公开(公告)号：US06852019B2

公开(公告)日：2005-02-08

申请号：US09973842

申请日：2001-10-11

申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

IPC分类号： B24B37/005 ,  B24B37/04 ,  B24B37/30 ,  B24B41/06 ,  H01L21/304 ,  B24B7/22

CPC分类号： B24B37/30 ,  B24B41/061

摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

公开(公告)号：US08357029B2

公开(公告)日：2013-01-22

申请号：US12747225

申请日：2009-02-09

申请人： Makoto Fukushima ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Osamu Nabeya ,  Tomoshi Inoue

发明人： Makoto Fukushima ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Osamu Nabeya ,  Tomoshi Inoue

IPC分类号： B24B5/00

CPC分类号： B24B37/30

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold and press a substrate against the polishing surface (101a), and a retainer ring (3) provided at an outer peripheral portion of the top ring body (2) and configured to press the polishing surface (101a). A fulcrum for receiving a lateral force applied from the substrate to the retainer ring (3) during polishing of the substrate is located above a central portion of the substrate.

摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光面（101a）的抛光台（100），被配置为将基板保持并压靠在抛光表面（101a）上的顶环体（2），以及设置在抛光表面 所述顶环体（2）的外周部分构造成按压所述抛光表面（101a）。 用于在衬底抛光期间接收从衬底施加到保持环（3）的侧向力的支点位于衬底的中心部分的上方。

公开(公告)号：US08100743B2

公开(公告)日：2012-01-24

申请号：US12285941

申请日：2008-10-16

申请人： Osamu Nabeya ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Makoto Fukushima

发明人： Osamu Nabeya ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Makoto Fukushima

IPC分类号： B24B5/00

CPC分类号： B24B37/32

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring body configured to hold and press a substrate against the polishing surface, a retainer ring provided at an outer peripheral portion of the top ring body and configured to press the polishing surface, and a retainer ring guide fixed to the top ring body and configured to be brought into sliding contact with a ring member of the retainer ring to guide a movement of said ring member. Either one of sliding contact surfaces of the ring member and the retainer ring guide which are brought into sliding contact with each other comprises a low friction material.

摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有研磨面的研磨台，配置为将基板保持并压靠在研磨面上的顶环体，设置在顶环体的外周部并构造成按压抛光面的保持环， 以及保持环导向件，其固定到所述顶环主体并且被构造成与所述保持环的环形构件滑动接触以引导所述环构件的运动。 彼此滑动接触的环构件和保持器环导向件的滑动接触表面中的任一个包括低摩擦材料。

公开(公告)号：US20090191791A1

公开(公告)日：2009-07-30

申请号：US12320471

申请日：2009-01-27

申请人： Makoto Fukushima ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Osamu Nabeya ,  Shingo Saito

发明人： Makoto Fukushima ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Osamu Nabeya ,  Shingo Saito

IPC分类号： B24B1/00 ,  B24B49/10 ,  B24B57/02

CPC分类号： B24B37/345

摘要： A polishing method can safely detach and lift up a workpiece from a polishing surface without carrying out the operation of making the workpiece overhang the polishing surface. The polishing method includes carrying out processing of a surface to be polished of a workpiece by supplying a liquid to a polishing surface while pressing the surface to be polished of the workpiece held by a holding device against the polishing surface and moving the workpiece and the polishing surface relative to each other, attracting the workpiece after the processing to the holding device while supplying the liquid to the polishing surface at a decreased flow rate, thereby detaching the workpiece from the polishing surface, and lifting up the holding device together with the workpiece on confirmation of detachment of the workpiece from the polishing surface and attachment of the workpiece to the holding device.

