公开(公告)号：US10921349B2

公开(公告)日：2021-02-16

申请号：US16096968

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Jelena Culic-Viskota ,  Thomas L. Sounart ,  Feras Eid ,  Sasha N. Oster

IPC: G01R15/20 ,  H01L41/06 ,  G01R15/14 ,  H01L41/113 ,  G01R15/24 ,  H01L41/12

Abstract: Embodiments of the invention include a current sensing device for sensing current in an organic substrate. The current sensing device includes a released base structure that is positioned in proximity to a cavity of the organic substrate and a piezoelectric film stack that is positioned in proximity to the released base structure. The piezoelectric film stack includes a piezoelectric material in contact with first and second electrodes. A magnetic field is applied to the current sensing device and this causes movement of the released base structure and the piezoelectric stack which induces a voltage (potential difference) between the first and second electrodes.

公开(公告)号：US10594029B2

公开(公告)日：2020-03-17

申请号：US15283140

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Shawna M. Liff ,  Adel A. Elsherbini ,  Sasha N. Oster ,  Feras Eid ,  Georgios C. Dogiamis ,  Thomas L. Sounart ,  Johanna M. Swan

IPC: H01Q1/52 ,  H01L41/09 ,  H01L41/047 ,  H04L29/06 ,  H01Q1/27 ,  H04W12/12 ,  H04L29/08 ,  H01Q15/00 ,  H04W12/00

Abstract: Embodiments of the invention include a reconfigurable communication system, that includes a substrate and a metamaterial shield formed over the substrate. In an embodiment, the metamaterial shield surrounds one or more components on the substrate. Additionally, a plurality of first piezoelectric actuators may be formed on the substrate. The first piezoelectric actuators may be configured to deform the metamaterial shield and change a frequency band that is permitted to pass through the metamaterial shield. Embodiments may also include a reconfigurable antenna that includes a metamaterial. In an embodiment, a plurality of second piezoelectric actuators may be configured to deform the metamaterial of the antenna and change a central operating frequency of the antenna. Embodiments may also include an integrated circuit electrically coupled to the plurality of first piezoelectric actuators and second piezoelectric actuators.

公开(公告)号：US10566672B2

公开(公告)日：2020-02-18

申请号：US15277504

申请日：2016-09-27

Applicant: INTEL CORPORATION

Inventor： Adel A. Elsherbini ,  Sasha N. Oster ,  Johanna M. Swan ,  Georgios C. Dogiamis ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Telesphor Kamgaing

IPC: H01P5/10 ,  H01Q13/08

Abstract: The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide connector. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a planar first member and a planar second member that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide connector.

公开(公告)号：US20200004290A1

公开(公告)日：2020-01-02

申请号：US16567479

申请日：2019-09-11

Applicant: Intel Corporation

Inventor： Nadine L. Dabby ,  Sasha N. Oster ,  Aleksandar Aleksov ,  Braxton Lathrop ,  Racquel L. Fygenson

IPC: G06F1/16

Abstract: Systems and methods describe herein provide a solution to the technical problem of creating a wearable electronic devices. In particular, these systems and methods enable electrical and mechanical attachment of stretchable or flexible electronics to fabric. A stretchable or flexible electronic platform is bonded to fabric using a double-sided fabric adhesive, and conductive adhesive is used to join pads on the electronic platform to corresponding electrical leads on the fabric. An additional waterproofing material may be used over and beneath the electronic platform to provide a water-resistant or waterproof device This stretchable or flexible electronic platform integration process allows the platform to bend and move with the fabric while protecting the conductive connections. By using flexible and stretchable conductive leads and adhesives, the platform is more flexible and stretchable than traditional rigid electronics enclosures.

公开(公告)号：US10452571B2

公开(公告)日：2019-10-22

申请号：US15746318

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Sasha N. Oster ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Georgios C. Dogiamis ,  Brandon M. Rawlings

IPC: G06F13/14 ,  G06F13/00 ,  H04M9/06 ,  G06F3/14

Abstract: Microelectronic package communications are described that use radio interfaces that are connected through waveguides. One example includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, and a radio on the package substrate coupled to the radio chip to modulate the data over a carrier and to transmit the modulated data. A waveguide connector is coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide carries the modulated data to an external component.

