公开(公告)号：US5268446A

公开(公告)日：1993-12-07

申请号：US743105

申请日：1991-08-09

申请人： Shoji Tamai ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Shoji Tamai ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  C08G69/26

CPC分类号： C08G73/1071 ,  C08G73/1014

摘要： A readily melt-processable polyimide obtained by reacting diamino-diphenyl ether with 3,3',4,4'-biphenyltetracarboxylic dianhydride in the presence of phthalic anhydride and thermally or chemically imidizing the resultant polyamic acid.

公开(公告)号：US5206438A

公开(公告)日：1993-04-27

申请号：US601424

申请日：1990-10-23

申请人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C07C201/12 ,  C07C205/38 ,  C07C213/02 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/124

摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

公开(公告)号：US5196506A

公开(公告)日：1993-03-23

申请号：US914016

申请日：1992-07-15

申请人： Shoji Tamai ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Shoji Tamai ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  H01L23/29

CPC分类号： H01L23/293 ,  C08G73/105 ,  H01L2924/0002

摘要： A polyimide having a high heat-resistance good processability and recurring structural units of the formula (I): ##STR1## wherein R is a tetravalent radical selected from the group consisting of an aliphatic radical having at least two carbon atoms, alicyclic radical, monocyclic aromatic radical, fused polycyclic aromatic radical and polycyclic aromatic radical bonded through a direct bond or a bridge member.

摘要翻译： 具有高耐热性良好加工性的聚酰亚胺和式（I）的重复结构单元：其中R是选自以下的四价基团：至少具有至少 两个碳原子，脂环族基团，单环芳族基团，稠合多环芳族基团和多环芳族基团通过直接键或桥连接键合。

公开(公告)号：US4839232A

公开(公告)日：1989-06-13

申请号：US69449

申请日：1987-06-25

申请人： Moritsugu Morita ,  Kazuo Miyazaki ,  Akihiro Yamaguchi ,  Masahiro Ohta ,  Shoji Tamai ,  Kunio Nishihara

发明人： Moritsugu Morita ,  Kazuo Miyazaki ,  Akihiro Yamaguchi ,  Masahiro Ohta ,  Shoji Tamai ,  Kunio Nishihara

IPC分类号： B32B15/00 ,  B32B15/08 ,  C08G69/26 ,  C08G73/10 ,  H01B3/30 ,  H05K1/03 ,  H05K3/38

CPC分类号： C08G73/1064 ,  C08G69/265 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1071 ,  H01B3/306 ,  H05K1/0346 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A polyimide film formed by using a symmetrical aromatic meta-substituted primary diamine and a symmetrical aromatic para-substituted primary diamine as raw materials in a specific proportion has excellent heat resistance, electrical properties, flexibility and the like. Such a polyimide film can be bonded to a metal foil not by using any adhesive, but by coating the metal foil with a polyamic acid constituting a precursor of the polyimide and further reacting the polyamic acid to convert it to the polyimide. In this manner, there can be obtained a flexible laminate for printed-circuit board comprising a polyimide film bonded to a metal foil with good adhesion and exhibiting excellent properties as described above.

公开(公告)号：US06531568B1

公开(公告)日：2003-03-11

申请号：US09762260

申请日：2001-04-09

申请人： Atsushi Shibuya ,  Tomomi Okumura ,  Hideaki Oikawa ,  Yoshihiro Sakata ,  Takashi Kuroki ,  Yuichi Okawa ,  Shoji Tamai

发明人： Atsushi Shibuya ,  Tomomi Okumura ,  Hideaki Oikawa ,  Yoshihiro Sakata ,  Takashi Kuroki ,  Yuichi Okawa ,  Shoji Tamai

IPC分类号： C08G7310

CPC分类号： C08G73/10 ,  C08G73/101

摘要： This invention provides crosslinkable-group-containing polyimides of various known thermoplastic polyimide backbone structures, which are provided with far better heat resistance, chemical resistance and mechanical properties than known polyimides of the structures without impairing excellent moldability or formability, superb sliding property, low water absorption property, outstanding electrical properties, high thermal oxidation stability and high radiation resistance, all of which are inherent to the structures.

摘要翻译： 本发明提供了各种已知的热塑性聚酰亚胺骨架结构的含交联性基团的聚酰亚胺，其具有比已知结构的聚酰亚胺更好的耐热性，耐化学性和机械性能，而不损害优异的成型性或成型性，优异的滑动性，低水 吸收性能，优异的电性能，高热氧化稳定性和高耐辐射性，所有这些都是结构固有的。

公开(公告)号：US06458912B1

公开(公告)日：2002-10-01

申请号：US09674916

申请日：2001-02-05

申请人： Takashi Kuroki ,  Yoshihiro Sakata ,  Tomomi Okumura ,  Atsushi Shibuya ,  Yuichi Okawa ,  Hideaki Oikawa ,  Kayako Yanagihara ,  Yasunori Yoshida ,  Masaji Yoshimura ,  Hiroyasu Kido ,  Shoji Tamai

