公开(公告)号：US08310020B2

公开(公告)日：2012-11-13

申请号：US13455888

申请日：2012-04-25

Applicant: Rajiv Yadav Ranjan ,  Parviz Keshtbod

Inventor： Rajiv Yadav Ranjan ,  Parviz Keshtbod

IPC: H01L29/82 ,  G11C11/00

CPC classification number: H01L43/10 ,  B82Y10/00 ,  G11C11/161 ,  G11C11/1675 ,  H01L27/228

Abstract: A non-volatile current-switching magnetic memory element includes a bottom electrode, a pinning layer formed on top of the bottom electrode, and a fixed layer formed on top of the pinning layer. The memory element further includes a tunnel layer formed on top of the pinning layer, a first free layer formed on top of the tunnel layer, a granular film layer formed on top of the free layer, a second free layer formed on top of the granular film layer, a cap layer formed on top of the second layer and a top electrode formed on top of the cap layer.

Abstract translation: 非易失性电流切换磁存储元件包括底电极，形成在底电极顶部的钉扎层和形成在钉扎层顶部上的固定层。 存储元件还包括形成在钉扎层顶部的隧道层，形成在隧道层顶部上的第一自由层，形成在自由层顶部上的颗粒膜层，形成在颗粒状的顶部上的第二自由层 膜层，形成在第二层的顶部上的盖层和形成在盖层的顶部上的顶部电极。

公开(公告)号：US20120212998A1

公开(公告)日：2012-08-23

申请号：US13453940

申请日：2012-04-23

Applicant: Rajiv Yadav Ranjan ,  Parviz Keshtbod

Inventor： Rajiv Yadav Ranjan ,  Parviz Keshtbod

IPC: G11C11/16 ,  H01L43/10

CPC classification number: H01L43/10 ,  B82Y10/00 ,  G11C11/161 ,  G11C11/1675 ,  H01L27/228

Abstract: A non-volatile current-switching magnetic memory element includes a bottom electrode, a pinning layer formed on top of the bottom electrode, and a fixed layer formed on top of the pinning layer. The non-volatile current-switching magnetic memory element further includes a tunnel layer formed on top of the pinning layer, a first free layer with a perpendicular anisotropy that is formed on top of the tunnel layer, a granular film layer formed on top of the free layer, a second free layer formed on top of the granular film layer, a cap layer formed on top of the second layer, and a top electrode formed on top of the cap layer.

Abstract translation: 非易失性电流切换磁存储元件包括底电极，形成在底电极顶部的钉扎层和形成在钉扎层顶部上的固定层。 非易失性电流切换磁存储元件还包括形成在钉扎层顶部的隧道层，形成在隧道层顶部上的具有垂直各向异性的第一自由层，形成在隧道层顶部的粒状膜层 自由层，形成在所述粒状膜层的顶部上的第二自由层，形成在所述第二层的顶部上的盖层，以及形成在所述盖层的顶部上的顶部电极。

公开(公告)号：US6018265A

公开(公告)日：2000-01-25

申请号：US52038

申请日：1998-03-30

Applicant: Parviz Keshtbod

Inventor： Parviz Keshtbod

IPC: G11C16/06 ,  G05F1/10 ,  G05F3/02 ,  G05F3/24

CPC classification number: G05F3/247

Abstract: The present invention includes a circuit for deriving a reference signal having a reference voltage from a system voltage source having a system voltage level and for regulating the reference voltage level. The circuit includes an output sub-circuit, a reference generator sub-circuit, a regulator sub-circuit, a translator sub-circuit, and a low pass filter sub-circuit. The output sub-circuit, which is coupled to the system voltage source, is responsive to a voltage control signal, and is operative to generate the reference signal wherein the reference voltage level is less than or equal to the system voltage level. The reference generator sub-circuit is responsive to the reference signal and is operative to generate a prime voltage level which remains substantially unaffected by fabrication process variations, temperature variations and variations in the reference signal. The regulator sub-circuit is responsive to the reference signal and the prime voltage level and is operative to generate the voltage control signal. The translator sub-circuit is coupled to the system voltage source and functions to amplify the voltage control signal. The low pass filter sub-circuit is used for filtering the voltage control signal. The output sub-circuit includes an output transistor having its gate coupled to receive the voltage control signal, its source connected to the system voltage source, and its drain connected to an output terminal at which the reference signal is provided.

