摘要:
A method of detecting deficiency of an aperture used in a charged-particle-beam exposure process employing at least two exposure columns is disclosed, where each of the two exposure columns passes a charged-particle beam through the aperture formed through a mask to shape a cross section of the charged-particle beam before exposing the charged-particle beam onto an object. The method includes the steps of mounting masks having the same aperture to the at least two exposure columns; scanning, in each of the at least two exposure columns, the charged-particle beam over an area containing a mark on a surface substantially at the same height as the object after passing the charged-particle beam through the same aperture; obtaining, in each of the at least two exposure columns, a signal waveform corresponding to the scan by detecting charged particles scattered by the mark; and comparing the signal waveform between the at least two exposure columns.
摘要:
An electron beam exposure system for writing a pattern on an object by an electron beam comprises a beam source for producing an electron beam, a beam focusing unit for focusing the electron beam on the object, a beam processing unit provided along an optical axis of the electron beam for modifying the electron beam in response to control signals, a column extending along the optical axis of the electron beam so as to surround a region that includes the object, the beam source, the beam focusing unit and the beam processing unit and for maintaining the region evacuated, and an interface element mounted on the column for supplying the control signals to said beam processing unit. The interface element comprises a ring-shaped base body of a ceramic material having first and second major surfaces, the first major surface establishing an hermetic seal to the column when the interface element is mounted thereon, one or more conductor patterns provided on the second major surface so as to extend radially from an inner circumference to an outer circumference, and an insulator film provided on the second major surface of the base body so as to bury the conductor patterns underneath. The insulator film has a substantially flat major surface and establishes an hermetic seal with the column when the interface element is mounted thereon.
摘要:
A mask is used for exposing a desired pattern on a substrate by a charged particle beam exposure. The mask comprises a plurality of pattern groups each including a plurality of exposure patterns within an approximately rectangular region, and a plurality of position matching patterns formed at positions different from those of the exposure pattern groups, where positional relationships of each of the exposure pattern groups and the position matching patterns are predetermined and fixed.
摘要:
A charged particle beam exposure method includes the steps of (a) selectively irradiating a charged particle beam on at least one selected opening forming a selected pattern of a mask which includes a plurality of openings related to a plurality of kinds of patterns so as to shape a cross section of the charged particle beam which is transmitted through the selected opening, where the area of the mask is divided into a plurality of blocks each including at least one opening which is related to one pattern, and (b) irradiating the charged particle beam which is transmitted through the selected opening of the mask onto an object surface so as to expose a desired pattern corresponding to at least a part of the pattern of the selected opening on the object surface, where the step (a) carries out first and second deflections independently of each other with respect to the charged particle beam. The first deflection deflects the charged particle beam within a first deflection range which corresponds to the size of one block and the second deflection deflects the charged particle beam within a second irradiating range which covers a plurality of blocks of the mask, so that the second deflection deflects the charged particle beam to irradiate the selected opening out of the plurality of openings of the mask and the first deflection sets the first deflection range of the charged particle beam with respect to the selected opening.
摘要:
An electron beam exposure device comprises an electron gun, a mask plate provided with a plurality of apertures defining corresponding patterns, each pattern having a specific shape for forming a corresponding cross-sectional shape of an electron beam composed of charged particles incident thereon and passing therethrough, deflecting means provided both on a first side of a mask plate onto which the beam is irradiated and on a second side thereof from which the beam is emitted, for deflecting the beam from an original axis thereof so as to pass through a selected one of the apertures provided on the mask plate, and for deflecting again said beam so as to return said beam to the original axis thereof, sample holding means, focus point adjusting means provided between the mask plate and the sample holding means, and control means for controlling the focus point adjusting means. The focus point adjusting means further comprises processing means for processing focus point adjusting condition data for each specific aperture pattern utilizing a specific relationship between the cross-sectional area of the aperture of each pattern and a specific focus point adjusting value for each pattern, and supplying means for supplying information of said focus point adjusting condition data thus obtained to the focus point adjusting means.
