摘要:
A system, device and related method are used to communicate data via a plurality of data lanes including a selected data lane. In a first mode of operation, payload data and related supplemental data are communicated via the plurality of data lanes including the selected data lane. In a second mode of operation, only payload data is communicated via the plurality of data lanes, except the selected data lane.
摘要:
According to one embodiment, a method of performing fast locking in a delay locked loop circuit is disclosed. The method includes performing a first comparison comparing an input clock signal to a first feedback clock signal that is a non-inverted feedback clock signal, and performing a second comparison comparing the input clock signal to a second feedback clock signal that is the feedback clock signal inverted. The method also includes, based on the first and second comparisons, selecting one of the non-inverted feedback clock signal or the inverted feedback clock signal to synchronize with the input clock signal. In addition, the method includes synchronizing the selected clock signal with the input clock signal.
摘要:
According to one embodiment, a method of performing fast locking in a delay locked loop circuit is disclosed. The method includes performing a first comparison comparing an input clock signal to a first feedback clock signal that is a non-inverted feedback clock signal, and performing a second comparison comparing the input clock signal to a second feedback clock signal that is the feedback clock signal inverted. The method also includes, based on the first and second comparisons, selecting one of the non-inverted feedback clock signal or the inverted feedback clock signal to synchronize with the input clock signal. In addition, the method includes synchronizing the selected clock signal with the input clock signal.
摘要:
A semiconductor memory device includes a plurality of memory banks; a plurality of temperature sensing circuits, and a shared control circuit. The temperature sensing circuits correspond to the memory banks and each is disposed in the vicinity of a corresponding memory bank. The shared control circuit is connected to the plurality of temperature sensing circuits and a plurality of refresh circuits for refreshing the plurality of memory banks, performs calibration on the plurality of temperature sensing circuits, performs digital processing on signals for separately controlling refresh intervals for the plurality of memory banks, and transmits the processed signals to the plurality of refresh circuits. Therefore, the refresh intervals for individual channels or banks are separately or selectively controlled. Further, since the plurality of temperature sensing circuits are connected to the shared temperature control circuit, the occupied area of the circuits in a chip is reduced or minimized.
摘要:
A semiconductor device includes a first substrate including at least one first well region and first impurity regions on portions of the substrate and a bias voltage plate on a surface of the substrate. A semiconductor device may be of a three dimensional stack structure, and in example embodiments, the semiconductor device may further include a through contact plug substantially perpendicularly penetrating at least one substrate and at least one bias voltage plate. Therefore, a design margin of a semiconductor device may be enhanced and a bias voltage may be provided reliably.
摘要:
A memory system includes at least one memory module, each of which has a pattern data generating circuit for generating a pattern data, which has a plurality of memories to which a command signal is commonly applied and corresponding data is applied respectively; and a memory controller for respectively applying the command signal and the corresponding data to the plurality of memories, applying a pattern data generating command to the memory module during a timing control operation, calculating time differences among data of reaching each of the plurality of memories using the pattern data outputted from each of the memories and receiving and outputting data using the calculated data reaching time difference. Therefore, a stable data transmission is achieved between the memory controller and the memories.
摘要:
A memory module, a memory system including a memory controller and a memory module and methods thereof. The example memory module may include a plurality of memory units each having an interface and at least one memory device. An example write operation method may include receiving a packet command at a given one of a plurality of memory units, each of the plurality of memory units including an interface and at least one memory device, extracting a command signal, an address and write data from the received packet command if the received packet command corresponds to a write operation, transferring the extracted write data to at least one memory device via write/read data lines internal to the given one memory unit and writing the transferred write data at the at least one memory device. An example read operation may include receiving a packet command at a given one of a plurality of memory units, each of the plurality of memory units including an interface and at least one memory device, extracting a command signal and an address from the received packet command if the received packet command corresponds to a read operation, transferring the extracted command signal and address to at least one memory device, receiving read data corresponding to the extracted command signal and address from the at least one memory device via write/read data lines internal to the given one memory unit and transmitting the received read data from the interface via read data lines external to the given one memory unit.
摘要:
Methods for controlling the timing of a pre-charge operation in a memory device are provided. In embodiments of the present invention, the timing may be controlled by dynamically selecting a word line off time based on information about a number of column cycles. This may be accomplished, for example, by routing a word line disable signal via one of a first plurality of delay paths. The methods may further include dynamically selecting a bit line equalization start time based on the information about the number of column cycles. This may be accomplished, for example, by routing a bit line equalization start signal via one of a second plurality of delay paths. Pursuant to still further embodiments of the present invention, systems for controlling timing in a memory device are provided which include a control circuit that is configured to select a word line off time from a plurality of word line off times in response to a word line signal and information about a number of column cycles.
摘要:
A memory system includes at least one memory module, each of which has a pattern data generating circuit for generating a pattern data, which has a plurality of memories to which a command signal is commonly applied and corresponding data is applied respectively; and a memory controller for respectively applying the command signal and the corresponding data to the plurality of memories, applying a pattern data generating command to the memory module during a timing control operation, calculating time differences among data of reaching each of the plurality of memories using the pattern data outputted from each of the memories and receiving and outputting data using the calculated data reaching time difference. Therefore, a stable data transmission is achieved between the memory controller and the memories.
摘要:
A semiconductor memory device comprising control pads and input/output I/O pads capable of reducing the data path for reading and writing data in a cell array, and a method for driving the semiconductor memory device are included. The semiconductor memory device comprises a plurality of memory banks arranged at a cell region of a memory chip, and a plurality of control pads and a plurality of I/O pads, separately arranged from each other at the memory chip, for reading/writing data from/in the memory banks, wherein the plurality of control pads and I/O pads are dispersed at the peripheral region between adjacent memory banks and at the outer portions of the memory banks.