Abstract translation: 本发明包括用于从具有系统电压电平的系统电压源导出具有参考电压并用于调节参考电压电平的参考信号的电路。 电路包括输出子电路，参考发生器子电路，调节器子电路，转换器子电路和低通滤波器子电路。 耦合到系统电压源的输出子电路响应于电压控制信号，并且可操作地产生参考信号，其中参考电压电平小于或等于系统电压电平。 参考发生器子电路响应于参考信号，并且可操作地产生主要电压电平，其基本上不受制造工艺变化，温度变化和参考信号变化的影响。 稳压器子电路响应于参考信号和主电压电平，并且可操作地产生电压控制信号。 转换器子电路耦合到系统电压源并且用于放大电压控制信号。 低通滤波器子电路用于对电压控制信号进行滤波。 输出子电路包括输出晶体管，其输出晶体管的栅极被耦合以接收电压控制信号，其源极连接到系统电压源，其漏极连接到提供参考信号的输出端子。

公开(公告)号：US5776787A

公开(公告)日：1998-07-07

申请号：US650785

申请日：1996-05-20

Applicant: Parviz Keshtbod

Inventor： Parviz Keshtbod

IPC: H01L21/336 ,  H01L21/8247 ,  H01L29/423 ,  H01L29/788 ,  H01L29/792

CPC classification number: H01L27/11521 ,  H01L27/115 ,  H01L29/4232 ,  H01L29/42324 ,  H01L29/42328 ,  H01L29/66825 ,  H01L29/7883

Abstract: A flash EPROM cell has a reduced cell size by providing vertical coupling between the floating gate and the bit line during programming. The erase operation is done by tunneling of electrons from the sharp tip of the Poly spacer to the control gate. The cell is adapted so that the source for each cell within the array is the source of an adjacent cell and the drain is the drain to another adjacent cell. The cell is formed by forming the drain regions into the substrate through openings in a first insulator that is preferably the field oxide. A second insulator is deposited over the first insulator, over the substrate and along the side walls of the openings and is preferably a thin layer so that the opening is covered with a thin insulating layer. The insulated opening is filled with a metal, preferably tungsten or a tungsten alloy. The field oxide is selectively removed. A gate oxide is grown and a first polysilicon layer is formed and then etched to form spacers along the edges of the metal/second insulator structure. The first polysilicon is selectively etched and a tunneling insulator layer is formed thereover. A second polysilicon layer is formed over the tunneling insulator.

Abstract translation: 闪存EPROM单元在编程期间通过在浮动栅极和位线之间提供垂直耦合而具有减小的单元尺寸。 擦除操作是通过将电子从Poly间隔物的尖端引导到控制栅极进行的。 单元被适配成使得阵列内的每个单元的源极是相邻单元的源极，漏极是另一相邻单元的漏极。 通过在优选为场氧化物的第一绝缘体中的开口将漏区形成为衬底而形成电池。 第二绝缘体沉积在第一绝缘体上方，在衬底上并且沿着开口的侧壁，并且优选地是薄层，使得开口被薄绝缘层覆盖。 绝缘开口填充有金属，优选钨或钨合金。 有选择地去除场氧化物。 生长栅极氧化物并形成第一多晶硅层，然后蚀刻以沿着金属/第二绝缘体结构的边缘形成间隔物。 选择性地蚀刻第一多晶硅，并在其上形成隧穿绝缘体层。 在隧道绝缘体上形成第二多晶硅层。

公开(公告)号：US5476801A

公开(公告)日：1995-12-19

申请号：US383090

申请日：1995-02-03

Applicant: Parviz Keshtbod

Inventor： Parviz Keshtbod

IPC: H01L21/336 ,  H01L21/8247 ,  H01L27/115 ,  H01L29/423 ,  H01L29/788 ,  H01L29/792 ,  H01L21/441

CPC classification number: H01L27/11521 ,  H01L27/115 ,  H01L29/4232 ,  H01L29/42324 ,  H01L29/42328 ,  H01L29/66825 ,  H01L29/7883

Abstract: A flash EPROM cell has a reduced cell size by providing vertical coupling between the floating gate and the bit line during programming. The erase operation is done by tunneling of electrons from the sharp tip of the Poly spacer to the control gate. The cell is adapted so that the source for each cell within the array is the source of an adjacent cell and the drain is the drain to another adjacent cell. The cell is formed by forming the drain regions into the substrate through openings in a first insulator that is preferably the field oxide. A second insulator is deposited over the first insulator, over the substrate and along the side walls of the openings and is preferably a thin layer so that the opening is covered with a thin insulating layer. The insulated opening is filled with a first doped polysilicon layer. The field oxide is selectively removed. A gate oxide is grown and a second polysilicon layer is formed and then etched to form spacers along the edges of the first polysilicon/second insulator structure. The second polysilicon is selectively etched and a tunneling insulator layer is formed thereover. A third polysilicon layer is formed over the tunneling insulator.

