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44 条记录 (耗时 0.02 秒)

    Method for manufacturing circuit board for semiconductor package
    41.
    发明申请
    Method for manufacturing circuit board for semiconductor package 审中-公开
    半导体封装电路板的制造方法

    公开(公告)号：US20070087587A1

    公开(公告)日：2007-04-19

    申请号：US11543679

    申请日：2006-10-04

    申请人： Ming Chang ,  E-Tung Chou ,  Che-Wei Hsu ,  Tzu-Sheng Tseng

    发明人： Ming Chang ,  E-Tung Chou ,  Che-Wei Hsu ,  Tzu-Sheng Tseng

    IPC分类号： H01R12/00

    CPC分类号： H05K3/242 ,  H01L21/4803 ,  H01L21/481 ,  H01L23/13 ,  H01L2924/0002 ,  H05K3/0044 ,  H05K2203/0228 ,  H05K2203/107 ,  H05K2203/175 ,  H01L2924/00

    摘要： A method for manufacturing a circuit board for a semiconductor package is proposed. The method includes providing a circuit board having a circuit layer formed on at least one surface thereof, wherein the circuit board is defined with at least one predetermined area, the circuit layer includes a plurality of electrically conductive pads and conductive wires for electroplating and being connected with the electrically conductive pads, the conductive wires are formed within the predetermined area, and a metal protecting layer formed to cover the electrically conductive pads and the conductive wires; removing the portion of the metal protecting layer and the conductive wires covered by the portion of the metal protecting layer to electrically disconnect the electrically conductive pads from the conductive wires; and removing the predetermined area to form a through hole in the circuit board. Thus, formation of burrs in the metal protecting layer can be prevented after formation of the through hole.

    摘要翻译： 提出一种制造半导体封装用电路基板的方法。 该方法包括提供具有形成在其至少一个表面上的电路层的电路板，其中电路板被限定有至少一个预定区域，电路层包括多个导电焊盘和用于电镀和连接的导线 通过导电焊盘，导电线形成在预定区域内，形成为覆盖导电焊盘和导线的金属保护层; 去除金属保护层的一部分和由金属保护层的部分覆盖的导电线，以使导电焊盘与导电线电断开; 并且移除所述预定区域以在所述电路板中形成通孔。 因此，在形成通孔之后可以防止在金属保护层中形成毛刺。

    SMD(surface mount device)-type light emitting diode with high heat dissipation efficiency and high power
    42.
    发明申请
    SMD(surface mount device)-type light emitting diode with high heat dissipation efficiency and high power 失效
    SMD（表面贴装器件）型发光二极管，散热效率高，功率大

    公开(公告)号：US20060076570A1

    公开(公告)日：2006-04-13

    申请号：US11078344

    申请日：2005-03-14

    申请人： Yen Chen ,  Ching Tseng ,  Sher Wei ,  Ming Chang

    发明人： Yen Chen ,  Ching Tseng ,  Sher Wei ,  Ming Chang

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A SMD-type LED with high heat dissipation efficiency and high power includes a base with a post arranged and integrated on the center thereof and a slot on top of the post. At least one contact hole is arranged on bottom of the base for connecting with an external heat sink so as to achieve better heat dissipation. The slot is used for accommodating a LED chip that is electrically connected with a circuitry extension device through two electrical contacts. The LED chip is electrically connected with the circuitry extension device directly while it also connects with the base for heat dissipation, thus the structure for electricity conduction is separated from the structure for heat dissipation.

    摘要翻译： 具有高散热效率和高功率的SMD型LED包括具有布置在其中心上的柱和在柱的顶部上的槽的基座。 至少一个接触孔布置在底座的底部，用于与外部散热器连接，从而实现更好的散热。 该槽用于容纳通过两个电触点与电路延伸装置电连接的LED芯片。 LED芯片直接与电路延伸装置电连接，同时它还与底座连接以进行散热，因此用于导电的结构与用于散热的结构分离。