公开(公告)号：US08080121B2

公开(公告)日：2011-12-20

申请号：US12309706

申请日：2007-05-21

申请人： Yoshihiro Inao

发明人： Yoshihiro Inao

IPC分类号： B32B37/14 ,  B32B38/10

CPC分类号： C09J5/04 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T156/10

摘要： An adhesive agent layer for bonding a support plate (1) and a wafer (5) is in a three-layer configuration in which a hard layer (31) is sandwiched between soft layers (32) and (33) from above and below. Both the top and bottom surfaces of the adhesive agent layer are soft adhesive agent layers, which results in an excellent bonding affinity with the wafer 5 and the support plate (1). Accordingly, the peripheral portion of the wafer (5) can be prevented from being lifted before a dicing process. Further, because the sandwiched adhesive agent layer is the hard adhesive agent layer (31), even when the non-adhesive surface of the support plate (1) is vacuum suctioned, or when a pressure is applied from a grinder, the hard adhesive agent layer (31) is not deformed according to the soft adhesive agent layer (33) being drawn or pushed into through holes (2).

摘要翻译： 用于粘合支撑板（1）和晶片（5）的粘合剂层是从上下方向将软质层（32）和（33）夹在其中的硬质层（31）的三层结构。 粘合剂层的顶表面和底表面都是软粘合剂层，这导致与晶片5和支撑板（1）的极好的粘结亲和性。 因此，可以防止晶片（5）的周边部分在切割处理之前被提升。 此外，由于夹层粘合剂层是硬粘合剂层（31），所以即使当支撑板（1）的非粘合表面被真空抽吸时，或者当从研磨机施加压力时，硬粘合剂 层（31）根据软性粘合剂层（33）被拉入或推入通孔（2）而不变形。

公开(公告)号：US07999052B2

公开(公告)日：2011-08-16

申请号：US12377473

申请日：2007-08-01

申请人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura ,  Koji Saito

发明人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura ,  Koji Saito

IPC分类号： C08F220/10

CPC分类号： C08L53/00 ,  C08F293/00 ,  C08F293/005 ,  C08L2666/02 ,  C09J7/10 ,  C09J7/387 ,  C09J153/00 ,  C09J2453/00 ,  Y10T428/31721

摘要： An adhesive composition according to the present invention is an adhesive composition whose main component is a polymer obtained by copolymerization of a monomer composition, which monomer composition contains styrene, (meth)acrylic ester having a cyclic structure, and alkyl (meth)acrylate having a chain structure. The polymer thus having a styrene block segment allows improvement of thermal resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping following a high temperature process of the adhesive composition. As such, an adhesive composition is provided, which has high thermal resistance, adhesive strength in the high temperature environment, and alkaline resistance, and further which can easily carry out stripping of the adhesive composition after a high temperature process has been carried out to the adhesive composition.

摘要翻译： 根据本发明的粘合剂组合物是其主要成分是通过单体组合物共聚获得的聚合物，该单体组合物含有苯乙烯，具有环状结构的（甲基）丙烯酸酯和（甲基）丙烯酸烷基酯，其具有 链结构。 因此，具有苯乙烯嵌段链段的聚合物可以改善耐热性，在高温环境下的粘合强度，耐碱性和在粘合剂组合物的高温过程中的剥离容易性。 因此，提供了一种粘合剂组合物，其具有高耐热性，在高温环境中的粘合强度和耐碱性，并且还可以在进行高温处理之后容易地进行粘合剂组合物的剥离 粘合剂组成。

公开(公告)号：US20100227996A1

公开(公告)日：2010-09-09

申请号：US12377473

申请日：2007-08-01

申请人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura ,  Koji Saito

发明人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura ,  Koji Saito

IPC分类号： C08F220/10

CPC分类号： C08L53/00 ,  C08F293/00 ,  C08F293/005 ,  C08L2666/02 ,  C09J7/10 ,  C09J7/387 ,  C09J153/00 ,  C09J2453/00 ,  Y10T428/31721

摘要： An adhesive composition according to the present invention is an adhesive composition whose main component is a polymer obtained by copolymerization of a monomer composition, which monomer composition contains styrene, (meth)acrylic ester having a cyclic structure, and alkyl (meth)acrylate having a chain structure. The polymer thus having a styrene block segment allows improvement of thermal resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping following a high temperature process of the adhesive composition. As such, an adhesive composition is provided, which has high thermal resistance, adhesive strength in the high temperature environment, and alkaline resistance, and further which can easily carry out stripping of the adhesive composition after a high temperature process has been carried out to the adhesive composition.

