公开(公告)号：US09721880B2

公开(公告)日：2017-08-01

申请号：US14969940

申请日：2015-12-15

Applicant: Intel Corporation

Inventor： Jimin Yao ,  Sanka Ganesan ,  Shawna M. Liff ,  Yikang Deng ,  Debendra Mallik

IPC: H01L23/12 ,  H01L21/00 ,  H05K7/10 ,  H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H05K1/18 ,  H05K1/03 ,  H05K3/34 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L23/3114 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/14135 ,  H01L2224/16237 ,  H01L2224/16503 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8101 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/15321 ,  H01L2924/3511 ,  H05K1/03 ,  H05K1/18 ,  H05K1/181 ,  H05K3/34 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/1053 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028

Abstract: Integrated circuit (IC) package structures, and related devices and methods, are disclosed herein. In some embodiments, an IC package substrate may include: a dielectric layer having a first face and a second face; a metal layer disposed at the first face of the dielectric layer and having a first face and a second face, wherein the second face of the metal layer is disposed between the first face of the metal layer and the second face of the dielectric layer; a package contact at the first face of the metal layer to couple the IC package substrate to a component; and a die contact at the first face of the metal layer to couple a die to the IC package substrate.