公开(公告)号：US20190198961A1

公开(公告)日：2019-06-27

申请号：US16329587

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/16 ,  H01Q9/04 ,  H01P11/00

CPC classification number: H01P3/16 ,  H01P3/122 ,  H01P11/002 ,  H01P11/006 ,  H01Q9/045 ,  H04L67/10

Abstract: A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.

公开(公告)号：US10251272B2

公开(公告)日：2019-04-02

申请号：US15639873

申请日：2017-06-30

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Feras Eid ,  Thomas L. Sounart ,  Georgios C. Dogiamis ,  Johanna M. Swan

IPC: H05K1/16 ,  H05K3/46 ,  H01L23/498 ,  H01L21/48 ,  H05K3/12 ,  H05K3/00 ,  H05K3/22

Abstract: Embodiments of the invention include a microelectronic device that includes a plurality of organic dielectric layers and a capacitor that is integrated with a first organic dielectric layer of the plurality of organic dielectric layers. The capacitor includes first and second conductive electrodes and an ultra-high-k dielectric layer that is positioned between the first and second conductive electrodes.

公开(公告)号：US10211970B2

公开(公告)日：2019-02-19

申请号：US15475827

申请日：2017-03-31

Applicant: INTEL CORPORATION

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Sasha N. Oster

IPC: H04B10/00 ,  H04L7/00 ,  H04L7/033 ,  H04B10/61 ,  H04B10/548

Abstract: The present disclosure is directed to systems and methods for communicating between rack mounted devices disposed in the same or different racks separated by distances of less than a meter to a few tens of meters. The system includes a CMOS first mm-wave engine that includes mm-wave transceiver circuitry, mm-wave MODEM circuitry, power distribution and control circuitry, and a mm-wave waveguide connector. The CMOS first mm-wave engine communicably couples to a CMOS second mm-wave engine that also includes mm-wave transceiver circuitry, mm-wave MODEM circuitry, power distribution and control circuitry, and a mm-wave waveguide connector. In some implementations, at least a portion of the mm-wave transceiver circuitry may be fabricated using III-V semiconductor manufacturing methods. The use of mm-wave communication techniques beneficially improves data integrity and increases achievable datarates, and reduces power costs.

公开(公告)号：US20180191049A1

公开(公告)日：2018-07-05

申请号：US15394990

申请日：2016-12-30

Applicant: INTEL CORPORATION

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Sasha N. Oster

IPC: H01P3/16 ,  H01P3/127 ,  H04B1/40

Abstract: Radio frequency (RF) data transfer between components in rack mounted systems is facilitated through the use of dielectric waveguides and millimeter Wave (mm-Wave) transceivers. A signal generator provides one or more data signals to a serializer/deserializer (SERDES) which serializes a plurality of parallel data signals to produce a single, serialized, signal containing data from each of the input signals to the SERDES. A mm-Wave die upconverts the serialized signal to a mm-Wave signal and a mm-Wave launcher launches the signal into the dielectric waveguide. At the receiving end the process is reversed such that the mm-Wave signal is first downconverted and passed through a SERDES to provide the original one or more signals to a recipient signal generator. Some or all of the components may be formed directly in the semiconductor package.

公开(公告)号：US09647636B1

公开(公告)日：2017-05-09

申请号：US15088825

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Telesphor Kamgaing ,  Feras Eid ,  Vijay K. Nair ,  Georgios C. Dogiamis ,  Johanna M. Swan ,  Valluri R. Rao

IPC: G06K19/06 ,  H03H9/30 ,  H03H9/205 ,  H03H9/17 ,  G06K7/10

CPC classification number: G06K7/10297 ,  G06K7/10316 ,  G06K19/0672 ,  G06K19/0675 ,  H03H9/30

Abstract: Embodiments of the invention include delay line circuitry that is integrated with an organic substrate. Organic dielectric material and a plurality of conductive layers form the organic substrate. The delay line circuitry includes a piezoelectric transducer to receive a guided electromagnetic wave signal and to generate an acoustic wave signal to be transmitted with an acoustic transmission medium. An acoustic reflector is communicatively coupled to the acoustic transmission medium. The acoustic reflector receives a plurality of acoustic wave signals from the acoustic transmission medium and reflects acoustic wave signals to the piezoelectric transducer using the acoustic transmission medium. The transducer converts the reflected acoustic signals into electromagnetic waves which are then transmitted back through the antenna and decoded by the reader.

公开(公告)号：US20250112216A1

公开(公告)日：2025-04-03

申请号：US18478937

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Qiang Yu ,  Georgios C. Dogiamis ,  Said Rami ,  Adel Elsherbini

IPC: H01L25/18 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L23/538 ,  H01L25/00

Abstract: Methods of selectively transferring integrated circuit (IC) components between substrates, and devices and systems formed using the same, are disclosed herein. In one embodiment, a first substrate with a release layer and a layer of IC components over the release layer is received, and a second substrate with one or more adhesive areas is received. The layer of IC components may include one or more thick gate oxide transistors, group III-V transistors, varactors, or electrostatic discharge protection devices. The first substrate is partially bonded to the second substrate, such that a subset of IC components on the first substrate are bonded to the adhesive areas on the second substrate. The first substrate is then separated from the second substrate, and the subset of IC components bonded to the second substrate are separated from the first substrate and remain on the second substrate.

公开(公告)号：US11430751B2

公开(公告)日：2022-08-30

申请号：US16465132

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Sasha N. Oster

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01L25/16 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/52

Abstract: Embodiments of the invention include a microelectronic device that includes a first ultra thin substrate formed of organic dielectric material and conductive layers, a first mold material to integrate first radio frequency (RF) components with the first substrate, and a second ultra thin substrate being coupled to the first ultra thin substrate. The second ultra thin substrate formed of organic dielectric material and conductive layers. A second mold material integrates second radio frequency (RF) components with the second substrate.

公开(公告)号：US11387200B2

公开(公告)日：2022-07-12

申请号：US16827296

申请日：2020-03-23

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Javier A. Falcon ,  Yoshihiro Tomita ,  Vijay K. Nair

IPC: H01L23/66 ,  H01L23/00 ,  H01L25/18 ,  H01L25/065

Abstract: Embodiments of the invention include a microelectronic device that includes a first die formed with a silicon based substrate and a second die coupled to the first die. The second die is formed with compound semiconductor materials in a different substrate (e.g., compound semiconductor substrate, group III-V substrate). An antenna unit is coupled to the second die. The antenna unit transmits and receives communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20210376437A1

公开(公告)日：2021-12-02

申请号：US17403571

申请日：2021-08-16

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/16 ,  H01P11/00 ,  H01P3/12 ,  H01Q9/04

Abstract: A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.

公开(公告)号：US11095012B2

公开(公告)日：2021-08-17

申请号：US16329587

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/16 ,  H01P11/00 ,  H01P3/12 ,  H01Q9/04 ,  H04L29/08

Abstract: A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.