公开(公告)号：US20050242408A1

公开(公告)日：2005-11-03

申请号：US10833345

申请日：2004-04-28

申请人： Wen-Kun Yang ,  Wen-Pin Yang

发明人： Wen-Kun Yang ,  Wen-Pin Yang

IPC分类号： H01L27/14 ,  H01L21/00 ,  H01L21/50 ,  H01L21/56 ,  H01L23/12 ,  H01L23/50 ,  H01L27/144 ,  H01L27/146 ,  H01L29/06 ,  H01L31/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/10 ,  H04N5/225 ,  H05K1/18

CPC分类号： H01L27/14687 ,  H01L21/561 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/24137 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15788 ,  H05K1/189 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/82

摘要： The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises an isolating base, a wafer level package, a lens holder, and a F.P.C.. The wafer level package having a plurality of image sensor dies and a plurality of solder balls is attached to the isolating base. A plurality of lens are placed in the lens holder, and the lens holder is located on the image sensor dies. The lens holder is placed in the F.P.C., and the F.P.C. has a plurality of solder joints coupled to the solder balls for conveniently transmitting signal of the image sensor dies. Moreover, the image sensor dies may be packaged with passive components or other dies with a side by side structure or a stacking structure.

摘要翻译： 本发明公开了一种图像传感器模块和晶片级封装的形成方法。 图像传感器模块包括隔离基座，晶片级封装，透镜保持器和F.P.C。具有多个图像传感器管芯和多个焊球的晶片级封装件附接到隔离基座。 多个透镜被放置在透镜保持器中，并且透镜保持器位于图像传感器模具上。 镜头架放置在F.P.C.和F.P.C. 具有耦合到焊球的多个焊点，用于方便地传输图像传感器管芯的信号。 此外，图像传感器管芯可以与无源部件或具有并排结构或堆叠结构的其它管芯一起封装。