公开(公告)号：US07956635B2

公开(公告)日：2011-06-07

申请号：US12345740

申请日：2008-12-30

Applicant: Eric D. Hobbs ,  Andrew W. McFarland

Inventor： Eric D. Hobbs ,  Andrew W. McFarland

IPC: G01R31/20 ,  G01R31/02

CPC classification number: G01R1/07378

Abstract: A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members.

Abstract translation: 本文提供了一种与测试装置一起使用的加强装置。 在一些实施例中，用于与测试装置一起使用的加强件包括内部构件; 与所述内部构件以主要间隔开的关系设置的外部构件; 以及用于使内部和外部构件相对于彼此定向的多个对准机构，其中对准机构将施加到内部构件的下表面的力传递到外部构件，并且在内部构件和内部构件之间提供主要的导电传热通道 外部成员。

公开(公告)号：US07851794B2

公开(公告)日：2010-12-14

申请号：US11617394

申请日：2006-12-28

Applicant: Eric D. Hobbs

Inventor： Eric D. Hobbs

IPC: H01L21/00

CPC classification number: G01R1/06716 ,  G01R1/06733 ,  Y10T29/49128

Abstract: Rotating contact elements and methods of fabrication are provided herein. In one embodiment, a rotating contact element includes a tip having a first side configured to contact a device to be tested and an opposing second side; and a plurality of deformed members extending from the second side of the tip and arranged about a central axis thereof, wherein the tip rotates substantially about the central axis upon compression of the plurality of deformed members.

Abstract translation: 本文提供旋转接触元件和制造方法。 在一个实施例中，旋转接触元件包括尖端，其具有被配置为接触待测试装置和相对的第二侧的第一侧; 以及多个变形构件，其从所述尖端的第二侧延伸并围绕其中心轴线布置，其中当所述多个变形构件压缩时，所述尖端基本上围绕所述中心轴线旋转。

公开(公告)号：US07808259B2

公开(公告)日：2010-10-05

申请号：US11861559

申请日：2007-09-26

Applicant: Benjamin N. Eldridge ,  Eric D. Hobbs ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Eric D. Hobbs ,  Gaetan L. Mathieu

IPC: G01R31/02

CPC classification number: G01R31/2891 ,  G01R1/06716 ,  G01R1/07342 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L21/682 ,  Y10T29/49002

Abstract: A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the first structure is in a position with respect to the second structure that aligns first features on the first structure with second features on the second structures. The second feature can be in a second plane that is generally parallel to the first plane. The first and second structures can be first and second electronic components, which can be components of a probe card assembly.

Abstract translation: 用于对准多个结构的方法或设备可以包括将第一平面中的第一力施加到第一结构。 该方法还可以包括在第一平面中约束相对于第二结构的第一结构，使得第一结构相对于将第一结构上的第一特征与第二结构上的第二特征对准的第二结构处于相对位置。 第二特征可以在通常平行于第一平面的第二平面中。 第一和第二结构可以是第一和第二电子部件，其可以是探针卡组件的部件。

公开(公告)号：US20100000080A1

公开(公告)日：2010-01-07

申请号：US12477748

申请日：2009-06-03

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Eric D. Hobbs ,  Gaetan L. Mathieu ,  Makarand S. Shinde ,  Alexander H. Slocum ,  A. Nicholas Sporck ,  Thomas N. Watson

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Eric D. Hobbs ,  Gaetan L. Mathieu ,  Makarand S. Shinde ,  Alexander H. Slocum ,  A. Nicholas Sporck ,  Thomas N. Watson

IPC: H05K13/04

CPC classification number: G01R31/2874 ,  G01R31/2863 ,  G01R31/2889 ,  Y10T29/5313

Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

Abstract translation: 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

公开(公告)号：US20090108861A1

公开(公告)日：2009-04-30

申请号：US12345740

申请日：2008-12-30

Applicant: Eric D. Hobbs ,  Andrew W. McFarland

Inventor： Eric D. Hobbs ,  Andrew W. McFarland

IPC: G01R31/02 ,  G01R31/28

CPC classification number: G01R1/07378

Abstract: A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members.

Abstract translation: 本文提供了一种与测试装置一起使用的加强装置。 在一些实施例中，用于与测试装置一起使用的加强件包括内部构件; 与所述内部构件以主要间隔开的关系设置的外部构件; 以及用于使内部和外部构件相对于彼此定向的多个对准机构，其中对准机构将施加到内部构件的下表面的力传递到外部构件，并且在内部构件和内部构件之间提供主要的导电传热通道 外部成员。

公开(公告)号：US07471078B2

公开(公告)日：2008-12-30

申请号：US11617929

申请日：2006-12-29

Applicant: Eric D. Hobbs ,  Andrew W. McFarland

Inventor： Eric D. Hobbs ,  Andrew W. McFarland

IPC: G01R31/28 ,  G01R31/02

CPC classification number: G01R1/07378

Abstract: A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members.