摘要翻译： 抛光方法可以安全地从抛光表面上分离和提起工件，而不必进行使工件伸出抛光表面的操作。 抛光方法包括：通过向抛光表面供给液体来进行待研磨表面的加工，同时将由保持装置保持的工件的待抛光表面压在抛光表面上并移动工件和抛光 相对于彼此的表面，在将处理后的工件吸收到保持装置的同时，以降低的流量向抛光表面供给液体，从而将工件从抛光表面分离，并将工件与工件一起提起 确认工件与抛光表面分离并将工件附着到保持装置上。

公开(公告)号：US20070111637A1

公开(公告)日：2007-05-17

申请号：US10555702

申请日：2004-02-25

申请人： Tetsuji Togawa ,  Osamu Nabeya

发明人： Tetsuji Togawa ,  Osamu Nabeya

IPC分类号： B24B49/00

CPC分类号： H01L21/6838 ,  B24B37/30 ,  B24B49/16 ,  H01L21/67092

摘要： A substrate holding apparatus holds a substrate such as a semiconductor and presses the substrate against a polishing surface. The substrate holding apparatus includes a top ring body (2) for holding the substrate, a plurality of fluid passages (33, 34, 35, 36) for supplying a fluid to a plurality of pressure chambers (22, 23, 24, 25) defined in the top ring body, and a plurality of sensors (S1, S2, S3, S4) disposed in the fluid passages, respectively, for detecting flowing states of the fluid which flows through the fluid passages.

摘要翻译： 基板保持装置保持诸如半导体的基板，并将基板压靠在抛光表面上。 基板保持装置包括用于保持基板的顶环体（2），用于向多个压力室（22,23,24,25）供给流体的多个流体通道（33,34,35,36） 以及设置在流体通道中的多个传感器（S 1，S 2，S 3，S 4），用于检测流过流体通道的流体的流动状态。

公开(公告)号：US20050130562A1

公开(公告)日：2005-06-16

申请号：US10504873

申请日：2003-02-27

申请人： Osamu Nabeya ,  Tetsuji Togawa

发明人： Osamu Nabeya ,  Tetsuji Togawa

IPC分类号： B24B37/04 ,  B24B49/12 ,  G06T1/00 ,  G06T7/00 ,  H01L21/304 ,  B24B49/00 ,  B24B51/00

CPC分类号： B24B37/005 ,  B24B49/12

摘要： A polishing apparatus 110 which comprises a polishing tool 1 having a polishing surface, and a holder means (top ring 4) for holding a semiconductor wafer (a substrate) W. Polishing apparatus 110 further comprises color CCD camera 10 for taking a color image of a region on the polishing surface; image processor means 40 for determining whether or not any foreign matter exists on the polishing surface based on a condition of a color in the color image data acquired by color CCD camera 10, and apparatus operation control section 45 which in response to the determination of image processing section 40, stops the relative movement between semiconductor wafer W and the polishing surface and separates top ring 4 and the polishing surface from each other.

摘要翻译： 抛光装置110，其包括具有抛光表面的抛光工具1和用于保持半导体晶片（基板）W的保持器装置（顶环4）。抛光装置110还包括彩色CCD照相机10，用于拍摄彩色图像 抛光表面上的区域; 图像处理装置40，用于基于由彩色CCD照相机10获取的彩色图像数据中的颜色的条件以及响应于图像的确定的装置操作控制部分45确定抛光表面上是否存在任何异物 处理部分40停止半导体晶片W与抛光表面之间的相对运动，并将顶环4和抛光表面彼此分开。

公开(公告)号：US06783440B2

公开(公告)日：2004-08-31

申请号：US09903581

申请日：2001-07-13

申请人： Tetsuji Togawa ,  Osamu Nabeya

发明人： Tetsuji Togawa ,  Osamu Nabeya

IPC分类号： B24B700

CPC分类号： B24B37/26 ,  B24B47/10 ,  B24D11/04

摘要： A polishing apparatus has a top ring for holding a workpiece to be polished and a polishing table movable relative to the top ring. The polishing table has a polishing surface for polishing the workpiece held by the top ring. The polishing apparatus further has a polishing liquid supply device for supplying a polishing liquid to the polishing surface. At least one of the top ring and the polishing table reciprocates linearly in a first direction. The workpiece can be polished uniformly by the polishing surface because at least one of the top ring and the polishing table reciprocates linearly in the first direction.

