公开(公告)号：US20160197620A1

公开(公告)日：2016-07-07

申请号：US14589484

申请日：2015-01-05

Applicant: General Electric Company

Inventor： Amit Satish Gore ,  Emad Andarawis Andarawis ,  Naresh Kesavan Rao

IPC: H03M3/00 ,  G01B7/00

CPC classification number: H03M3/35 ,  G01D5/2291 ,  H03M3/466

Abstract: An analog-to-digital converter (ADC) is provided includes a first sigma-delta modulator (SDM) electrically coupled to a first signal input. The first SDM includes a first summing junction configured to receive a plurality of inputs to the first SDM. The ADC further includes a second sigma-delta modulator (SDM) electrically coupled to a second signal input. The second SDM includes a second summing junction configured to receive a plurality of inputs to the second SDM. The first SDM also includes a cross-coupled feedback loop from an output of the first SDM to a negative input of the first summing junction and to a positive input of the second summing junction. The second SDM also includes a cross-coupled feedback loop from an output of the second SDM to a negative input of the first summing junction and to a negative input of the second summing junction.

Abstract translation: 提供了一种模拟 - 数字转换器（ADC），包括电耦合到第一信号输入的第一Σ-Δ调制器（SDM）。 第一SDM包括被配置为接收到第一SDM的多个输入的第一求和点。 ADC还包括电耦合到第二信号输入的第二Σ-Δ调制器（SDM）。 第二SDM包括被配置为接收到第二SDM的多个输入的第二求和结。 第一SDM还包括从第一SDM的输出到第一求和结的负输入和第二求和结的正输入的交叉耦合反馈回路。 第二SDM还包括从第二SDM的输出到第一求和结的负输入和第二求和结的负输入的交叉耦合反馈回路。

公开(公告)号：US09130365B2

公开(公告)日：2015-09-08

申请号：US14486138

申请日：2014-09-15

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Avinash Srikrishnan Kashyap ,  Emad Andarawis Andarawis ,  David Mulford Shaddock

IPC: H01L29/66 ,  H01L21/332 ,  H02H1/04 ,  H01L21/50 ,  H01L29/861 ,  H01L21/82 ,  H01L27/06 ,  H01L27/08 ,  H01L27/02 ,  H01L23/00 ,  H02H3/20 ,  H01L29/45 ,  H01L29/06 ,  H01L29/16 ,  H01L29/20 ,  H01L21/8252

CPC classification number: H02H1/04 ,  H01L21/50 ,  H01L21/8213 ,  H01L21/8252 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/96 ,  H01L27/0255 ,  H01L27/0605 ,  H01L27/0814 ,  H01L29/0661 ,  H01L29/1602 ,  H01L29/1608 ,  H01L29/2003 ,  H01L29/45 ,  H01L29/861 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13109 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/81825 ,  H01L2924/10272 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/15192 ,  H01L2924/3025 ,  H02H3/20 ,  H01L2924/0105 ,  H01L2924/00

Abstract: A high temperature electronic system includes an electronics unit configured for exposure to an environment having a temperature greater than approximately 150.0° C. The remote electronics unit includes a transient voltage suppressor (TVS) assembly coupled in operative relationship with at least some electronic components of the electronics unit. The TVS assembly includes at least one TVS device comprising at least one of a punch-through wide band-gap semiconductor TVS die and an avalanche breakdown wide band-gap semiconductor TVS die encapsulated in a flip-chip package at least partially surrounding the die, and coupled to first and second electrodes exposed to a single side of the encapsulation.

Abstract translation: 高温电子系统包括被配置为暴露于温度大于约150.0℃的环境的电子单元。远程电子单元包括瞬态电压抑制器（TVS）组件，其与至少一些电子部件的操作关系耦合 电子单元。 TVS组件包括至少一个TVS装置，其包括穿透宽带隙半导体TVS管芯和封装在至少部分围绕管芯的倒装芯片封装的雪崩击穿宽带隙半导体TVS管芯中的至少一个， 并且耦合到暴露于封装的单侧的第一和第二电极。