公开(公告)号：US08649177B2

公开(公告)日：2014-02-11

申请号：US13451714

申请日：2012-04-20

Applicant: Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

Inventor： Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

IPC: H05K7/20

CPC classification number: H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

Abstract: A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

Abstract translation: 提供一种制造液冷电子系统的方法，其包括具有电子卡的电子组件和在一端具有闩锁的插座。 闩锁有助于将卡固定在插座内。 该方法包括在插座的一端提供液冷冷轨，以及将电子卡耦合到冷轨的散热器。 热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。 延伸件设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除，而不移除冷轨或散热器。

公开(公告)号：US20140022725A1

公开(公告)日：2014-01-23

申请号：US13587912

申请日：2012-08-16

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: G06F1/20

CPC classification number: H05K7/20836 ,  G05D23/00 ,  H05K7/20281

Abstract: According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools warm air generated by the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat from the rack of information technology equipment.

Abstract translation: 根据一个实施例，用于从信息技术设备的机架移除热量的系统可以包括侧面的室内空气 - 液体热交换器，其冷却由信息技术设备的机架产生的热空气。 该系统还可以包括液体与液体热交换器和室外热交换器。 该系统可以进一步包括可配置的路径，以根据环境温度和/或环境湿度连接和控制通过旁侧热交换器，液体到液体热交换器，信息技术设备的机架和室外热交换器的流体流动，以去除热量 从信息技术设备架构。

公开(公告)号：US20140020885A1

公开(公告)日：2014-01-23

申请号：US13551929

申请日：2012-07-18

Applicant: Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

Inventor： Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

IPC: G05D23/00

CPC classification number: H05K7/20836 ,  G06F1/206

Abstract: A method aspect for removing heat from a data center may use liquid coolant cooled without vapor compression refrigeration on a liquid cooled information technology equipment rack. The method may also include regulating liquid coolant flow to the data center through a range of liquid coolant flow values with a controller-apparatus based upon information technology equipment temperature threshold of the data center.

Abstract translation: 从数据中心去除热量的方法方面可以使用液体冷却剂冷却而不进行蒸气压缩制冷在液冷信息技术设备机架上。 该方法还可以包括通过使用基于数据中心的信息技术设备温度阈值的控制器装置通过一定范围的液体冷却剂流量来调节流向数据中心的液体冷却剂流。

公开(公告)号：US08286855B2

公开(公告)日：2012-10-16

申请号：US13442322

申请日：2012-04-09

Applicant: Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

Inventor： Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

IPC: B23K31/02 ,  B23K31/00

CPC classification number: H05K3/3457 ,  B23K1/0016 ,  B23K3/0638 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338

Abstract: A method are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The fill head and mold are transitioned so that the fill head is situated substantially directly above the mold and so that the plurality of cavities are facing in an upward direction with respect to the sealing member. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 提供了一种将导电接合材料沉积在模具中的空腔中的方法。 填充头被放置成与包括空腔的模具基本接触。 填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。 填充头和模具被过渡，使得填充头基本上位于模具的正上方，并且使得多个空腔相对于密封构件向上的方向面对。 导电接合材料被迫从模具顶端朝向模具。 导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。

公开(公告)号：US07931249B2

公开(公告)日：2011-04-26

申请号：US11670080

申请日：2007-02-01

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: B22D11/00 ,  H05K3/00 ,  H01L21/00

CPC classification number: H05K3/3457 ,  H05K2203/0113

Abstract: A process of reducing friction, which is encountered in molds utilized in injection molded, solder processing, and wherein glass mold plates have mold pits etched therein. The mold pates are subjected to a heat treatment so as to smooth or round-off sharp edges along the periphery of the mold pits.

Abstract translation: 一种降低摩擦的方法，其在注射成型，焊接加工中使用的模具中遇到，并且其中玻璃模板在其中蚀刻有模具凹坑。 对模具进行热处理，以沿着模具凹坑的周边平滑或圆形的锐利边缘。

公开(公告)号：US07751141B2

公开(公告)日：2010-07-06

申请号：US12116175

申请日：2008-05-06

Applicant: German A. Chamorro ,  Michael P. McIntosh ,  Shawn M. Nave ,  Mark D. Schultz ,  Harley C. Witt ,  Raymond Yardy

Inventor： German A. Chamorro ,  Michael P. McIntosh ,  Shawn M. Nave ,  Mark D. Schultz ,  Harley C. Witt ,  Raymond Yardy

IPC: G11B19/02

CPC classification number: G11B15/682 ,  G11B15/689 ,  G11B17/22 ,  G11B17/225 ,  G11B17/228

Abstract: In an automated library, data cartridges, such as magnetic tape cartridges, are stored in storage cells and accessed by data storage drives. An accessor with a gripper transports cartridges between storage cells and storage drives. Cartridges are prioritized according to their relative importance. A processor manages the placement of the cartridges in cells by having higher priority cartridges stored closer to the front of multi-cartridge cells than cartridges with a lower priority. Cartridges with a higher priority may also be stored closer to a storage drive than cartridges with a lower priority. A pusher may be used to push cartridges towards the front of multi-cartridge cells with an empty position to enable the gripper to reach the front cartridge.

