公开(公告)号：US06819864B2

公开(公告)日：2004-11-16

申请号：US09803140

申请日：2001-03-12

申请人： Kazuya Fujita ,  Shojiro Sato

发明人： Kazuya Fujita ,  Shojiro Sato

IPC分类号： H04N591

CPC分类号： H04N9/8042 ,  G11B19/022 ,  G11B27/034 ,  G11B27/105 ,  G11B27/3027 ,  G11B27/329 ,  G11B27/36 ,  G11B2220/216 ,  G11B2220/2516 ,  G11B2220/2562 ,  G11B2220/2575 ,  G11B2220/455 ,  H04N5/781 ,  H04N5/782 ,  H04N5/85 ,  H04N9/8063 ,  H04N9/8205 ,  H04N9/8227

摘要： A multi controller according to the present invention comprise first operating means for generating a control signal in association with a declination operation in plural directions, second operating means for generating a control signal in association with a rotation operation in a circular arc, and third operating means for generating a control signal in association with a shifting operation in front and back. Depending on the mode which is being executed, the control signal generated by the same operating means controls various operations.

摘要翻译： 根据本发明的多控制器包括：第一操作装置，用于产生与多个方向的偏角操作相关联的控制信号;第二操作装置，用于产生与圆弧中的旋转操作相关的控制信号;第三操作装置 用于产生与前后移动操作相关联的控制信号。 根据正在执行的模式，由相同的操作装置产生的控制信号控制各种操作。

公开(公告)号：US5472646A

公开(公告)日：1995-12-05

申请号：US8138

申请日：1993-01-25

申请人： Hirofumi Uchida ,  Kazuya Fujita

发明人： Hirofumi Uchida ,  Kazuya Fujita

IPC分类号： H01L23/12 ,  B29C45/14 ,  H01L21/52 ,  H01L21/56 ,  H01L23/28 ,  B29C45/02

CPC分类号： B29C45/14655 ,  H01L21/565 ,  H01L2924/0002

摘要： A transfer molded semiconductor method arranges a semiconductor chip on a flat die pad so that, at least one predetermined edge surface of the semiconductor chip extends or protrudes over a corresponding edge of the flat die pad. The predetermined edge of the die pad is arranged on the opposite side of a gate beneath a lead frame at the other side. The arrangement suppresses the formation of voids at a side surface of the semiconductor chip, e.g., the side surface opposite the gate at which resin is injected.

摘要翻译： 传输模制半导体方法将半导体芯片布置在平坦的芯片焊盘上，使得半导体芯片的至少一个预定的边缘表面在平坦的芯片焊盘的相应边缘上延伸或突出。 芯片焊盘的预定边缘设置在另一侧的引线框架下面的栅极的相对侧上。 该布置抑制了在半导体芯片的侧表面（例如与注入树脂的栅极相对的侧表面）形成空隙。

公开(公告)号：US5424578A

公开(公告)日：1995-06-13

申请号：US180334

申请日：1994-01-12

申请人： Kazuya Fujita ,  Kenji Toyosawa

发明人： Kazuya Fujita ,  Kenji Toyosawa

IPC分类号： C23C28/02 ,  H01L21/56 ,  H01L23/495 ,  H01L23/50 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52 ,  H01L29/60

CPC分类号： H01L23/49582 ,  H01L21/565 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48639 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181

摘要： A lead frame for use in a resin-sealed semiconductor device includes: a lead frame with inner lead portion or inner lead portion and die pad portion being silver-plated and outer lead portion being solder-plated; and a semiconductor chip being die-bonded on said die pad portion and wire-bonded to said inner lead portion. The lead frame is constructed such that a solder plating layer is provided on the top surface of the lead frame while a tin plating layer is provided under the solder plating layer. Alternatively, a copper or nickel layer or layers are provided under the solder layer or between the solder layers.

