Camera module and electronic device including the same
    1.
    发明授权
    Camera module and electronic device including the same 有权
    相机模块和电子设备包括相同

    公开(公告)号:US08174609B2

    公开(公告)日:2012-05-08

    申请号:US12454813

    申请日:2009-05-22

    IPC分类号: H04N5/235 H04N5/225 G03B7/00

    CPC分类号: H04N5/2254 H04N5/2257

    摘要: In a camera module 1 of the present invention, a mechanical shutter 2 is provided above a top surface of a lens unit 3, and a protrusion section formed to an end of a lens 31 is held in a depression section formed on a back surface of the mechanical shutter 2. With the arrangement, it is possible to cause the camera module 1 employing the mechanical shutter 2 to be smaller and thinner at the same time.

    摘要翻译: 在本发明的照相机模块1中,在透镜单元3的上表面的上方设置有机械挡板2,并且形成在透镜31的端部的突出部保持在形成在透镜单元3的背面的凹部 机械快门2.通过这种布置,可以使采用机械快门2的相机模块1同时变薄和变薄。

    Camera module and electronic device including the same
    2.
    发明申请
    Camera module and electronic device including the same 有权
    相机模块和电子设备包括相同

    公开(公告)号:US20090295983A1

    公开(公告)日:2009-12-03

    申请号:US12454813

    申请日:2009-05-22

    IPC分类号: H04N5/235

    CPC分类号: H04N5/2254 H04N5/2257

    摘要: In a camera module 1 of the present invention, a mechanical shutter 2 is provided above a top surface of a lens unit 3, and a protrusion section formed to an end of a lens 31 is held in a depression section formed on a back surface of the mechanical shutter 2. With the arrangement, it is possible to cause the camera module 1 employing the mechanical shutter 2 to be smaller and thinner at the same time.

    摘要翻译: 在本发明的照相机模块1中,在透镜单元3的上表面的上方设置有机械挡板2,并且形成在透镜31的端部的突出部保持在形成在透镜单元3的背面的凹部 机械快门2.通过这种布置,可以使采用机械快门2的相机模块1同时变薄和变薄。

    CAMERA MODULE MANUFACTURING METHOD, CAMERA MODULE, AND ELECTRONIC APPARATUS
    3.
    发明申请
    CAMERA MODULE MANUFACTURING METHOD, CAMERA MODULE, AND ELECTRONIC APPARATUS 有权
    相机模块制造方法,相机模块和电子设备

    公开(公告)号:US20130314810A1

    公开(公告)日:2013-11-28

    申请号:US13983876

    申请日:2012-01-20

    IPC分类号: G02B7/09

    摘要: A camera module (40) of the present invention includes: an optical section (1) having an image pickup lens (2) and a lens barrel (3); and a lens driving device (10) including a lens holder (11). The optical section (1) and the lens driving device (10) are provided on an upper side of a sensor cover (23) covering an image pickup element (22) of an image pickup section (20). The lens barrel (3) is positioned at such a location that the lens barrel (3) does not make contact with the sensor cover (23), so that the lens barrel (3) is fixed to the lens holder (11) at the location. Before being fixed to the lens holder (11), the lens barrel (3) is slidable in the optical axis direction with respect to the lens holder (11).

    摘要翻译: 本发明的照相机模块(40)包括:具有图像拾取透镜(2)和透镜镜筒(3)的光学部分(1); 以及包括透镜保持器(11)的透镜驱动装置(10)。 光学部分(1)和透镜驱动装置(10)设置在覆盖图像拾取部分(20)的图像拾取元件(22)的传感器盖(23)的上侧。 透镜镜筒(3)位于透镜镜筒(3)不与传感器盖(23)接触的位置处,使透镜镜筒(3)固定在镜片保持器(11)上, 位置。 在固定到透镜架(11)之前,镜筒(3)可相对于透镜保持件(11)在光轴方向上滑动。

    Camera module manufacturing method, camera module, and electronic apparatus
    4.
    发明授权
    Camera module manufacturing method, camera module, and electronic apparatus 有权
    相机模块制造方法,相机模块和电子设备

    公开(公告)号:US09568705B2

    公开(公告)日:2017-02-14

    申请号:US13983876

    申请日:2012-01-20

    摘要: A camera module (40) of the present invention includes: an optical section (1) having an image pickup lens (2) and a lens barrel (3); and a lens driving device (10) including a lens holder (11). The optical section (1) and the lens driving device (10) are provided on an upper side of a sensor cover (23) covering an image pickup element (22) of an image pickup section (20). The lens barrel (3) is positioned at such a location that the lens barrel (3) does not make contact with the sensor cover (23), so that the lens barrel (3) is fixed to the lens holder (11) at the location. Before being fixed to the lens holder (11), the lens barrel (3) is slidable in the optical axis direction with respect to the lens holder (11).

