公开(公告)号：US4839232A

公开(公告)日：1989-06-13

申请号：US69449

申请日：1987-06-25

申请人： Moritsugu Morita ,  Kazuo Miyazaki ,  Akihiro Yamaguchi ,  Masahiro Ohta ,  Shoji Tamai ,  Kunio Nishihara

发明人： Moritsugu Morita ,  Kazuo Miyazaki ,  Akihiro Yamaguchi ,  Masahiro Ohta ,  Shoji Tamai ,  Kunio Nishihara

IPC分类号： B32B15/00 ,  B32B15/08 ,  C08G69/26 ,  C08G73/10 ,  H01B3/30 ,  H05K1/03 ,  H05K3/38

CPC分类号： C08G73/1064 ,  C08G69/265 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1071 ,  H01B3/306 ,  H05K1/0346 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A polyimide film formed by using a symmetrical aromatic meta-substituted primary diamine and a symmetrical aromatic para-substituted primary diamine as raw materials in a specific proportion has excellent heat resistance, electrical properties, flexibility and the like. Such a polyimide film can be bonded to a metal foil not by using any adhesive, but by coating the metal foil with a polyamic acid constituting a precursor of the polyimide and further reacting the polyamic acid to convert it to the polyimide. In this manner, there can be obtained a flexible laminate for printed-circuit board comprising a polyimide film bonded to a metal foil with good adhesion and exhibiting excellent properties as described above.

公开(公告)号：US4788846A

公开(公告)日：1988-12-06

申请号：US127299

申请日：1987-10-27

申请人： Moritsugu Morita ,  Kazuo Miyazaki

发明人： Moritsugu Morita ,  Kazuo Miyazaki

IPC分类号： B32B15/08 ,  B29C53/18 ,  B65H23/32 ,  B65H23/34 ,  H05K1/00 ,  B21D1/02 ,  B31F1/00 ,  H05K3/00

CPC分类号： H05K1/028 ,  B32B15/08 ,  B32B38/0012 ,  B65H23/32 ,  B65H23/34 ,  B65H2301/33212 ,  H05K2201/0154 ,  H05K2203/0271 ,  Y10T29/49155

摘要： A long flexible metal clad laminate, which has a thin aromatic polyimide film formed on a long metal foil, is caused to slide under tension, along its length, on curved surfaces of four bars arranged at specific positions, so that its curls are corrected and its dimensional stability is improved.

公开(公告)号：US20050165196A1

公开(公告)日：2005-07-28

申请号：US10512064

申请日：2003-05-29

申请人： Jin Kinoshita ,  Moritsugu Morita ,  Minehiro Mori ,  Yoichi Kodama

发明人： Jin Kinoshita ,  Moritsugu Morita ,  Minehiro Mori ,  Yoichi Kodama

IPC分类号： C08G73/10 ,  C08L63/00 ,  C09J7/00 ,  C09J179/08 ,  H01L21/58 ,  C08G77/26

CPC分类号： C09J179/08 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/106 ,  C08L63/00 ,  C08L2666/22 ,  C09J7/10 ,  C09J2203/326 ,  C09J2479/08 ,  H01L24/83 ,  H01L2224/8385 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3512 ,  H01L2924/00

摘要： The adhesive resin of the invention comprises a polyimide resin obtained by reacting a diamine component containing the compound (1) as an essential component with a tetracarboxylic dianhydride component. The diamine component contains a silicone diamine having a specific structure and/or the tetracarboxylic dianhydride component contains a silicone acid dianhydride having a specific structure. Film adhesives made by using the adhesive resin preferably together with a thermosetting resin, and, if necessary, an inorganic filler are excellent in low-temperature adhesion, resistance to moisture absorption, heat resistance, and workability in adhesive adhering and are favorably usable as semiconductor-mounting materials for adhering semiconductor elements to substrates.

