Spring-loaded heat sink assembly for a circuit assembly
    42.
    发明授权
    Spring-loaded heat sink assembly for a circuit assembly 失效
    用于电路组件的弹簧式散热器组件

    公开(公告)号:US06746270B2

    公开(公告)日:2004-06-08

    申请号:US10602221

    申请日:2003-06-23

    IPC分类号: H01R300

    CPC分类号: H01R12/82 H05K3/325 H05K3/365

    摘要: A spring-loaded heat sink assembly for a circuit assembly, an installation tool, and a method of installation. The assembly comprises a heat sink, a load plate, and at least one leaf spring positioned therebetween. The load plate comprises elongate shafts having an open channel therethrough which extend through the leaf spring(s) and heat sink and at least partially through the circuit assembly. The elongate shafts provide a space for the leaf spring(s) between the heat sink and load plate. Fasteners extend through the elongate shafts to connect the spring-loaded heat sink assembly to the circuit assembly.

    摘要翻译: 用于电路组件的弹簧加载散热器组件,安装工具和安装方法。 组件包括散热器,负载板和位于它们之间的至少一个板簧。 负载板包括细长轴,其具有穿过其的开放通道,其穿过板簧和散热器并且至少部分地穿过电路组件。 细长轴为散热片和负载板之间的板簧提供了一个空间。 紧固件延伸穿过细长轴以将弹簧加载的散热器组件连接到电路组件。

    Heat-activated self-aligning heat sink
    43.
    发明授权
    Heat-activated self-aligning heat sink 失效
    热活化自对准散热片

    公开(公告)号:US06625026B1

    公开(公告)日:2003-09-23

    申请号:US10210000

    申请日:2002-07-31

    IPC分类号: H05K720

    摘要: A heat-activated self-aligning heat sink is built thermally connecting at least one heat-generating devices on a substrate to the heat sink body, where the heat-generating devices may not be co-planar with each other due to tolerance stack-up or parallel with the heat sink body. A pedestal is attached to the substrate to support the heat sink body. A plug or floating pedestal is placed on top of each heat-generating device and held within the pedestal allowing sufficient movement for the bottom surface of the plug to fully contact the top surface of the heat-generating device. A quantity of a low melting temperature, thermally conductive material, such as solder, or a thermally conductive liquid, is placed over each plug and a heat sink body is placed over the assembly. When heated, the thermal material melts, forming a low impedance thermal junction between the plug and the heat sink body regardless of planarity differences between the two devices.

    摘要翻译: 热激活的自对准散热器是将至少一个基板上的发热装置热连接到散热体上,其中发热装置可能由于公差叠加而彼此不共面 或与散热器主体平行。 基座附接到基板以支撑散热体。 插头或浮动底座放置在每个发热装置的顶部并且保持在基座内,允许足够的运动使插塞的底表面完全接触发热装置的顶表面。 将一定数量的低熔点温度的导热材料,例如焊料或导热液体放置在每个塞子上,并将散热器主体放置在组件上。 当加热时,热材料熔化,在插头和散热器本体之间形成低阻抗热连接,而与两个器件之间的平面度差异无关。

    Packaging architecture for 32 processor server
    45.
    发明授权
    Packaging architecture for 32 processor server 有权
    32处理器服务器的包装架构

    公开(公告)号:US06452789B1

    公开(公告)日:2002-09-17

    申请号:US09562593

    申请日:2000-04-29

    IPC分类号: G06F1200

    CPC分类号: G06F15/16

    摘要: The inventive system uses a backplane to interconnect a plurality of modular cell boards. Each cell board comprises a plurality of processors, a processor controller chip, a memory subsystem, and a power subsystem. The processor controller chip manages communications between components on the cell board. A mechanical subassembly provides support for the cell board, as well as ventilation passages for cooling. Controller chips are connected to one side of the backplane, while the cell boards are connected to the other side. The controller chips manage cell board to cell board communications, and communications between the backplane and the computer system. The cell boards are arranged in back to back pairs, with the outer most cell boards having their components extend beyond the height of the backplane. This allows for an increase of spacing between the front to front interface of adjacent cell boards.

    摘要翻译: 本发明的系统使用背板来互连多个模块化单元板。 每个单元板包括多个处理器,处理器控制器芯片,存储器子系统和电源子系统。 处理器控制器芯片管理单元板上的组件之间的通信。 机械子组件为电池板提供支撑,以及用于冷却的通风通道。 控制器芯片连接到背板的一侧,而单元板连接到另一侧。 控制器芯片管理单元板到单元板通信,以及背板和计算机系统之间的通信。 单元板布置成背靠背对,其中最外面的单元板具有其组件延伸超出背板的高度。 这允许相邻电池板的前面与前面之间的间隔增加。

    Cable locking and sealing process for sensor
    47.
    发明授权
    Cable locking and sealing process for sensor 失效
    传感器的电缆锁定和密封过程

    公开(公告)号:US5351388A

    公开(公告)日:1994-10-04

    申请号:US127955

    申请日:1993-09-28

    IPC分类号: G01H1/00 G01P1/00 H01F41/02

    摘要: A sensor has a metal case with a sensing coil at one end and a shielded cable extending from the other. In one use it is placed in proximity to rotating machinery to sense imbalance by position change of the shaft. A pair of suitably sized metal cylinders which are precisely interlocked by dielectric material provides for firm mechanical and electrical connections to the inner and outer conductors of the associated shielded cable. In addition a four step injection molding process provides for accurate and secure location of the sensing coil. And at the same time the entire structure because of the injection molding and associated seals is moisture proof. Other uses include temperature and velocity sensing.In an alternative embodiment only a two-step injection molding process is utilized with a somewhat simplified procedure.

    摘要翻译: 传感器具有在一端具有感测线圈的金属外壳和从另一端延伸的屏蔽电缆。 在一次使用中,它被放置在旋转机械附近,以通过轴的位置变化来感测不平衡。 由电介质材料精确互锁的一对适当尺寸的金属圆筒提供了与相关屏蔽电缆的内导体和外导体的牢固的机械和电连接。 此外,四步注射成型工艺提供了感测线圈的精确和安全的位置。 同时由于注射成型和相关密封,整个结构都是防潮的。 其他用途包括温度和速度检测。 在替代实施例中,仅使用两步注射成型工艺,其程度稍微简化。

    ENCLOSURE POWER DISTRIBUTION ARCHITECTURES

    公开(公告)号:US20130342968A1

    公开(公告)日:2013-12-26

    申请号:US13530466

    申请日:2012-06-22

    IPC分类号: H02B1/26 H05K1/00 H05K5/00

    摘要: Computational enclosures may be designed to distribute power from power supplies to load units (e.g., processors, storage devices, or network routers). The architecture may affect the efficiency, cost, modularity, accessibility, and space utilization of the components within the enclosure. Presented herein are power distribution architectures involving a distribution board oriented along a first (e.g., vertical) axis within the enclosure, comprising a power interconnect configured to distribute power among a set of load boards oriented along a second (e.g., lateral) axis and respectively connecting with a set of load units oriented along a third (e.g., sagittal) axis, and a set of power supplies also oriented along the third axis. This orientation may compactly and proximately position the loads near the power supplies in the distribution system, and result in a comparatively low local current that enables the use of printed circuit boards for the distribution board and load boards.