公开(公告)号：US20190198965A1

公开(公告)日：2019-06-27

申请号：US16325522

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Brandon M. Rawlings ,  Aleksandar Aleksov ,  Shawna M. Liff ,  Richard J. Dischler ,  Johanna M. Swan

IPC: H01P11/00 ,  H01P3/12

CPC classification number: H01P11/002 ,  H01P3/122

Abstract: An apparatus comprises a waveguide section including an outer layer of conductive material tubular in shape and having multiple ends; and a joining feature on at least one of the ends of the waveguide section configured for joining to a second separate waveguide section.

公开(公告)号：US20190173149A1

公开(公告)日：2019-06-06

申请号：US16325301

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/12 ,  H01P11/00 ,  H01P3/127 ,  H01P3/16

Abstract: An apparatus comprises a waveguide including: an elongate waveguide core including a dielectric material, wherein the waveguide core includes at least one space arranged lengthwise along the waveguide core that is void of the dielectric material; and a conductive layer arranged around the waveguide core.

公开(公告)号：US10263312B2

公开(公告)日：2019-04-16

申请号：US15282050

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Sasha N. Oster ,  Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/12 ,  H01P3/16 ,  H01P11/00 ,  H01P3/14

Abstract: A method of making a waveguide ribbon that includes a plurality of waveguides comprises joining a first sheet of dielectric material to a first conductive sheet of conductive material, patterning the first sheet of dielectric material to form a plurality of dielectric waveguide cores on the first conductive sheet, and coating the dielectric waveguide cores with substantially the same conductive material as the conductive sheet to form the plurality of waveguides.

公开(公告)号：US10179729B2

公开(公告)日：2019-01-15

申请号：US15005826

申请日：2016-01-25

Applicant: INTEL CORPORATION

Inventor： Sarah K. Haney ,  Weng Hong Teh ,  Feras Eid ,  Sasha N. Oster

IPC: B81B7/00 ,  B81C1/00

Abstract: Embodiments of the invention describe hermetic encapsulation for MEMS devices, and processes to create the hermetic encapsulation structure. Embodiments comprise a MEMS substrate stack that further includes a magnet, a first laminate organic dielectric film, a first hermetic coating disposed over the magnet, a second laminate organic dielectric film disposed on the hermetic coating, a MEMS device layer disposed over the magnet, and a plurality of metal interconnects surrounding the MEMS device layer. A hermetic plate is subsequently bonded to the MEMS substrate stack and disposed over the formed MEMS device layer to at least partially form a hermetically encapsulated cavity surrounding the MEMS device layer. In various embodiments, the hermetically encapsulated cavity is further formed from the first hermetic coating, and at least one of the set of metal interconnects, or a second hermetic coating deposited onto the set of metal interconnects.

公开(公告)号：US20180183561A1

公开(公告)日：2018-06-28

申请号：US15388204

申请日：2016-12-22

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Emanuel Cohen ,  Sasha N. Oster

IPC: H04L5/14 ,  H04W72/04 ,  H04B1/44

CPC classification number: H04L5/14 ,  H04B1/44

Abstract: Embodiments of the present disclosure may relate to a transceiver to transmit and receive concurrently radio frequency (RF) signals via a dielectric waveguide. In embodiments, the transceiver may include a transmitter to transmit to a paired transceiver a channelized radio frequency (RF) transmit signal via the dielectric waveguide. A receiver may receive from the paired transceiver a channelized RF receive signal via the dielectric waveguide. In embodiments, the channelized RF receive signal may include an echo of the channelized RF transmit signal. The transceiver may further include an echo suppression circuit to suppress from the channelized RF receive signal the echo of the channelized RF transmit signal. In some embodiments, the channelized RF transmit signal and the channelized RF receive signal may be within a frequency range of approximately 30 gigahertz (GHz) to approximately 1 terahertz (THz), and the transceiver may provide full-duplex millimeter-wave communication.