发明人： Takashi Kuroki ,  Yoshihiro Sakata ,  Tomomi Okumura ,  Atsushi Shibuya ,  Yuichi Okawa ,  Hideaki Oikawa ,  Kayako Yanagihara ,  Yasunori Yoshida ,  Masaji Yoshimura ,  Hiroyasu Kido ,  Shoji Tamai

IPC分类号： C08G7300

CPC分类号： C08G73/1042 ,  C08G73/101 ,  C08G73/105

摘要： A thermoplastic polyimide having good thermal stability, comprising a repeating unit represented by the chemical formula (1), a molecular terminal being composed of the chemical formula (2) and/or chemical formula (3), characterized in that: a melt viscosity ratio calculated by the numerical formula (1) and/or the numerical formula (3) is within a numerical range shown in the numerical formula (2) and/or the numerical formula (4) and 1,3-bis(4-aminophenoxy)benzene represented by the chemical formula (3) for production of the above polyimide, characterized in that the content of an azo compound is from 0.0 to 0.2%. The thermoplastic polyimide of the present invention has excellent characteristics {circle around (1)} to {circle around (4)} described below. {circle around (1)} It is superior in thermal stability on melting. That is, the degree of lowering of the fluidity on melting with a lapse of time is small and it is possible to apply to conventional melt molding. {circle around (2)} It has high heat resistance. {circle around (3)} It is superior in productivity. {circle around (4)} It is superior in dimensional accuracy.

摘要翻译： 一种具有良好热稳定性的热塑性聚酰亚胺，其包含由化学式（1）表示的重复单元，由化学式（2）和/或化学式（3）组成的分子末端，其特征在于：熔体粘度比 由式（1）和/或数值式（3）计算的数值在数值式（2）和/或数值式（4）和1,3-双（4-氨基苯氧基） 由化学式（3）表示的用于制备上述聚酰亚胺的苯，其特征在于偶氮化合物的含量为0.0-0.2％。 本发明的热塑性聚酰亚胺具有以下所述的{圆周（1）}〜{圆周（4）}的特性。 {circle around（1）}熔融时的热稳定性优异。 也就是说，随着时间的流逝，熔融流动性的降低程度小，可以适用于常规的熔融成型。 {circle around（2）}它具有很高的耐热性。 {circle around（3）}它的生产力优越。 {circle around（4）}尺寸精度优越。

公开(公告)号：US6103806A

公开(公告)日：2000-08-15

申请号：US216867

申请日：1998-12-21

申请人： Hiroyasu Kido ,  Masaji Yoshimura ,  Yasunori Yoshida ,  Kayako Yanagihara ,  Hideaki Oikawa ,  Shoji Tamai ,  Tomohito Koba

发明人： Hiroyasu Kido ,  Masaji Yoshimura ,  Yasunori Yoshida ,  Kayako Yanagihara ,  Hideaki Oikawa ,  Shoji Tamai ,  Tomohito Koba

IPC分类号： C08L79/08

CPC分类号： C08L79/08

摘要： A polyimide resin composition is disclosed herein which comprises 5 to 60% by weight of a polyimide [polyimide (1)] having a repeating unit represented by the chemical formula 1 and 40 to 95% by weight of a polyimide [polyimide (2)] having a repeating unit represented by the chemical formula 2. According to the present invention, there are provided a polymer alloy in which the advantages of the polyimide (1) and the polyimide (2) are utilized and the disadvantages of the polyimide (1) and the polyimide (2) are reduced; a polyimide resin composition from which crystalline molded articles can be obtained even by a usual molding cycle, for example, an injection molding cycle of about 30 to 60 seconds; and a polyimide resin composition from which molded articles having an excellent dimensional accuracy and flexural modulus can be obtained even by a usual molding cycle, for example, an injection molding cycle of about 30 to 60 seconds, for example, in the case that the molded articles are intended to be used at a high temperature of 230.degree. C. or more, for example, a temperature of 230 to 300.degree. C., or 230 to 250.degree. C.

摘要翻译： 本文公开了一种聚酰亚胺树脂组合物，其包含5至60重量％的具有由化学式1表示的重复单元的聚酰亚胺[聚酰亚胺（1）]和40至95重量％的聚酰亚胺[聚酰亚胺（2）] 具有由化学式2表示的重复单元。根据本发明，提供了使用聚酰亚胺（1）和聚酰亚胺（2）的优点的聚合物合金，并且聚酰亚胺（1） 并且聚酰亚胺（2）被还原; 聚酰亚胺树脂组合物，甚至可以通过通常的成型周期获得结晶模制品，例如约30至60秒的注塑周期; 以及聚酰亚胺树脂组合物，即使在通常的成型周期（例如，注射成型周期为约30〜60秒）下，也可以获得具有优异的尺寸精度和挠曲模量的成型制品，例如在成型 制品应在230℃或更高的高温下使用，例如温度为230-300℃，或230-250℃。

公开(公告)号：US5276133A

公开(公告)日：1994-01-04

申请号：US894346

申请日：1992-06-04

申请人： Yuichi Okawa ,  Shoji Tamai ,  Akihiro Yamaguchi

发明人： Yuichi Okawa ,  Shoji Tamai ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  C08G69/26

CPC分类号： C08G73/10 ,  C08G73/1014

摘要： A favorably processable polyimide which has recurring structural units represented by the formula (I): ##STR1## wherein R is a tetravalent radical having from 2 to 27 carbon atoms and is selected from the group consisting of an aliphatic radical, alicyclic radical, monoaromatic radical, condensed polyaromatic radical and noncondensed aromatic radical connected to each other with a direct bond or a bridge member, and is blocked at the polymer chain end with aromatic dicarboxylic anhydride represented by the formula (II): ##STR2## wherein X is a divalent radical selected from the group consisting of a monoaromatic radical having from 6 to 27 carbon atoms, condensed polyaromatic radical and noncondensed aromatic radical connected to each other with a direct bond or a bridge member.