Abstract translation: 本文提供了一种与测试装置一起使用的加强装置。 在一些实施例中，用于与测试装置一起使用的加强件包括内部构件; 与所述内部构件以主要间隔开的关系设置的外部构件; 以及用于使内部和外部构件相对于彼此定向的多个对准机构，其中对准机构将施加到内部构件的下表面的力传递到外部构件，并且在内部构件和内部构件之间提供主要的导电传热通道 外部成员。

公开(公告)号：US20080186040A1

公开(公告)日：2008-08-07

申请号：US11864690

申请日：2007-09-28

Applicant: Eric D. Hobbs ,  Andrew W. McFarland

Inventor： Eric D. Hobbs ,  Andrew W. McFarland

IPC: G01R31/26 ,  G01R1/02

CPC classification number: G01R31/2863 ,  G01R31/2889 ,  G01R31/31905

Abstract: Methods and apparatus for testing semiconductor devices are provided herein. In some embodiments, an assembly for testing semiconductor devices can include a probe card assembly; and a thermal barrier disposed proximate an upper surface of the probe card assembly, the thermal barrier can restrict thermal transfer between tester side boundary conditions and portions of the probe card assembly disposed beneath the thermal barrier.

Abstract translation: 本文提供了测试半导体器件的方法和装置。 在一些实施例中，用于测试半导体器件的组件可以包括探针卡组件; 以及设置在探针卡组件的上表面附近的热障，热障可以限制测试仪侧边界条件与布置在热障下方的探针卡组件的部分之间的热传递。

公开(公告)号：US20080088010A1

公开(公告)日：2008-04-17

申请号：US11548668

申请日：2006-10-11

Applicant: Eric D. Hobbs ,  Gaetan Mathieu

Inventor： Eric D. Hobbs ,  Gaetan Mathieu

IPC: H01L23/34

CPC classification number: H01L23/34 ,  B81B7/0006 ,  B81B7/0093 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/00

Abstract: An electronic device can comprise a semiconductor die on which can be formed a micromechanical system. The micromechanical system can comprise a plurality of electrically conductive elongate, contact structures, which can be disposed on input and/or output terminals of the semiconductor die. The micromechanical system can also comprise a cooling structure disposed on the semiconductor die.

Abstract translation: 电子设备可以包括其上可以形成微机械系统的半导体管芯。 微机械系统可以包括多个导电细长的接触结构，其可以设置在半导体管芯的输入和/或输出端子上。 微机械系统还可以包括设置在半导体管芯上的冷却结构。

公开(公告)号：US07285968B2

公开(公告)日：2007-10-23

申请号：US11306515

申请日：2005-12-30

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Eric D. Hobbs ,  Gaetan L. Mathieu ,  Makarand S. Shinde ,  Alexander H. Slocum ,  A. Nicholas Sporck ,  Thomas N. Watson

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Eric D. Hobbs ,  Gaetan L. Mathieu ,  Makarand S. Shinde ,  Alexander H. Slocum ,  A. Nicholas Sporck ,  Thomas N. Watson

IPC: G01R31/02

CPC classification number: G01R31/2874 ,  G01R31/2863 ,  G01R31/2889 ,  Y10T29/5313

Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

Abstract translation: 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

公开(公告)号：US08760187B2

公开(公告)日：2014-06-24

申请号：US12327576

申请日：2008-12-03

Applicant: Eric D. Hobbs

Inventor： Eric D. Hobbs

IPC: G01R31/20

CPC classification number: G01R31/2889

Abstract: A first device and a second device can include at least one alignment feature and at least one corresponding constraint. The alignment feature and the constraint can be configured to align the first device and the second device when the alignment feature is inserted into the constraint. The alignment feature and the constraint can be further configured to direct relative movement between the first device and the second device due to relative thermal expansion or contraction between the first device and the second device. The directed relative movement can keep the first device and the second device aligned over a predetermined temperature range.

Abstract translation: 第一装置和第二装置可以包括至少一个对准特征和至少一个对应的约束。 对准特征和约束可以被配置为当对准特征被插入到约束中时，使第一设备和第二设备对齐。 对准特征和约束可以被进一步配置成由于第一装置和第二装置之间的相对热膨胀或收缩而引导第一装置和第二装置之间的相对运动。 定向相对运动可以使第一装置和第二装置保持在预定的温度范围内。