an N-type central buffer trap region are disposed inside the N-type epitaxial layer; a P-type drain region is disposed in the buffer trap region; N-type source regions and a P-type body contact region are disposed in the P-type body region; an N-type base region and a P-type emitter region are disposed in the buffer trap region; gate and field oxide layers are disposed on the N-type epitaxial layer; polycrystalline silicon gates are disposed on the gate oxide layers; and a passivation layer and metal layers are disposed on the surface of the symmetrical transistor. P-type emitter region output and current density are improved without increasing the area of the transistor.
Abstract:
The present invention discloses an ultralow-power negative margin timing monitoring method of a neural network circuit, relates to an adaptive voltage regulation technology based on on-chip timing detection, and belongs to the technical field of low-power design of integrated circuit. The present invention provides an ultralow-power operating method of neural network circuit. By inserting a timing monitoring unit in specific position of critical paths and setting partial circuits to operate under “negative margin”, the system can further lower voltage, compress the timing slack, and obtain higher power gain.
Abstract:
An adaptive load optimization method for a resonant gate drive circuit is provided to optimize the switching loss, turn-on loss and gate drive loss under different MOSFET loads. A data table is pre-stored in a digital signal processor chip (DSP), and voltages and pre-charge times, corresponding to a low total loss, of the resonant gate driver obtained by actual tests in case of different load currents are recorded in the data table; and in actual application, after an analog-to-digital converter terminal (ADC) samples a load current, a load current, closest to the sampled load current, is read from the data table, and the digital signal processor chip (DSP) is enabled to perform table look-up to obtain an optimized voltage and pre-charge time of a gate drive circuit.
Abstract:
In the monolithically integrated GaN-based half-bridge circuit, a nucleation layer, a buffer layer, a channel layer and a barrier layer are sequentially provided on a conductive substrate, the barrier layer and the channel layer are separated by isolation layers, and a diode, an integrated capacitor, a low-side transistor, a high-side transistor, a first integrated resistor and a second integrated resistor are provided. The half-bridge circuit includes: a low-side transistor and a high-side transistor, wherein a drain of the low-side transistor is connected to a source of the high-side transistor and also connected to an output terminal Vout, and a substrate of the low-side transistor is connected to a substrate of the high-side transistor, wherein a series resistor is connected in parallel to a drain of the high-side transistor and a source of the low-side transistor.
Abstract:
The invention provides a graphene channel silicon carbide power semiconductor transistor, and its cellular structure thereof. Characterized in that, a graphene strip serving as a channel is embedded in a surface of the P-type body region and two ends of the graphene strip are respectively contacted with a boundary between the N+-type source region and the P-type body region and a boundary between the P-type body region and the N-type drift region, and the graphene strip is distributed in a cellular manner in a gate width direction, a conducting channel of a device is still made of graphene; in the case of maintaining basically invariable on-resistance and current transmission capacity, the P-type body regions are separated by the graphene strip, thus enhancing a function of assisting depletion, which further reduces an overall off-state leakage current of the device, and improves a breakdown voltage.
Abstract:
A transverse ultra-thin insulated gate bipolar transistor having current density includes: a P substrate, where the P substrate is provided with a buried oxide layer thereon, the buried oxide layer is provided with an N epitaxial layer thereon, the N epitaxial layer is provided with an N well region and P base region therein, the P base region is provided with a first P contact region and an N source region therein, the N well region is provided with an N buffer region therein, the N well region is provided with a field oxide layer thereon, the N buffer region is provided with a P drain region therein, the N epitaxial layer is provided therein with a P base region array including a P annular base region, the P base region array is located between the N well region and the P base region, the P annular base region is provided with a second P contact region and an N annular source region therein, and the second P contact region is located in the N annular source region. The present invention greatly increases current density of a transverse ultra-thin insulated gate bipolar transistor, thus significantly improving the performance of an intelligent power module.
Abstract:
Disclosed is a noise current compensation circuit. The circuit is provided with two input and output terminals A and B, and two control terminals CON and CONF. The control terminals control a work mode (work state and pre-charge state) of the compensation circuit. The compensation circuit consists of 7 PMOS transistors and 8 NMOS transistors. In the normal work state, by detecting changes of potential change rate of two signal lines in an original circuit, the noise current compensation circuit automatically enables one end of the original circuit that discharges slowly to discharge a signal more slowly, and enables one end of the original circuit that discharges rapidly to discharge a signal more rapidly, thus eliminating the influence of the noise current on the circuit and providing assistance for correct identification of subsequent circuit signals. The current compensation circuit can be used for an SRAM bit line leakage current compensation circuit, because the existence of a large leakage current on the SRAM bit line leads to the decreasing of a voltage difference between two ends of the bit line, resulting in that a subsequent circuit cannot correctly identify a signal.