摘要翻译： 用于树脂密封半导体器件的引线框架包括：具有内部引线部分或内部引线部分的引线框架和具有镀银的管芯焊盘部分和被焊接的外部引线部分; 并且半导体芯片被芯片接合在所述芯片焊盘部分上并引线接合到所述内引线部分。 引线框架被构造成使得在引线框架的顶表面上设置焊料镀层，同时在焊料镀层下方设置镀锡层。 或者，在焊料层下方或焊料层之间设置铜或镍层。

公开(公告)号：US5182630A

公开(公告)日：1993-01-26

申请号：US828670

申请日：1992-02-07

申请人： Susumu Omi ,  Kazuya Fujita

发明人： Susumu Omi ,  Kazuya Fujita

IPC分类号： H01L23/50 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L23/3135 ,  H01L23/3157 ,  H01L23/49503 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/14 ,  H01L2924/181

摘要： A semiconductor device is provided with: a semiconductor element having a mounting face; a lead frame including a die pad having an upper surface on which the semiconductor element is mounted with the mounting face facing to the upper surface of the die pad. The die pad has such an outer shape that a central portion of each sides opposed to each other is caved more inward than an outer shape of the mounting face of the semiconductor element. The semiconductor device is also provided with: a resin film coated on a lower surface of the die pad, and a portion of the mounting face of the semiconductor element, exposed at the central portion of each side of the die pad which is opposed to each other; and a package body made of molding compound for encapsulating the semiconductor element, the die pad and the resin film. The resin film is made of resin having a high adhesiveness with respect to the semiconductor element, the die pad and the molding compound of the package body.

摘要翻译： 半导体器件具有：具有安装面的半导体元件; 引线框架，包括具有上表面的管芯焊盘，半导体元件安装在其上，安装面朝向管芯焊盘的上表面。 芯片焊盘具有这样的外部形状，使得彼此相对的每个侧面的中心部分比半导体元件的安装面的外部形状更向内凹陷。 该半导体器件还具有涂覆在芯片焊盘的下表面上的树脂膜和半导体元件的安装面的一部分，露出在与芯片焊盘相对的每一侧的中心部分 其他; 以及由用于封装半导体元件，芯片焊盘和树脂膜的模塑料制成的封装体。 树脂膜由相对于半导体元件，芯片焊盘和封装主体的模塑料具有高粘附性的树脂制成。

公开(公告)号：US09568705B2

公开(公告)日：2017-02-14

申请号：US13983876

申请日：2012-01-20

申请人： Yoshihiro Sekimoto ,  Kazuya Fujita

发明人： Yoshihiro Sekimoto ,  Kazuya Fujita

IPC分类号： G02B7/02 ,  G02B7/09 ,  G03B3/10 ,  H04N5/225 ,  G02B7/08

CPC分类号： G02B7/025 ,  G02B7/021 ,  G02B7/023 ,  G02B7/08 ,  G02B7/09 ,  G02B27/646 ,  G03B3/10 ,  G03B2205/0007 ,  G03B2205/0069 ,  H04M1/0264 ,  H04N5/2257 ,  Y10T29/4978

摘要： A camera module (40) of the present invention includes: an optical section (1) having an image pickup lens (2) and a lens barrel (3); and a lens driving device (10) including a lens holder (11). The optical section (1) and the lens driving device (10) are provided on an upper side of a sensor cover (23) covering an image pickup element (22) of an image pickup section (20). The lens barrel (3) is positioned at such a location that the lens barrel (3) does not make contact with the sensor cover (23), so that the lens barrel (3) is fixed to the lens holder (11) at the location. Before being fixed to the lens holder (11), the lens barrel (3) is slidable in the optical axis direction with respect to the lens holder (11).

摘要翻译： 本发明的照相机模块（40）包括：具有图像拾取透镜（2）和透镜镜筒（3）的光学部分（1）; 以及包括透镜保持器（11）的透镜驱动装置（10）。 光学部分（1）和透镜驱动装置（10）设置在覆盖图像拾取部分（20）的图像拾取元件（22）的传感器盖（23）的上侧。 透镜镜筒（3）位于透镜镜筒（3）不与传感器盖（23）接触的位置处，使透镜镜筒（3）固定在镜片保持器（11）上， 位置。 在固定到透镜架（11）之前，镜筒（3）可相对于透镜保持件（11）在光轴方向上滑动。

公开(公告)号：US09285698B2

公开(公告)日：2016-03-15

申请号：US12484318

申请日：2009-06-15

申请人： Shinji Uemoto ,  Hiromitsu Misawa ,  Ryo Iwai ,  Naoki Uchida ,  Koso Aoki ,  Kazuya Fujita ,  Kaori Kinoshita ,  Kazushi Takama ,  Eiichi Kurita