Abstract translation: 闪存EPROM单元在编程期间通过在浮动栅极和位线之间提供垂直耦合而具有减小的单元尺寸。 擦除操作是通过将电子从Poly间隔物的尖端引导到控制栅极进行的。 单元被适配成使得阵列内的每个单元的源极是相邻单元的源极，漏极是另一相邻单元的漏极。 通过在优选为场氧化物的第一绝缘体中的开口将漏区形成为衬底而形成电池。 第二绝缘体沉积在第一绝缘体上方，在衬底上并且沿着开口的侧壁，并且优选地是薄层，使得开口被薄绝缘层覆盖。 绝缘开口填充有第一掺杂多晶硅层。 有选择地去除场氧化物。 生长栅极氧化物并形成第二多晶硅层，然后蚀刻以沿着第一多晶硅/第二绝缘体结构的边缘形成间隔物。 选择性地蚀刻第二多晶硅，并在其上形成隧穿绝缘体层。 在隧道绝缘体上形成第三多晶硅层。

公开(公告)号：US08802451B2

公开(公告)日：2014-08-12

申请号：US13610587

申请日：2012-09-11

Applicant: Roger Klas Malmhall ,  Kimihiro Satoh ,  Jing Zhang ,  Parviz Keshtbod ,  Rajiv Yadav Ranjan

Inventor： Roger Klas Malmhall ,  Kimihiro Satoh ,  Jing Zhang ,  Parviz Keshtbod ,  Rajiv Yadav Ranjan

IPC: H01L21/00

CPC classification number: H01L43/12 ,  B82Y10/00 ,  B82Y25/00 ,  G11C11/161 ,  H01L27/228

Abstract: Methods of fabricating MTJ arrays using two orthogonal line patterning steps are described. Embodiments are described that use a self-aligned double patterning method for one or both orthogonal line patterning steps to achieve dense arrays of MTJs with feature dimensions one half of the minimum photo lithography feature size (F). In one set of embodiments, the materials and thicknesses of the stack of layers that provide the masking function are selected so that after the initial set of mask pads have been patterned, a sequence of etching steps progressively transfers the mask pad shape through the multiple mask layer and down through all of the MTJ cell layers to the form the complete MTJ pillars. In another set of embodiments, the MTJ/BE stack is patterned into parallel lines before the top electrode layer is deposited.

Abstract translation: 描述使用两个正交线图案化步骤制造MTJ阵列的方法。 描述了使用用于一个或两个正交线图案化步骤的自对准双图案化方法来实现特征尺寸为最小光刻特征尺寸（F）的一半的MTJ的致密阵列的实施例。 在一组实施例中，选择提供掩模功能的层叠层的材料和厚度，使得在初始掩模焊盘组被图案化之后，一系列蚀刻步骤逐渐地将掩模焊盘形状传递通过多个掩模 通过所有的MTJ单元层的层和下层形成完整的MTJ柱。 在另一组实施例中，在沉积顶部电极层之前，将MTJ / BE叠层图案化成平行线。

公开(公告)号：US08536063B2

公开(公告)日：2013-09-17

申请号：US13199490

申请日：2011-08-30

Applicant: Kimihiro Satoh ,  Yiming Huai ,  Jing Zhang ,  Rajiv Yadav Ranjan ,  Parviz Keshtbod ,  Roger K. Malmhall

Inventor： Kimihiro Satoh ,  Yiming Huai ,  Jing Zhang ,  Rajiv Yadav Ranjan ,  Parviz Keshtbod ,  Roger K. Malmhall

IPC: H01L21/302 ,  H01L21/461

CPC classification number: H01L43/12 ,  H01L29/00

Abstract: Various embodiments of the invention relate to etching processes used in fabrication of MTJ cells in an MRAM device. The various embodiments can be used in combination with each other. The first embodiment adds a hard mask buffer layer between a hard mask and a top electrode. The second embodiment uses a multilayered etching hard mask. The third embodiment uses a multilayered top electrode structure including a first Cu layer under a second layer such as Ta. The fourth embodiment is a two-phase etching process used for the bottom electrode to remove re-deposited material while maintaining a more vertical sidewall etching profile. In the first phase the bottom electrode layer is removed using carbonaceous reactive ion etching until the endpoint. In the second phase an inert gas and/or oxygen plasma is used to remove the polymer that was deposited during the previous etching processes.