摘要翻译： 根据本发明的粘合剂组合物是其主要成分是通过单体组合物共聚获得的聚合物，该单体组合物含有苯乙烯，具有环状结构的（甲基）丙烯酸酯和（甲基）丙烯酸烷基酯，其具有 链结构。 因此，具有苯乙烯嵌段链段的聚合物可以改善耐热性，在高温环境下的粘合强度，耐碱性和在粘合剂组合物的高温过程中的剥离容易性。 因此，提供了一种粘合剂组合物，其具有高耐热性，在高温环境中的粘合强度和耐碱性，并且进一步可以在对高温工艺进行后容易地进行粘合剂组合物的剥离 粘合剂组成。

公开(公告)号：US20100075141A1

公开(公告)日：2010-03-25

申请号：US12514633

申请日：2007-09-26

申请人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

发明人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

IPC分类号： B32B27/36 ,  C09J153/00

CPC分类号： C09J153/00 ,  C08F212/08 ,  C08F220/06 ,  C08F220/18 ,  C08F290/046 ,  C08F2220/301 ,  C09J7/381 ,  C09J133/10 ,  C09J133/12 ,  C09J135/06 ,  C09J2205/114 ,  C09J2433/00 ,  C09J2453/00 ,  Y10T428/2852 ,  Y10T428/2891

摘要： Disclosed is an adhesive composition whose component is a polymer obtained by copolymerizing a monomer composition containing styrene, a (meth)acrylic acid ester having a cyclic structure, and an alkyl(meth)acrylate having a chain structure. The monomer composition further contains a carboxylic acid having an ethylene double bond, a bifunctional monomer, and a styrene macromonomer. The polymer has a styrene block segment. This can improve heat resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping of an adhesive composition that has been subjected to a high temperature process. As a result, there can be obtained an adhesive composition which has high heat resistance, adhesive strength in a high temperature environment, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature.

摘要翻译： 公开了一种粘合剂组合物，其组分是通过共聚包含苯乙烯的单体组合物，具有环状结构的（甲基）丙烯酸酯）和具有链结构的（甲基）丙烯酸烷基酯获得的聚合物。 单体组合物还含有具有乙烯双键的羧酸，双官能单体和苯乙烯大分子单体。 聚合物具有苯乙烯嵌段。 这可以提高耐热性，在高温环境下的粘合强度，耐碱性，以及剥离已经进行高温处理的粘合剂组合物的容易性。 结果，可以获得耐热性高，在高温环境下的粘合强度和耐碱性的粘合剂组合物，并且在粘合剂组合物在高温下加工后可以容易地剥离。

公开(公告)号：US20090325467A1

公开(公告)日：2009-12-31

申请号：US12309285

申请日：2007-05-24

申请人： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Yasumasa Iwata

发明人： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Yasumasa Iwata

IPC分类号： B24B1/00 ,  B24B41/06

CPC分类号： B24B41/068 ,  B24B7/228 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68318 ,  H01L2221/68327

摘要： A wafer can be thinned without occurrences of dimples. A support plate 1 has a number of through holes 10. A circuit forming surface of a wafer 2 is adhered to one surface of the support plate by an adhesive member 4, and a dimple prevention member 3 having a thickness of 100 μm or more and having an adhesive layer 30 on one face is adhered to the other surface, thus the openings at both ends of the through holes 10 are blocked. The support plate is vacuum adsorbed to a support table through the dimple prevention member, and a non circuit-forming face of the wafer is ground/polished to thin the wafer. The dimple prevention member is stripped off, and a solvent is penetrated into the adhesive member through the through holes to detach the wafer from the support plate.

摘要翻译： 晶片可以变薄而不发生凹坑。 支撑板1具有多个通孔10.晶片2的电路形成表面通过粘合构件4和厚度为100μm以上的凹坑防止构件3粘附到支撑板的一个表面，以及 在一个面上具有粘合剂层30粘附到另一个表面，因此通孔10的两端的开口被阻挡。 支撑板通过凹坑防止构件被真空吸附到支撑台上，并且将晶片的非电路形成面研磨/抛光以使晶片变薄。 剥去防止凹坑的构件，并且通过通孔将溶剂渗透到粘合构件中，以将晶片从支撑板上分离。

公开(公告)号：US20090305617A1

公开(公告)日：2009-12-10

申请号：US12309287

申请日：2007-04-17

申请人： Akihiro Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao

发明人： Akihiro Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao

IPC分类号： H01L21/683 ,  H01L21/02 ,  B25B11/00 ,  B29C43/50

CPC分类号： H01L21/6875 ,  H01L21/6838

摘要： A support plate for supporting a wafer includes a plurality of through holes piercing the support plate in the thickness direction, and a belt-shaped or island-like flat portion on which the plurality of through holes are not formed.