摘要翻译： 本发明的粘合树脂包括通过使含有作为必需成分的化合物（1）的二胺成分与四羧酸二酐成分反应得到的聚酰亚胺树脂。 二胺组分含有具有特定结构的硅氧烷二胺和/或四羧酸二酐组分含有具有特定结构的硅酸二酐。 通过使用粘合剂树脂优选与热固性树脂一起制成的胶粘剂，并且如果需要，可以根据需要使用无机填料，粘合剂粘合性低，耐吸湿性，耐热性，加工性优异，有利于半导体 - 用于将半导体元件粘附到基板的安装材料。

公开(公告)号：US07030170B2

公开(公告)日：2006-04-18

申请号：US10301731

申请日：2002-11-22

申请人： Syuji Tahara ,  Etsuo Ohkawado ,  Moritsugu Morita ,  Kazuhito Fujita ,  Takeshi Tsuda

发明人： Syuji Tahara ,  Etsuo Ohkawado ,  Moritsugu Morita ,  Kazuhito Fujita ,  Takeshi Tsuda

IPC分类号： C08F2/46 ,  G03F7/039

CPC分类号： G03F7/038 ,  G03F7/037 ,  Y10S430/107 ,  Y10T428/24917 ,  Y10T428/31721

摘要： A photosensitive resin composition which contains (A) polyamic acid, (B) (meth)acrylate having at least two photopolymerizable C═C unsaturated double bonds, (C) a photopolymerization initiator and (D) a flame retardant, with the (meth)acrylate (B) having at least two photopolymerizable C═C unsaturated double bonds being contained in an amount of 10 to 700 parts by weight based on 100 parts by weight of the polyamic acid (A).

摘要翻译： 一种感光性树脂组合物，其含有（A）聚酰胺酸，（B）具有至少两个光聚合性CC不饱和双键的（甲基）丙烯酸酯，（C）光聚合引发剂和（D）阻燃剂与（甲基）丙烯酸酯 B）相对于聚酰胺酸（A）100重量份，含有10〜700重量份的至少两个光聚合性CC不饱和双键。

公开(公告)号：US5089355A

公开(公告)日：1992-02-18

申请号：US360909

申请日：1989-05-03

申请人： Moritsugu Morita ,  Takushi Sato ,  Shusuke Yamanaka ,  Shunji Yoshida ,  Kenji Tanabe ,  Mitsuyuki Naito ,  Shigeyuki Shishido

发明人： Moritsugu Morita ,  Takushi Sato ,  Shusuke Yamanaka ,  Shunji Yoshida ,  Kenji Tanabe ,  Mitsuyuki Naito ,  Shigeyuki Shishido

IPC分类号： B32B15/08 ,  B32B43/00 ,  H05K1/00 ,  H05K3/06

CPC分类号： B32B43/00 ,  B32B15/08 ,  H05K1/028 ,  H05K2201/0129 ,  H05K2201/0311 ,  H05K2201/0355 ,  H05K2201/051 ,  H05K2201/09118 ,  H05K2203/0271 ,  H05K2203/0353 ,  H05K3/06 ,  Y10T428/12438 ,  Y10T428/12569 ,  Y10T428/31 ,  Y10T428/31678 ,  Y10T428/31681

摘要： An elongated flexible metal clad laminate formed of at least one metal layer and at least one plastic layer and having a smaller interlayer dimensional difference and excellent process-ability. A defect that a dimension of the metal layer is longer than a corresponding dimension of the plastic layer when they are compared to each other as discrete layers has been corrected by causing the metal layer to continually undergo compression plastic deformation in the form of the laminate and hence compressing the metal layer. A production method for the laminate and an apparatus for the method.

摘要翻译： PCT No.PCT / JP88 / 00958 Sec。 371日期：1989年5月3日 102（e）日期1989年5月3日PCT提交1988年9月22日PCT公布。 出版物WO89 / 0282200 日期：1989年4月6日。一种由至少一个金属层和至少一个塑料层形成并且具有较小层间尺寸差异和优异加工性能的细长柔性金属覆层层压板。 通过使金属层不断地以层叠体的形式进行压缩塑性变形，将金属层的尺寸相对于彼此作为离散层进行比较时的尺寸比塑料层的相应尺寸长的缺陷进行了校正 从而压缩金属层。 层压体的制造方法和该方法的装置。

公开(公告)号：US5990553A

公开(公告)日：1999-11-23

申请号：US55232

申请日：1998-04-06

申请人： Moritsugu Morita ,  Hirofumi Tanaka ,  Kazuhito Fujita

发明人： Moritsugu Morita ,  Hirofumi Tanaka ,  Kazuhito Fujita

IPC分类号： H01L23/12 ,  H01L23/13 ,  H01L23/14 ,  H05K1/03 ,  H05K1/05 ,  H01L23/06

CPC分类号： H05K1/056 ,  H01L23/13 ,  H01L23/142 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025