    摘要翻译: 本发明的照相机模块(40)包括:具有图像拾取透镜(2)和透镜镜筒(3)的光学部分(1); 以及包括透镜保持器(11)的透镜驱动装置(10)。 光学部分(1)和透镜驱动装置(10)设置在覆盖图像拾取部分(20)的图像拾取元件(22)的传感器盖(23)的上侧。 透镜镜筒(3)位于透镜镜筒(3)不与传感器盖(23)接触的位置处,使透镜镜筒(3)固定在镜片保持器(11)上, 位置。 在固定到透镜架(11)之前,镜筒(3)可相对于透镜保持件(11)在光轴方向上滑动。

    Vehicle component and sealing member
    6.
    发明授权
    Vehicle component and sealing member 有权
    车辆部件和密封件

    公开(公告)号:US08720908B2

    公开(公告)日:2014-05-13

    申请号:US11727007

    申请日:2007-03-23

    IPC分类号: F16J15/02

    摘要: A vehicle component includes a sealing member that is sandwiched between the vehicle component and a vehicle body to seal a gap between the vehicle component and the vehicle body. The sealing member includes an adhering/separating member that is adhereable to and separable from a wall of the vehicle body, and an elastic compressing member that is elastically compressible and stacked on the adhering/separating member. The adhering/separating member adheres to the wall of the vehicle body when the sealing member is present between the vehicle component and the vehicle body.

    摘要翻译: 车辆部件包括夹在车辆部件和车体之间的密封部件,以密封车辆部件与车身之间的间隙。 密封构件包括粘附/分离构件,其粘附到车体的壁上并可与其分离;以及弹性压缩构件,其弹性压缩并堆叠在粘合/分离构件上。 当密封构件存在于车辆部件和车身之间时,粘附/分离部件粘附到车体的壁上。

    Semiconductor device and optical device module having the same
    8.
    发明申请
    Semiconductor device and optical device module having the same 有权
    半导体器件和具有其的光学器件模块

    公开(公告)号:US20080296715A1

    公开(公告)日:2008-12-04

    申请号:US12156192

    申请日:2008-05-30

    IPC分类号: H01L31/00

    摘要: In a solid-state imaging device 1 in which a hollow section 9 is formed between a solid-state imaging element 2 and a covering section 4 and an air path 7 extending from the hollow section 9 to the outside is formed in an adhesive section 5, a shielding section 11 for shielding the air path 7 is formed on the air path 7 so as to be positioned on a portion exposed from the covering section 4. This makes it possible to reduce noises occurring in a signal processing section of a semiconductor element while preventing condensation in the covering section for covering the semiconductor element.

    摘要翻译: 在固体成像装置1中,在固态成像元件2和覆盖部分4之间形成中空部分9,并且从中空部分9延伸到外部的空气通道7形成在粘合部分5中 在空气路径7上形成用于遮蔽空气通道7的屏蔽部分11,以便位于从覆盖部分4露出的部分上。这使得可以减少半导体元件的信号处理部分中产生的噪声 同时防止用于覆盖半导体元件的覆盖部分中的冷凝。

    Vehicle component and sealing member
    9.
    发明申请
    Vehicle component and sealing member 有权
    车辆部件和密封件

    公开(公告)号:US20070228758A1

    公开(公告)日:2007-10-04

    申请号:US11727007

    申请日:2007-03-23

    IPC分类号: B62D27/00

    摘要: A vehicle component includes a sealing member that is sandwiched between the vehicle component and a vehicle body to seal a gap between the vehicle component and the vehicle body. The sealing member includes an adhering/separating member that is adhereable to and separable from a wall of the vehicle body, and an elastic compressing member that is elastically compressible and stacked on the adhering/separating member. The adhering/separating member adheres to the wall of the vehicle body when the sealing member is present between the vehicle component and the vehicle body.

    摘要翻译: 车辆部件包括夹在车辆部件和车体之间的密封部件,以密封车辆部件与车身之间的间隙。 密封构件包括粘附/分离构件,其粘附到车体的壁上并可与其分离;以及弹性压缩构件,其弹性压缩并堆叠在粘合/分离构件上。 当密封构件存在于车辆部件和车身之间时,粘附/分离部件粘附到车体的壁上。

    Semiconductor device, semiconductor module, and manufacturing method of semiconductor device
    10.
    发明申请
    Semiconductor device, semiconductor module, and manufacturing method of semiconductor device 审中-公开
    半导体器件,半导体模块和半导体器件的制造方法

    公开(公告)号:US20060043544A1

    公开(公告)日:2006-03-02

    申请号:US11217582

    申请日:2005-08-31

    IPC分类号: H01L23/495

    摘要: An imaging device as a semiconductor device includes a semiconductor substrate on which an imaging element is mounted, a light-transmitting lid section (covering section) arranged to face a light receiving section provided on one surface of the imaging element, and an adhesive layer arranged in an area excluding the light receiving section on the one surface of the imaging element for bonding between the semiconductor substrate and the lid section. The adhesive layer ranges from 10 g/(m2·24 h) to 200 g/(m2·24 h) in the water vapor permeability.

    摘要翻译: 作为半导体器件的成像器件包括其上安装有成像元件的半导体衬底,布置成面对设置在成像元件的一个表面上的光接收部分的透光盖部分(覆盖部分)和布置成 在除了用于在半导体衬底和盖部之间接合的成像元件的一个表面上的光接收部分的区域中。 粘合剂层的水蒸汽渗透性为10g /(m 2·2H 2·24h)至200g /(m 2·2H 2·24h)。