摘要翻译： 用于支撑晶片的支撑板包括在厚度方向上穿过支撑板的多个通孔，以及未形成多个通孔的带状或岛状平坦部。

公开(公告)号：US20090199957A1

公开(公告)日：2009-08-13

申请号：US12309706

申请日：2007-05-21

申请人： Yoshihiro Inao

发明人： Yoshihiro Inao

IPC分类号： B32B38/00 ,  B32B37/14 ,  B32B38/10

CPC分类号： C09J5/04 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T156/10

摘要： An adhesive agent layer for bonding a support plate (1) and a wafer (5) is in a three-layer configuration in which a hard layer (31) is sandwiched between soft layers (32) and (33) from above and below. Both the top and bottom surfaces of the adhesive agent layer are soft adhesive agent layers, which results in an excellent bonding affinity with the wafer 5 and the support plate (1). Accordingly, the peripheral portion of the wafer (5) can be prevented from being lifted before a dicing process. Further, because the sandwiched adhesive agent layer is the hard adhesive agent layer (31), even when the non-adhesive surface of the support plate (1) is vacuum suctioned, or when a pressure is applied from a grinder, the hard adhesive agent layer (31) is not deformed according to the soft adhesive agent layer (33) being drawn or pushed into through holes (2).

摘要翻译： 用于粘合支撑板（1）和晶片（5）的粘合剂层是从上下方向将软质层（32）和（33）夹在其中的硬质层（31）的三层结构。 粘合剂层的顶表面和底表面都是软粘合剂层，这导致与晶片5和支撑板（1）的极好的粘结亲和性。 因此，可以防止晶片（5）的周边部分在切割处理之前被提升。 此外，由于夹层粘合剂层是硬粘合剂层（31），所以即使当支撑板（1）的非粘合表面被真空抽吸时，或者当从研磨机施加压力时，硬粘合剂 层（31）根据软性粘合剂层（33）被拉入或推入通孔（2）而不变形。

公开(公告)号：USD544452S1

公开(公告)日：2007-06-12

申请号：US29255496

申请日：2006-03-08

申请人： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao

设计人： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao

公开(公告)号：US20070125495A1

公开(公告)日：2007-06-07

申请号：US11633604

申请日：2006-12-04

申请人： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao

发明人： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao

IPC分类号： B32B37/00

CPC分类号： B32B38/1841 ,  B32B37/0046 ,  B32B2038/1891 ,  B32B2309/68 ,  B32B2457/14 ,  H01L21/68 ,  H01L21/68742 ,  Y10T156/17

摘要： An attaching device which makes it possible to accurately perform alignment when the diameters of a substrate and a supporting plate are substantially the same includes a mounting plate for mounting a semiconductor wafer thereon, a pressing plate for pressing a supporting plate onto the semiconductor wafer, and a pair of alignment members. The pair of alignment members are arranged to freely move back and forth in a horizontal direction, and blades for supporting a lower surface of the periphery of the supporting plate and pushing members for performing positioning in a state where the supporting plate is superposed on the semiconductor wafer are provided at tip ends of the alignment members.

摘要翻译： 一种连接装置，其能够在基板和支撑板的直径基本相同的情况下准确地进行对准，包括用于在其上安装半导体晶片的安装板，用于将支撑板按压到半导体晶片上的按压板，以及 一对对准构件。 一对对准构件被布置成在水平方向上自由地前后移动，并且用于支撑支撑板的周边的下表面的叶片和用于在支撑板叠置在半导体上的状态下执行定位的推动构件 晶片设置在对准构件的顶端。

公开(公告)号：US20070062644A1

公开(公告)日：2007-03-22

申请号：US11512566

申请日：2006-08-30

申请人： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao

发明人： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao

IPC分类号： B29C63/00

CPC分类号： B29C63/0013 ,  B29L2031/3425 ,  Y10T156/1111 ,  Y10T156/1132 ,  Y10T156/1928

摘要： A supporting plate which makes it possible to easily strip the supporting plate from a substrate in a short period of time after thinning the substrate. In the supporting plate to which a circuit-formed surface of a substrate is bonded with an adhesive, a first penetrating hole is formed in a substantially central portion of the supporting plate in the thickness direction, grooves connecting with the first penetrating hole are formed on a surface of the supporting plate to be contacted with an adhesive, and a second penetrating hole connecting with the grooves is formed in a peripheral portion of the supporting plate in the thickness direction.

摘要翻译： 支撑板，其能够在使基板变薄之后的短时间内容易地从基板剥离支撑板。 在基板的电路形成面与粘合剂接合的支撑板中，在厚度方向的支撑板的大致中央部形成有第一贯通孔，与第一贯通孔连结的槽形成在 在支撑板的周边部分沿厚度方向形成与粘合剂接触的支撑板的表面和与槽连接的第二贯通孔。