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公开(公告)号:US20200088773A1
公开(公告)日:2020-03-19
申请号:US16132816
申请日:2018-09-17
Applicant: Infineon Technologies AG
Inventor: Valentyn Solomko , Ruediger Bauder , Anthony Thomas
IPC: G01R27/06 , H04B1/3827 , H04B1/04 , H03H7/40
Abstract: A radio-frequency system includes an impedance tuning network having a plurality of selectable impedance states and a first port for coupling to a complex load impedance, a detector coupled to a second port of the impedance tuning network and configured to measure scalar values of reflection coefficients at the second port, and a controller configured to, for a first radio-frequency band, sequentially tune the impedance tuning network to at least three different impedance states in each of which the detector measures a scalar value of a corresponding reflection coefficient at the second port, and estimates a value of the complex load impedance based on the scalar values measured by the detector.
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公开(公告)号:US10304780B2
公开(公告)日:2019-05-28
申请号:US16025338
申请日:2018-07-02
Applicant: Infineon Technologies AG
Inventor: Chau Fatt Chiang , Kok Yau Chua , Swee Kah Lee , Chee Yang Ng , Valentyn Solomko
IPC: H01L23/49 , H01L23/552 , H01L21/48 , H01L21/56 , H01L23/31 , H01L23/367 , H01L23/498 , H01L23/66 , H01L23/00
Abstract: A device includes a substrate that includes conductive structures and has a first surface that is opposite to a second surface. Conductive pillars are built up over and electrically coupled to at least one of the conductive structures. An integrated circuit is disposed over the first surface and electrically coupled to the conductive structures. A molding compound is formed over the first surface of the substrate.
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公开(公告)号:US10250251B1
公开(公告)日:2019-04-02
申请号:US15891025
申请日:2018-02-07
Applicant: Infineon Technologies AG
Inventor: Bernd Schleicher , Winfried Bakalski , Ruediger Bauder , Valentyn Solomko
IPC: H03K17/16 , H03K17/687
Abstract: An RF switch includes series-coupled RF switch cells coupled between an RF input and ground, a transistor including a first current node coupled to a first load resistor, a second current node coupled to ground, and a control node coupled to an internal switch node, and a filter having an input coupled to the first current node of the first transistor and an output for providing a DC voltage corresponding to the RF power present at the internal switch node.
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公开(公告)号:US20180108616A1
公开(公告)日:2018-04-19
申请号:US15297744
申请日:2016-10-19
Applicant: Infineon Technologies AG
Inventor: Chau Fatt Chiang , Kok Yau Chua , Swee Kah Lee , Chee Yang NG , Valentyn Solomko
IPC: H01L23/552 , H01L23/498 , H01L23/31 , H01L23/66 , H01L23/367 , H01L23/00 , H01L21/48 , H01L21/56
CPC classification number: H01L23/552 , H01L21/485 , H01L21/4853 , H01L21/4882 , H01L21/565 , H01L23/3114 , H01L23/367 , H01L23/49838 , H01L23/66 , H01L24/48 , H01L2223/6677 , H01L2224/48227 , H01L2924/3025
Abstract: A device includes a substrate that includes conductive structures and has a first surface that is opposite to a second surface. Conductive pillars are built up over and electrically coupled to at least one of the conductive structures. An integrated circuit is disposed over the first surface and electrically coupled to the conductive structures. A molding compound is formed over the first surface of the substrate.
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公开(公告)号:US09947985B2
公开(公告)日:2018-04-17
申请号:US14804073
申请日:2015-07-20
Applicant: Infineon Technologies AG
Inventor: Valentyn Solomko , Winfried Bakalski , Nikolay Ilkov
Abstract: In accordance with an embodiment, a method of operating a directional coupler includes determining a coupled power variation by applying an input signal at an input port of the directional coupler, applying a first impedance at a transmitted port of the directional coupler, measuring a first coupled power at a coupled port of the directional coupler after applying the first impedance, applying a second impedance at the transmitted port of the directional coupler, measuring a second coupled power after applying the second impedance, and determining a difference between the first coupled power and the second coupled power to form the coupled power variation.
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46.