Abstract translation: 在自动化库中，数据盒式磁带（如磁带盒）存储在存储单元中，并由数据存储驱动器访问。 具有夹持器的存取器在存储单元和存储驱动器之间传送墨盒。 墨盒根据其相对重要性进行优先排序。 处理器通过将较高优先级的存储盒存储在比多盒单元的前面更靠近具有较低优先级的盒，来管理盒中的盒的放置。 具有较高优先级的墨盒也可以比具有较低优先级的墨盒更靠近存储驱动器。 可以使用推动器将空盒朝向多盒单元的前部推送，以使夹具能够到达前盒。

公开(公告)号：US20090151893A1

公开(公告)日：2009-06-18

申请号：US11956311

申请日：2007-12-13

Applicant: John P. Karidis ,  Mark D. Schultz

Inventor： John P. Karidis ,  Mark D. Schultz

IPC: F28F7/00

CPC classification number: H01L23/473 ,  H01L21/4882 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A method for producing a compliant thermal interface device for cooling an integrated circuit includes steps of: cutting a plurality of high thermal conductivity sheets according to at least one pattern, the sheets made up of a first material; forming spring elements in at least one of the plurality of sheets; coating the sheets with a second material, wherein the second material is different from the first material; stacking the high thermal conductivity sheets; and bonding areas of the stacked sheets using thermo-compression bonding.

Abstract translation: 用于制造用于冷却集成电路的柔性热界面装置的方法包括以下步骤：根据至少一种图案切割多个高导热性片材，所述片材由第一材料制成; 在所述多个片材中的至少一个片材中形成弹簧元件; 用第二材料涂覆片材，其中第二材料不同于第一材料; 堆叠高导热片材; 以及使用热压接合的层叠片材的接合区域。

公开(公告)号：US07545647B2

公开(公告)日：2009-06-09

申请号：US12037067

申请日：2008-02-25

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20 ,  H01L23/36

CPC classification number: H01L23/433 ,  A01H5/02 ,  A01H6/42 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar surface in contact with the electronic device. The structure further includes a plurality of copper spring elements disposed between the solid heat-conducting layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements extend in an upper direction away from the electronic device and wherein the plurality of spring elements include a spring for offering resistance when loaded and wherein the spring elements have a smaller profile at a first end in contact with the electronic device, wherein the profile increases in size at a second end in contact with the solid heat-conducting layer.

Abstract translation: 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的固体导热层。 固体导热层是与电子设备接触的平面。 该结构还包括设置在固体导热层和电子装置之间的多个铜弹簧元件，用于提供来自电子装置的热路径，并且其中多个弹簧元件沿远离电子装置的上方向延伸，并且其中 多个弹簧元件包括用于在加载时提供电阻的弹簧，并且其中弹簧元件在与电子设备接触的第一端处具有较小的轮廓，其中，在与固体热交换器接触的第二端处的轮廓尺寸增大， 导电层。

公开(公告)号：US07518822B1

公开(公告)日：2009-04-14

申请号：US11374190

申请日：2006-03-13

Applicant: John P. Karidis ,  Mark D. Schultz

Inventor： John P. Karidis ,  Mark D. Schultz

IPC: G11B15/68

CPC classification number: G11B15/6835 ,  G11B17/225

Abstract: In an automated library, data cartridges, such as magnetic tape cartridges, are stored in multi-cartridge storage cells or shelves and accessed by data storage drives. An accessor with a deep-reach gripper transports cartridges between storage cells and storage drives. The gripper is capable of extending into the cell to grip and remove a cartridge stored in any position therein. The gripper may include a scissors mechanism, a set of units extendable with lead screws, or another extendable mechanism.

Abstract translation: 在自动化库中，数据盒式磁带（如磁带盒）存储在多盒式存储单元或架子中，并由数据存储驱动器访问。 具有深度夹持器的存取器在存储单元和存储驱动器之间传送墨盒。 夹具能够延伸到电池中以夹持和移除存储在其中任何位置的盒。 夹具可以包括剪刀机构，一组可用导螺杆延伸的单元或另一可延伸机构。

公开(公告)号：US20080298016A1

公开(公告)日：2008-12-04

申请号：US12180711

申请日：2008-07-28

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20

CPC classification number: H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for cooling an electronic device includes forming a spring structure by coupling a plurality of spring elements with a fin portion oriented at an angle, wherein a first end of the fin portion has a narrowed tip; coupling the spring structure with a planar heat-conducting material to form a first heat-conducting layer; positioning the first heat-conducting layer such that the planar heat-conducting material is on top; and placing the first heat-conducting layer over the electronic device such that the fin portion is oriented at an angle toward the electronic device, and such that the narrowed tip of the fin portion is in contact with the top surface of the electronic device.

Abstract translation: 一种用于冷却电子设备的方法包括：通过将多个弹簧元件与一个以一定角度取向的翅片部分联接来形成弹簧结构，其中，翅片部分的第一端具有变窄的尖端; 将弹簧结构与平面导热材料联接以形成第一导热层; 将第一导热层定位成使得平面导热材料位于顶部; 并且将第一导热层放置在电子设备上，使得翅片部分朝向电子设备成一定角度，并且使得翅片部分的变窄的尖端与电子设备的顶表面接触。