发明人： Shinji Uemoto ,  Hiromitsu Misawa ,  Ryo Iwai ,  Naoki Uchida ,  Koso Aoki ,  Kazuya Fujita ,  Kaori Kinoshita ,  Kazushi Takama ,  Eiichi Kurita

IPC分类号： G03G9/083 ,  G03G9/107 ,  G03G9/113

CPC分类号： G03G9/107 ,  G03G9/113 ,  G03G9/1135 ,  G03G9/1136

摘要： Black magnetic iron oxide particles having an average particle diameter of 0.05 to 2.0 μm and an electric resistance value at an applied voltage of 100 V of not less than 1×108 Ω·cm. Also a magnetic carrier for electrophotographic developer having spherical magnetic composite particles obtained by dispersing black magnetic iron oxide particles in a binder resin. The magnetic carrier has an electric resistance value R100 at an applied voltage of 100 V of 1×108 to 1×1014 Ω·cm, and an electric resistance value R300 at an applied voltage of 300 V which satisfies the relationship represented by the formula: 0.1≦R300/R100≦1.

摘要翻译： 平均粒径为0.05〜2.0μm，施加电压为100V的电阻值为1×10 8Ω·cm·cm以上的黑色磁性氧化铁粒子。 还有一种用于电子照相显影剂的磁性载体，其具有通过将黑色磁性氧化铁颗粒分散在粘合剂树脂中而获得的球形磁性复合颗粒。 磁载体在100V的施加电压为1×108〜1×1014＆OHgr·cm时具有电阻值R100，在300V的施加电压下的电阻值R300满足式 ：0.1＆nlE; R300 / R100＆nlE; 1。

公开(公告)号：US08393282B2

公开(公告)日：2013-03-12

申请号：US12812307

申请日：2008-12-25

申请人： Kazuya Fujita ,  Kenji Akizuki ,  Takashi Daikyoji

发明人： Kazuya Fujita ,  Kenji Akizuki ,  Takashi Daikyoji

IPC分类号： D05B93/00 ,  H02H1/04

CPC分类号： D03D15/00 ,  A41D31/0066 ,  D03D1/0041 ,  D03D15/0027 ,  D03D15/0083 ,  D10B2101/12 ,  D10B2101/20 ,  D10B2201/02 ,  D10B2201/24 ,  D10B2331/02 ,  D10B2331/04 ,  D10B2401/022 ,  D10B2401/16 ,  D10B2501/00

摘要： A sewn product comprises fabrics having conductive yarns inserted each in a warp direction and a weft direction and disposed in a lattice at intervals, wherein at least two stitches in at least one place of seam are provided with a stitch interval of not more than 5 mm, and a surface resistance (R) between two points separated by 30 cm across at least one seam is according to the formula: R≦1.0×1012Ω. A sewn product comprises fabrics having conductive yarns inserted each in a warp direction and a weft direction and disposed in a lattice at intervals, wherein in at least one place of seam a number of piles of clothing fabrics of seam allowance is 5 or more, and a surface resistance (R) between two points separated by 30 cm across at least one seam is R≦1.0×1012Ω.

摘要翻译： 缝制产品包括具有沿经向和纬向方向插入的导电纱线的织物，并以格子间隔布置，其中在至少一个接缝位置中至少有两个针脚具有不大于5mm的缝合间距 ，并且通过至少一个接缝分开30cm的两个点之间的表面电阻（R）根据下式：R＆lt; lE; 1.0×1012＆OHgr。 一种缝制品包括具有沿经向和纬向方向插入的导电纱线的织物，并以格子间隔布置，其中在至少一个接缝位置，多个缝合缝合物的织物的缝合为5个以上，以及 在至少一个接缝之间分开30cm的两个点之间的表面电阻（R）为R＆lt; 1; 1.0×10 12＆OHgr。

