摘要:
A wall mount for a display apparatus to vertically move an apparatus body of the display apparatus in an electromotive manner and a display apparatus having the same are provided. A wire is mounted at the rear of the apparatus body. The wall mount includes a plurality of wire hanging members fixed to a rear of the apparatus; a wire connected between the wire hanging members; a guide member which is configure to move vertically while supporting the wire, to thereby move the apparatus vertically, the guide member not being exposed when the apparatus is viewed from a front of the apparatus; and a base member which is configured to be fixed to the wall to vertically move the guide member in an electromotive manner.
摘要:
A test apparatus for a power supply unit is provided, which includes a body unit configured to define a space to receive a light emitting diode (LED) and to provide a test environment to test a supply state of power applied to the LED; and a test unit mounted in the body unit to face the LED and configured to detect flicker of the LED occurring when a power supply is abnormal. According to the foregoing structure, power supply with respect to the LED may be regularly detected and analyzed, thereby increasing quality of power supply with respect to the LED.
摘要:
A supporting device to a display apparatus to prevent a wire from separating from a wire hanger. The supporting device to fix the display apparatus to a wall includes a wire part coupled to the display apparatus, a wire hanger mounted to the wall, the wire hanger to hang the wire part on the wall, and a separation protector provided at the wire hanger, the separation protector serving to prevent the wire part from separating from the wire hanger.
摘要:
A supporting device is installed between an auxiliary display unit and a main display unit to variously change the position and pose of the auxiliary display unit and a dual display unit having the same are disclosed. The dual display unit includes a main display unit which displays an image, a supporting device which is coupled to the main display unit, and an auxiliary display unit which is installed on the supporting device. The supporting device is configured to adjust the distance between the main display unit and the auxiliary display unit.
摘要:
A method of manufacturing a power supply unit (PSU) is provided. The method includes providing at least one PSU supplying a dimming signal to at least one light source, performing a first test for electrical characteristics of the at least one PSU, detecting light emitted from the at least one light source, measuring a flicker of the at least one light source, and performing a second test for a state of the at least one PSU based on a flicker measurement result, and packing a PSU determined to be in a normal state among the at least one PSU, as a result of the first test and the second test.
摘要:
A photolithography process facility comprising a substrate treating apparatus, the substrate treating apparatus includes a temperature control plate controlling a temperature a substrate, a central supporter having a pin shape vertically penetrating the temperature control plate and supporting a central region of substrate, and a collision preventer preventing a collision between the substrate and the temperature control plate.
摘要:
A supporting device is installed between an auxiliary display unit and a main display unit to variously change the position and pose of the auxiliary display unit and a dual display unit having the same are disclosed. The dual display unit includes a main display unit which displays an image, a supporting device which is coupled to the main display unit, and an auxiliary display unit which is installed on the supporting device. The supporting device is configured to adjust the distance between the main display unit and the auxiliary display unit.
摘要:
The picture mode controller for flat panel and flat panel display device including the same includes an input unit to input a first timing signal indicating transmission sections for pixel data, and a second timing signal indicating a transmission time of each pixel data, a pseudo timing signal generating unit to generate a first pseudo timing signal to be used as the first timing signal, a first selecting unit to selectively output the first timing signal and the first pseudo timing signal to allow one of a video picture mode and a black picture mode to be designated, and a selection control unit to control a selecting operation of the first selecting unit based on whether the first timing signal is input from the input unit and whether a period of the second timing signal changes.
摘要:
The present invention relates to a chip sized integrated circuit package. A device package embodying the invention includes: an insulative substrate having a plurality of conductive first lands formed on an upper surface of the substrate and a plurality of conductive second lands formed on a lower surface of the insulating substrate; a plurality of via holes formed in the substrate adjacent the first and second lands; a conductive film formed on inner walls of the via holes and connecting corresponding ones of the first and second lands; and at least one cavity in the substrate that has an edge extending along a in centerline of a row of the via holes. A semiconductor chip having a plurality of bond pads is attached to a center portion of the upper surface of the substrate, and a plurality in of wires connect corresponding ones of the bond pads and the first lands. An insulation resin covers the integrated circuit chip, the wires, the first lands, and the upper surface of the substrate.
摘要:
The present invention relates to a chip sized integrated circuit package. A device package embodying the invention includes: an insulative substrate having a plurality of conductive first lands formed on an upper surface of the substrate and a plurality of conductive second lands formed on a lower surface of the insulating substrate; a plurality of via holes formed in the substrate adjacent the first and second lands; a conductive film formed on inner walls of the via holes and connecting corresponding ones of the first and second lands; and at least one cavity in the substrate that has an edge extending along a centerline of a row of the via holes. A semiconductor chip having a plurality of bond pads is attached to a center portion of the upper surface of the substrate, and a plurality of wires connect corresponding ones of the bond pads and the first lands. An insulation resin covers the integrated circuit chip, the wires, the first lands, and the upper surface of the substrate.