公开(公告)号:US20180041134A1
公开(公告)日:2018-02-08
申请号:US15661103
申请日:2017-07-27
Applicant: Infineon Technologies AG
Inventor: Viktor Gerber , Werner Simbuerger , Valentyn Solomko
Abstract: According to one embodiment, an apparatus for converting the electrical power of an electromagnetic wave into a DC electrical voltage signal is disclosed, the apparatus comprising a signal input region for receiving the electromagnetic wave, a signal output region for providing the DC electrical voltage signal, and a first conversion device, and the first conversion device comprising at least a first field-effect transistor element and a second field-effect transistor element, which is electrically coupled to the signal output region, the second field-effect transistor element being configured for series coupling to the first field-effect transistor element. According to this embodiment, the apparatus furthermore comprises at least one first capacitive element, which is electrically coupled to the signal input region, the first conversion device being configured in order to avoid at least one harmonic of the electromagnetic wave.
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公开(公告)号:US20170257135A1
公开(公告)日:2017-09-07
申请号:US15444962
申请日:2017-02-28
Applicant: Infineon Technologies AG
Inventor: Valentyn Solomko , Hans-Peter Friedrich , Michael Wilhelm
Abstract: A device includes a switching unit including N input ports and M output ports, wherein N≧M≧2. The switching unit is configured to selectively interconnect each of the M output ports with a different one of the N input ports. The device further includes M attenuators, wherein each of the M attenuators is electrically coupled to a different one of the M output ports of the switching unit.
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公开(公告)号:US09608305B2
公开(公告)日:2017-03-28
申请号:US14155130
申请日:2014-01-14
Applicant: Infineon Technologies AG
Inventor: Valentyn Solomko , Winfried Bakalski , Nikolay Ilkov , Werner Simbuerger , Daniel Kehrer
CPC classification number: H01P5/18 , G01R1/203 , G01R1/206 , G01R19/00 , G01R21/07 , H01P5/04 , H03H7/48
Abstract: A circuit includes a current sensing circuit comprising a current input terminal coupled to an input port, a current output terminal coupled to a transmitted port, and a current sensing output terminal configured to provide a current sensing signal proportional to a current flowing between the current input terminal and the current output terminal. The circuit further includes a voltage sensing circuit having a voltage input terminal coupled to the transmitted port and a voltage sensing output terminal configured to provide a voltage sensing signal proportional to a voltage at the transmitted port. A combining circuit has a first input coupled to the current sensing output terminal, a second input coupled to the voltage sensing output terminal, and a combined output node coupled to an output port.
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49.
公开(公告)号:US09535140B2
公开(公告)日:2017-01-03
申请号:US13931092
申请日:2013-06-28
Applicant: Infineon Technologies AG
Inventor: Valentyn Solomko , Winfried Bakalski
Abstract: In accordance with an embodiment, a circuit includes a magnetic transformer having a first winding coupled between a first signal node and a second signal node, and a second winding coupled between a first reference node and a current measurement node. A phase shift network is coupled between the second node and a voltage measurement node, and the circuit is configured to indicate an impedance matching condition based on an amplitude difference and a phase difference between the voltage measurement node and the current measurement node.
Abstract translation: 根据实施例,电路包括磁变压器,其具有耦合在第一信号节点和第二信号节点之间的第一绕组以及耦合在第一参考节点和当前测量节点之间的第二绕组。 相移网络耦合在第二节点和电压测量节点之间,并且电路被配置为基于电压测量节点和当前测量节点之间的振幅差和相位差来指示阻抗匹配条件。
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公开(公告)号:US20150091668A1
公开(公告)日:2015-04-02
申请号:US14043496
申请日:2013-10-01
Applicant: INFINEON TECHNOLOGIES AG
Inventor: Valentyn Solomko , Winfried Bakalski , Nikolay Ilkov
IPC: H01P5/18
CPC classification number: H03F1/56 , H01P5/18 , H03F1/0261 , H03F3/195 , H03F3/602 , H03F3/68 , H03F2200/198 , H03F2200/255 , H03F2200/451 , H03H7/24 , H03H11/36
Abstract: In accordance with an embodiment, a directional coupler includes a coupler circuit and at least one amplifier coupled between a coupler circuit isolated port and a directional coupler isolated port and/or between a coupler circuit coupled port and a directional coupler coupled port. In various embodiments, the directional coupler is disposed over and/or in a substrate.
Abstract translation: 根据实施例,定向耦合器包括耦合器电路和耦合在耦合器电路隔离端口和定向耦合器隔离端口之间和/或耦合器电路耦合端口和定向耦合器耦合端口之间的至少一个放大器。 在各种实施例中,定向耦合器设置在衬底上和/或衬底中。
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