摘要： Polyimide layers having special properties are formed on the bottom surface of a metallic body for a metal-based semiconductor circuit substrate with a polyimide layer as an insulator. There are four lamination methods: (a) a method in which a layer of thermoplastic polyimide resin (1) and a layer of non-thermoplastic polyimide resin are laminated on the bottom surface of the metallic body one over another in this order, (b) a method in which a layer of thermoplastic polyimide resin (1), a layer of non-thermoplastic polyimide resin and a layer of thermoplastic polyimide resin (2) are laminated on the bottom surface of a metallic body one over another in this order, (c) a method in which a layer of non-thermoplastic polyimide resin is laminated on the bottom surface of a metallic body and (d) a method in which a layer of thermoplastic polyimide resin (2) is laminated on the bottom surface of a metallic body. The resulting semiconductor circuit substrate has improved properties: flat joins to connect external terminals, small variations in shape due to temperature changes, the mounting properties to a mother board, the absorption efficiency of infrared rays during solder reflowing, plating resistance and the bonding reliability to other objects.

摘要翻译： 在具有聚酰亚胺层作为绝缘体的金属基半导体电路基板用金属体的底面形成有特殊性质的聚酰亚胺层。 有四种层压方法：（a）将热塑性聚酰亚胺树脂层（1）和非热塑性聚酰亚胺树脂层依次叠层在金属体的底面上的方法（b ）一种方法，其中将一层热塑性聚酰亚胺树脂（1），一层非热塑性聚酰亚胺树脂和一层热塑性聚酰亚胺树脂（2）层叠在金属体的底面上依次依次层叠， （c）在金属体的底面上层叠非热塑性聚酰亚胺树脂层的方法，（d）将热塑性聚酰亚胺树脂（2）层层叠在金属体的底面上的方法 金属体。 所得到的半导体电路基板具有改进的性能：连接外部端子的扁平连接，由于温度变化导致的形状变化小，对母板的安装特性，回流焊时红外线的吸收效率，电镀电阻和接合可靠性 其他对象。

公开(公告)号：US5406124A

公开(公告)日：1995-04-11

申请号：US158417

申请日：1993-11-29

申请人： Moritsugu Morita ,  Kimiteru Tagawa ,  Kenji Abe ,  Naoshi Mineta ,  Takayuki Kubo ,  Shigeo Kiba ,  Etsuo Ohkawado ,  Kenji Tanabe

发明人： Moritsugu Morita ,  Kimiteru Tagawa ,  Kenji Abe ,  Naoshi Mineta ,  Takayuki Kubo ,  Shigeo Kiba ,  Etsuo Ohkawado ,  Kenji Tanabe

IPC分类号： C08G73/10 ,  C09J179/08 ,  H01B3/30 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52 ,  H01L29/60

CPC分类号： C09J179/08 ,  C08G73/1071 ,  H01B3/306 ,  E02B2017/0047 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T428/31681 ,  Y10T428/31721

摘要： An insulating adhesive tape which comprises a base supporting film and an adhesive layer formed on at least one surface thereof, said adhesive layer being formed of a thermoplastic polymer comprising a thermoplastic polyimide, wherein said thermoplastic polymer has a glass transition temperature ranging from 180.degree. C. to 280.degree. C. and an elastic modulus ranging from 10.sup.10 dyne/cm.sup.2 to 10.sup.11 dyne/cm.sup.2 at 25.degree. C., said modulus including a value ranging from 10.sup.2 dyne/cm.sup.2 to 10.sup.9 dyne/cm.sup.2 at a temperature between 250.degree. C. and 300.degree. C.

摘要翻译： 一种绝缘胶带，其包括基底支撑膜和在其至少一个表面上形成的粘合剂层，所述粘合剂层由包含热塑性聚酰亚胺的热塑性聚合物形成，其中所述热塑性聚合物的玻璃化转变温度为180℃ 在25℃下的弹性模量范围为1010达因/厘米2至1011达因/厘米2，所述模量包括在102达因/厘米2至109达因/厘米2的范围内的值，温度为250℃ 和300℃