公开(公告)号：US11539081B2

公开(公告)日：2022-12-27

申请号：US16800327

申请日：2020-02-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Qianwen Chen ,  Bing Dang ,  John U. Knickerbocker

IPC: H01M10/0585 ,  H01M10/052 ,  H01M10/04 ,  A61B5/00

Abstract: A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.

公开(公告)号：US11411272B2

公开(公告)日：2022-08-09

申请号：US15811231

申请日：2017-11-13

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Bing Dang ,  John U. Knickerbocker ,  Yang Liu ,  Jae-Woong Nah ,  Adinath Narasgond ,  Bucknell C. Webb

IPC: H01M50/10 ,  H01M50/209 ,  H01M6/40 ,  H01M10/04

Abstract: A micro-battery is provided in which a metallic sealing layer is used to provide a hermetic seal between an anode side of the micro-battery and the cathode side of the micro-battery. In accordance with the present application, the metallic sealing layer is formed around a perimeter of each metallic anode structure located on the anode side and then the metallic sealing layer is bonded to a solderable metal layer of a wall structure present on the cathode side. The wall structure contains a cavity that exposes a metallic current collector structure, the cavity is filled with battery materials.

公开(公告)号：US11348833B2

公开(公告)日：2022-05-31

申请号：US16693526

申请日：2019-11-25

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Jeffrey D. Gelorme ,  John U. Knickerbocker

IPC: H01L23/48 ,  H01L21/56 ,  H01L23/538 ,  H01L21/48 ,  H01L25/065 ,  H01L21/78 ,  H01L23/31 ,  H01L23/29 ,  H01L23/00

Abstract: A support structure for use in fan-out wafer level packaging is provided that includes, a silicon handler wafer having a first surface and a second surface opposite the first surface, a release layer is located above the first surface of the silicon handler wafer, and a layer selected from the group consisting of an adhesive layer and a redistribution layer is located on a surface of the release layer. After building-up a fan-out wafer level package on the support structure, infrared radiation is employed to remove (via laser ablation) the release layer, and thus remove the silicon handler wafer from the fan-out wafer level package.

公开(公告)号：US11171374B2

公开(公告)日：2021-11-09

申请号：US15841720

申请日：2017-12-14

Applicant: International Business Machines Corporation

Inventor： Qianwen Chen ,  Bing Dang ,  John Knickerbocker ,  Bo Wen

IPC: H01M10/04 ,  H01M50/116 ,  H01M10/0525 ,  H01M10/0565 ,  H01M10/0562 ,  H01M6/40 ,  H01M6/18 ,  H01M50/10 ,  H01M50/20 ,  H01M50/183

Abstract: Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.

公开(公告)号：US11094407B2

公开(公告)日：2021-08-17

申请号：US16440032

申请日：2019-06-13

Applicant: International Business Machines Corporation

Inventor： John Knickerbocker ,  Li-Wen Hung ,  Bing Dang ,  Katsuyuki Sakuma ,  Jeffrey Donald Gelorme ,  Rajeev Narayanan ,  Qianwen Chen

IPC: G16H20/10 ,  A61B5/00 ,  A61J3/00 ,  G16H10/60 ,  G16H70/40 ,  A61B90/90 ,  A61B5/07

Abstract: A drug delivery form includes a drug and electronics. The electronics includes memory(ies) having drug delivery form information, including information about the drug and about at least part of a supply chain from manufacture of the drug delivery form to a current location in the supply chain. The electronics includes communication circuitry configured to read data from and write data to the drug delivery form information. An apparatus includes memory(ies) having computer readable code, and processor(s). The processor(s) cause the apparatus to perform operations including communicating with a drug delivery form including a drug and drug delivery form information, including information about the drug and about at least part of a supply chain from manufacture of the drug delivery form to a current location in the supply chain. The processor(s) cause the apparatus to perform reading data from or writing data into the drug and drug delivery form information.

公开(公告)号：US20210153811A1

公开(公告)日：2021-05-27

申请号：US16697284

申请日：2019-11-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： RAJEEV NARAYANAN ,  Bing Dang ,  KATSUYUKI Sakuma

IPC: A61B5/00

Abstract: A method, a structure, and a computer system for a modular sensing unit. The structure comprises a sensor module, a power cable ribbon, and a component module, wherein the component module is in communication with and detachable from the sensor module via the power cable ribbon.

公开(公告)号：US11000474B2

公开(公告)日：2021-05-11

申请号：US15852943

申请日：2017-12-22

Applicant: International Business Machines Corporation

Inventor： S. Jay Chey ,  Bing Dang ,  John U. Knickerbocker ,  Kenneth F. Latzko ,  Joana Sofia Branquinho Teresa Maria ,  Lavanya Turlapati ,  Bucknell C. Webb ,  Steven L. Wright

IPC: A61M31/00 ,  A61N1/04 ,  A61K9/00

Abstract: Electromechanical substance delivery devices are provided which implement low-power electromechanical release mechanisms for controlled delivery of substances such as drugs and medication. For example, an electromechanical device includes a substrate having a cavity formed in a surface of the substrate, a membrane disposed on the surface of the substrate covering an opening of the cavity, and a seal disposed between the membrane and the surface of the substrate. The seal surrounds the opening of the cavity, and the seal and membrane are configured to enclose the cavity and retain a substance within the cavity. An electrode structure is configured to locally heat a portion of the membrane in response to a control voltage applied to the electrode structure, and create a stress that causes a rupture in the locally heated portion of the membrane to release the substance from within the cavity.

公开(公告)号：US10998217B2

公开(公告)日：2021-05-04

申请号：US15900178

申请日：2018-02-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Bing Dang ,  Jeffrey D. Gelorme ,  John U. Knickerbocker

IPC: H01L21/683 ,  H01L21/02 ,  C08G59/06 ,  C09J163/00 ,  C09J171/00 ,  C08L63/00 ,  C08L71/00 ,  C08K3/04 ,  C09J9/00

Abstract: A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

公开(公告)号：US10903153B2

公开(公告)日：2021-01-26

申请号：US16194377

申请日：2018-11-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John Knickerbocker ,  Bing Dang ,  Raymond Horton ,  Joana Maria

IPC: H01L23/498 ,  H01L23/48 ,  H01L21/683 ,  H01L21/48 ,  H01L21/20 ,  H01L21/768

Abstract: Die stacks and methods of making die stacks with very thin dies are disclosed. The die surfaces remain flat within a 5 micron tolerance despite the thinness of the die and the process steps of making the die stack. A residual flux height is kept below 50% of the spacing distance between adjacent surfaces or structures, e.g. in the inter-die spacing.

公开(公告)号：US20200250385A1

公开(公告)日：2020-08-06

申请号：US16268465

申请日：2019-02-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Rajeev Narayanan ,  Bing Dang ,  Bo Wen

IPC: G06K7/08 ,  G06K19/06

Abstract: A method, system, and mobile terminal configured for medication management are provided. A read operation is performed by a magnetic reader to detect whether a pattern of bio-compatible nano-magnetic particles on a pill is present within a body of a patient. Information from the read operation is transmitted to a mobile terminal by the wireless transceiver.