公开(公告)号：US20100287679A1

公开(公告)日：2010-11-18

申请号：US12812307

申请日：2008-12-25

申请人： Kazuya Fujita ,  Kenji Akizuki ,  Takashi Daikyoji

发明人： Kazuya Fujita ,  Kenji Akizuki ,  Takashi Daikyoji

IPC分类号： A41D1/00

CPC分类号： D03D15/00 ,  A41D31/0066 ,  D03D1/0041 ,  D03D15/0027 ,  D03D15/0083 ,  D10B2101/12 ,  D10B2101/20 ,  D10B2201/02 ,  D10B2201/24 ,  D10B2331/02 ,  D10B2331/04 ,  D10B2401/022 ,  D10B2401/16 ,  D10B2501/00

摘要： A sewn product comprises fabrics having conductive yarns inserted each in a warp direction and a weft direction and disposed in a lattice at intervals, wherein at least two stitches in at least one place of seam are provided with a stitch interval of not more than 5 mm, and a surface resistance (R) between two points separated by 30 cm across at least one seam is according to the formula: R≦1.0×1012Ω. A sewn product comprises fabrics having conductive yarns inserted each in a warp direction and a weft direction and disposed in a lattice at intervals, wherein in at least one place of seam a number of piles of clothing fabrics of seam allowance is 5 or more, and a surface resistance (R) between two points separated by 30 cm across at least one seam is R≦1.0×1012Ω.

摘要翻译： 缝制产品包括具有沿经向和纬向方向插入的导电纱线的织物，并以格子间隔布置，其中在至少一个接缝位置中至少有两个针脚具有不大于5mm的缝合间距 ，并且通过至少一个接缝分开30cm的两个点之间的表面电阻（R）根据下式：R＆lt; lE; 1.0×1012＆OHgr。 一种缝制品包括具有沿经向和纬向方向插入的导电纱线的织物，并以格子间隔布置，其中在至少一个接缝位置，多个缝合缝合物的织物的缝合为5个以上，以及 在至少一个接缝之间分开30cm的两个点之间的表面电阻（R）为R＆lt; 1; 1.0×10 12＆OHgr。

公开(公告)号：US20090295983A1

公开(公告)日：2009-12-03

申请号：US12454813

申请日：2009-05-22

申请人： Yoshihiro Sekimoto ,  Kazuya Fujita ,  Kiyoharu Shimano ,  Kenji Sakai

发明人： Yoshihiro Sekimoto ,  Kazuya Fujita ,  Kiyoharu Shimano ,  Kenji Sakai

IPC分类号： H04N5/235

CPC分类号： H04N5/2254 ,  H04N5/2257

摘要： In a camera module 1 of the present invention, a mechanical shutter 2 is provided above a top surface of a lens unit 3, and a protrusion section formed to an end of a lens 31 is held in a depression section formed on a back surface of the mechanical shutter 2. With the arrangement, it is possible to cause the camera module 1 employing the mechanical shutter 2 to be smaller and thinner at the same time.

摘要翻译： 在本发明的照相机模块1中，在透镜单元3的上表面的上方设置有机械挡板2，并且形成在透镜31的端部的突出部保持在形成在透镜单元3的背面的凹部 机械快门2.通过这种布置，可以使采用机械快门2的相机模块1同时变薄和变薄。

公开(公告)号：US07221849B2

公开(公告)日：2007-05-22

申请号：US10158394

申请日：2002-05-31

申请人： Tatsuji Kusumoto ,  Hideo Kataoka ,  Kazuya Fujita

发明人： Tatsuji Kusumoto ,  Hideo Kataoka ,  Kazuya Fujita

IPC分类号： H04N5/76

CPC分类号： G11B27/034 ,  G11B2220/216 ,  G11B2220/2562 ,  G11B2220/455 ,  H04N5/782 ,  H04N5/85 ,  H04N5/907

摘要： Input programming data items are recorded into a memory contained in an apparatus. That one of the programming data items recorded in the memory, which is requested to be recorded in a recording medium, is read from the memory, transferred to the recording medium and recorded thereon. Programming data for usual record programming and for record programming using a specified recording medium can be managed in a centralized manner by referring to the programming data items recorded in the memory.

摘要翻译： 输入编程数据项被记录在装置中包含的存储器中。 记录在存储器中的要求记录在记录介质中的编程数据项之一被从存储器中读出，传送到记录介质并记录在其上。 可以通过参照记录在存储器中的编程数据项以集中的方式来管理用于常规记录编程和用于使用指定记录介质的记录编程的编程数据。