摘要:
Disclosed is a method of producing a block mask, which is employed in an electron-beam lithography apparatus, with high precision irrespective of the size of openings. The electron-beam lithography apparatus is of a type that produces a unit pattern at a time by transmitting an electron beam through openings selected from among a plurality of kinds of openings of a block mask, links the unit pattern with a previous one, and repeats this process to delineate a desired pattern. The method consists of four steps. At the first step, a resist is applied to the surface of a substrate of a block mask. At the next step, the resist is exposed to delineate patterns of a plurality of kinds of openings. At the next step, the exposed resist is developed. At the next step, the substrate of the block mask is etched. Herein, at the step of exposing the resist to delineate the patterns of a plurality of kinds of openings, for exposing the resist to delineate a pattern of openings that are larger than a predetermined size, the perimeters of corresponding opening portions of the resist are exposed by a predetermined width. However, the insides of the corresponding opening portions remain unexposed. Once etching is completed, the perimeter of each large opening portion becomes a penetrating hole. The inside thereof is detached from the substrate of the block mask. A larger hole is thus realized. Consequently, even when the etching is carried out under the same conditions for etching performed to create small openings, large openings can be created with high precision.
摘要:
A transparent mask plate used in a charged particle beam exposure apparatus includes a base plate, an exposure pattern area, and a calibration area. The exposure pattern area is formed in the base plate and has a plurality of transparent patterns for shaping a cross section of a charged particle beam into a block pattern. The calibration area is formed in the base plate, and has a plurality of transparent patterns used for obtaining a condition for deflecting the charged particle beam. The plurality of transparent patterns formed in the calibration area are arranged at the same pitch as the plurality of transparent patterns formed in the exposure pattern area. Each of the plurality of transparent patterns formed in the calibration area corresponds to one of the plurality of transparent patterns formed in the exposure pattern area.
摘要:
A charged particle beam exposure method exposes a desired exposure pattern on a substrate by a charged particle beam of a beam source and a deflection system for deflecting the charged particle beam transmitted through a mask. The method includes providing the mask having formed therein a plurality of exposure patterns and a plurality of position matching patterns, where each of the position matching patterns has a predetermined, fixed positional relationship to at least an adjacent exposure pattern in the mask, in a first step, exposing a first one of the plurality of position matching patterns in the mask at a predetermined position on the substrate by directing the charged particle beam through the selected position matching pattern in the mask and onto the predetermined position on the substrate, in a second step, detecting the irradiating position of the charged particle beam on the substrate, as directed through the first position matching pattern, in a third step, calculating an error between the predetermined position on the substrate and the irradiating position of the charged particle beam which is irradiated on the substrate through the first position matching pattern, in a fourth step, determining a correction amount for the desired exposure pattern which is adjacent to the first position matching pattern in the mask based on the calculated error, and in a fifth step, controlling the deflection system based on the correction amount so that the calculated error becomes approximately zero.
摘要:
A method of exposing a pattern on a substrate by a charged particle beam includes the steps of energizing first and second mask deflectors provided at an upstream side of a stencil mask simultaneously to obtain a first relativistic relationship of energization between the first and second mask deflectors, energizing the first mask deflector and simultaneously the second mask deflector according to the first relativistic relationship so as to hit a selected aperture on the stencil mask, to obtain an absolute deflection of the charged particle beam as a function of the energization of the first mask deflector, energizing third and fourth mask deflectors provided at a downstream side of the stencil mask simultaneously to obtain a second relativistic relationship of energization between the third and fourth mask deflectors, and energizing the first through fourth mask deflectors according to the first and second relativistic relationship and further to the absolute relationship, such that the charged particle beam is deflected away from an optical axis and hit a selected aperture on the stencil mask while traveling parallel to the optical axis, and such that the charged particle beam passed through the stencil mask is deflected toward the optical axis and deflected again such that the charged particle beam travels toward the substrate in alignment with the optical axis.
摘要:
An electron beam exposure system having an electromagnetic lens for forming an electron beam into an arbitrary image and for condensing and projecting the image on a sample, and a plurality of saddle type electromagnetic deflectors for deflecting and scanning the electron beam on the sample, wherein at least one of the plurality of saddle type electromagnetic deflectors has a half angle of arc of more than 60 degrees and positions in a vicinity of a smooth connecting line which links four points plotted on a graph having coordinates of the half angle of arc of 60 degrees to no less than a radius of curvature of 30 millimeters, approximately 61.5 degrees to 14 millimeters, approximately 64 degrees to 9 millimeters, and approximately 66 degrees to 7 millimeters. Thus, the electron beam exposure system having the saddle type electromagnetic deflector and which is small and has low aberration is realized.