摘要翻译： 具有由式（I）表示的重复结构单元的有利的可加工聚酰亚胺：（*化学结构*）（I）其中R是具有2至27个碳原子的四价基团，并且选自脂族基团 ，脂环族基团，单芳族基团，缩合多芳族基团和非缩合芳族基团，其与直接键合或桥连构件相互连接，并且在聚合物链端用由式（II）表示的芳族二羧酸酐封闭：（* CHEMICAL 结构*）（II）其中X是选自具有6至27个碳原子的单芳族基团的二价基团，缩合的多芳族基团和未缩合的芳香基团彼此直接连接或桥接成员。

公开(公告)号：US5470943A

公开(公告)日：1995-11-28

申请号：US360584

申请日：1994-12-21

申请人： Yoshihiro Sakata ,  Wataru Yamashita ,  Yuichi Okawa ,  Shoji Tamai ,  Tsutomu Ishida ,  Mitsunori Matsuo ,  Keizaburo Yamaguchi ,  Akihiro Yamaguchi

发明人： Yoshihiro Sakata ,  Wataru Yamashita ,  Yuichi Okawa ,  Shoji Tamai ,  Tsutomu Ishida ,  Mitsunori Matsuo ,  Keizaburo Yamaguchi ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  C08G77/10 ,  C07D213/69 ,  C08G69/26

CPC分类号： C08G73/1039 ,  C08G73/1085

摘要： This invention relates to a novel fluorine-containing polyimide or polyimide copolymer being colorless and having transparency and very low dielectric characteristics, and has a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the polyimide or polyimide copolymer and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition.The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein Ar is a tetravalent radical having 6 to 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed polyaromatic radical having aromatic radicals connected to each other with a direct bond or a bridge member, a trifluoromethyl radical is situated at the 3- or the 4-position on a pyridine nucleus, and an imide nitrogen atom is connected at the 3- or the 4-position to an ether bond.The polyimide or polyimide copolymer has excellent heat resistance, outstanding melt-flow stability and greatly improved processability, and also is colorless and has high transparency and very low dielectric coefficient, and can be expected to be used as raw materials for electric.cndot.electronic appliances and optical instruments due to the above characteristics.

摘要翻译： 本发明涉及一种新颖的含氟聚酰亚胺或聚酰亚胺共聚物，其具有透明性和非常低的介电特性，并且具有用于聚酰亚胺的新型芳族二氨基化合物及其制备方法，该聚酰亚胺系树脂组合物含有聚酰亚胺 或聚酰亚胺共聚物和纤维增强剂，树脂组合物的制备方法，树脂组合物的注塑制品。 聚酰亚胺包含具有一个或多个下式的重复结构单元的必需结构单元：其中Ar是具有6至27个碳原子的四价基团，并且选自单芳族基团，缩合多芳族基团 具有芳族基团的自由基和非缩合多芳族基团彼此直接键合或桥接成员，三氟甲基位于吡啶核上的3-或4-位，酰亚胺氮原子连接在3 - 或4-位到醚键。 聚酰亚胺或聚酰亚胺共聚物具有优异的耐热性，优异的熔体流动稳定性和极好的加工性，并且是无色的，具有高透明度和非常低的介电系数，并且可以预期用作电气电子设备的原料 光学仪器由于上述特点。

公开(公告)号：US4994544A

公开(公告)日：1991-02-19

申请号：US431779

申请日：1989-11-06

申请人： Taizo Nagahiro ,  Masahiro Ohta ,  Shuichi Morikawa ,  Nubohito Koga ,  Shoji Tamai

发明人： Taizo Nagahiro ,  Masahiro Ohta ,  Shuichi Morikawa ,  Nubohito Koga ,  Shoji Tamai

IPC分类号： C08G73/10 ,  D01F6/74

CPC分类号： C08G73/1014 ,  C08G73/105 ,  D01F6/74

摘要： A process for the production of polyimide fibers and polyimide fibers obtained by the process. The process includes thermal or chemical imidation of a polyamic acid which has been obtained by reacting a specific diamine and a particular tetracarboxylic dianhydride in the presence of a dicarboxylic anhydride represented by the following formula: ##STR1## wherein Z represents a divalent group selected from the group consisting of monocyclic aromatic groups, fused polycyclic aromatic groups and non-fused polycyclic aromatic groups with aromatic rings bonded together directly or via a crosslinking member.