摘要翻译： 抛光装置具有用于保持要抛光的工件的顶环和相对于顶环可移动的抛光台。 抛光台具有用于抛光由顶环保持的工件的抛光表面。 抛光装置还具有用于将抛光液供给到研磨面的研磨液供给装置。 顶环和抛光台中的至少一个在第一方向上往复运动。 由于顶环和研磨台中的至少一个在第一方向上线性地往复运动，所以能够通过抛光表面均匀地抛光工件。

公开(公告)号：US20070212988A1

公开(公告)日：2007-09-13

申请号：US11797721

申请日：2007-05-07

申请人： Osamu Nabeya ,  Tetsuji Togawa

发明人： Osamu Nabeya ,  Tetsuji Togawa

IPC分类号： B24B29/00 ,  B24B5/00

CPC分类号： B24B37/32 ,  B24B49/16

摘要： A polishing apparatus has a polishing surface, a top ring for holding a semiconductor wafer, and a top ring shaft for pressing the top ring against the polishing surface. The top ring has a retainer ring for holding a peripheral portion of the semiconductor wafer, a housing substantially in a form of a disk which is connected to the top ring shaft, a sliding contact joint interconnecting the retainer ring and the housing in a state such that the retainer ring and the housing are brought into sliding contact with each other.

摘要翻译： 抛光装置具有抛光面，用于保持半导体晶片的顶环和用于将顶环压靠在抛光表面上的顶环轴。 顶环具有用于保持半导体晶片的周边部分的保持环，基本上为与顶环轴连接的圆盘形状的壳体，以及保持环和壳体的滑动接触接头， 保持环和壳体彼此滑动接触。

公开(公告)号：US06609962B1

公开(公告)日：2003-08-26

申请号：US09572629

申请日：2000-05-17

申请人： Satoshi Wakabayashi ,  Kuniaki Yamaguchi ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Osamu Nabeya

发明人： Satoshi Wakabayashi ,  Kuniaki Yamaguchi ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Osamu Nabeya

IPC分类号： B24B100

CPC分类号： B24B53/017 ,  B24B1/04 ,  B24B53/12

摘要： A dressing apparatus is used for dressing a polishing surface of a polishing table used for polishing a workpiece such as a semiconductor wafer. The dressing apparatus for dressing apparatus comprises a dresser having a dressing surface for dressing the polishing surface, and the dressing surface has an area which covers an entire area of the polishing surface.

摘要翻译： 修整装置用于修整用于抛光诸如半导体晶片的工件的抛光台的抛光表面。 修整装置的敷料装置包括具有用于修整抛光表面的修整表面的修整器，并且修整表面具有覆盖抛光表面的整个区域的区域。

公开(公告)号：US20060128286A1

公开(公告)日：2006-06-15

申请号：US10562877

申请日：2004-07-14

申请人： Osamu Nabeya ,  Tetsuji Togawa

发明人： Osamu Nabeya ,  Tetsuji Togawa

IPC分类号： B24B29/00

CPC分类号： B24B37/32 ,  B24B49/16

摘要： A polishing apparatus according to the present invention has a polishing surface (101), a top ring (1) for holding a semiconductor wafer (W), and a top ring shaft (11) for pressing the top ring (1) against the polishing surface (101). The top ring (1) has a retainer ring (3) for holding a peripheral portion of the semiconductor wafer (W), a housing (2) substantially in a form of a disk which is connected to the top ring shaft (11), a sliding contact joint (4, 5, 6, 2b) interconnecting the retainer ring (3) and the housing (2) in a state such that the retainer ring (3) and the housing (2) are brought into sliding contact with each other.

摘要翻译： 根据本发明的抛光装置具有抛光表面（101），用于保持半导体晶片（W）的顶环（1）和用于将顶环（1）压在抛光件上的顶环轴（11） 表面（101）。 顶环（1）具有用于保持半导体晶片（W）的周边部分的保持环（3），与顶环轴（11）连接的大致呈圆盘形状的壳体（2） 在保持环（3）和壳体（2）滑动接触的状态下将保持环（3）和壳体（2）互连的滑动接触接头（4,5,6,2b）与 彼此。