公开(公告)号：US08535952B2

公开(公告)日：2013-09-17

申请号：US12040827

申请日：2008-02-29

Applicant: Rajiv Yadav Ranjan ,  Parviz Keshtbod ,  Roger Klas Malmhall

Inventor： Rajiv Yadav Ranjan ,  Parviz Keshtbod ,  Roger Klas Malmhall

IPC: H01L21/00

CPC classification number: H01L43/12 ,  B82Y10/00 ,  B82Y25/00 ,  G11C11/16 ,  H01L27/228

Abstract: In accordance with a method of the present invention, a method of manufacturing a magnetic random access memory (MRAM) cell and a corresponding structure thereof are disclosed to include a multi-stage manufacturing process. The multi-stage manufacturing process includes performing a front end on-line (FEOL) stage to manufacture logic and non-magnetic portions of the memory cell by forming an intermediate interlayer dielectric (ILD) layer, forming intermediate metal pillars embedded in the intermediate ILD layer, depositing a conductive metal cap on top of the intermediate ILD layer and the metal pillars, performing magnetic fabrication stage to make a magnetic material portion of the memory cell being manufactured, and performing back end on-line (BEOL) stage to make metal and contacts of the memory cell being manufactured.

Abstract translation: 根据本发明的方法，公开了一种制造磁随机存取存储器（MRAM）单元及其相应结构的方法，以包括多级制造工艺。 多级制造过程包括通过形成中间层间电介质（ILD）层来形成前端在线（FEOL）级来制造存储单元的逻辑和非磁性部分，形成嵌入在中间ILD中的中间金属柱 层，在中间ILD层和金属柱的顶部上沉积导电金属帽，进行磁性制造阶段以制造存储单元的磁性材料部分，并执行后端在线（BEOL）阶段以制造金属 和正在制造的存储单元的触点。

公开(公告)号：US08498150B2

公开(公告)日：2013-07-30

申请号：US13476944

申请日：2012-05-21

Applicant: Rajiv Yadav Ranjan ,  Parviz Keshtbod ,  Roger Klas Malmhall

Inventor： Rajiv Yadav Ranjan ,  Parviz Keshtbod ,  Roger Klas Malmhall

IPC: G11C11/14

CPC classification number: B82Y25/00 ,  B82Y40/00 ,  G11C11/161 ,  H01F10/3236 ,  H01F10/3254 ,  H01F10/3272 ,  H01F41/303 ,  H01L27/228 ,  H01L43/08

Abstract: A non-volatile magnetic memory element includes a number of layers one of which is a free layer which is graded. The graded free layer may include various elements with each element having a different anisotropy or it may include nonmagnetic compounds and magnetic regions with the non-magnetic compounds forming graded contents forming a unique shape such as cone shaped, diamond shaped or other shapes and whose thickness is based on the reactivity of the magnetic compound.

公开(公告)号：US08498149B2

公开(公告)日：2013-07-30

申请号：US13476930

申请日：2012-05-21

Applicant: Rajiv Yadav Ranjan ,  Parviz Keshtbod ,  Roger Klas Malmhall

Inventor： Rajiv Yadav Ranjan ,  Parviz Keshtbod ,  Roger Klas Malmhall

IPC: G11C11/14

CPC classification number: B82Y25/00 ,  B82Y40/00 ,  G11C11/161 ,  H01F10/3236 ,  H01F10/3254 ,  H01F10/3272 ,  H01F41/303 ,  H01L27/228 ,  H01L43/08

Abstract: A non-volatile magnetic memory element includes a number of layers one of which is a free layer which is graded. The graded free layer may include various elements with each element having a different anisotropy or it may include nonmagnetic compounds and magnetic regions with the non-magnetic compounds forming graded contents forming a unique shape such as cone shaped, diamond shaped or other shapes and whose thickness is based on the reactivity of the magnetic compound.