公开(公告)号：US20080031511A1

公开(公告)日：2008-02-07

申请号：US11869217

申请日：2007-10-09

申请人： Kaoru Sakai ,  Shunji Maeda ,  Takafumi Okabe ,  Hiroshi Goto ,  Masayuki Kuwabara ,  Naoya Takeuchi

发明人： Kaoru Sakai ,  Shunji Maeda ,  Takafumi Okabe ,  Hiroshi Goto ,  Masayuki Kuwabara ,  Naoya Takeuchi

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G06T7/0002 ,  G06T7/32 ,  G06T7/33 ,  G06T2207/30148

摘要： A pattern inspection method including: sequentially imaging plural chips formed on a substrate; selecting a pattern which is suitable for calculating position gap between an inspection image of a subject chip and reference image stored in memory from an image of a firstly imaged chip among said sequentially imaged plural chips formed on the substrate; computing position gap between an inspection image of a chip obtained by the sequential imaging and reference image stored in a memory by using a positional information of a pattern image included in the inspection image and a reference pattern image included in the reference image which are both corresponding to the pattern selected at the selecting; aligning the inspection image and the reference image by using information of the calculated position gap; and comparing the aligned inspection image with the reference image and extracting a difference as a defect candidate.

摘要翻译： 一种图案检查方法，包括：顺序成像形成在基板上的多个芯片; 从形成在所述基板上的所述顺序成像的多个芯片中，选择适合于计算被检体图像的检查图像与存储在存储器中的参考图像之间的位置间隔的图案， 通过使用包括在检查图像中的图案图像的位置信息和包括在参考图像中的参考图案图像来计算通过顺序成像获得的芯片的检查图像和存储在存储器中的参考图像之间的位置间隙， 到选择时选择的图案; 通过使用计算出的位置间隙的信息对准检查图像和参考图像; 并且将对准的检查图像与参考图像进行比较，并提取差异作为缺陷候选。

公开(公告)号：US20070133863A1

公开(公告)日：2007-06-14

申请号：US11548259

申请日：2006-10-10

申请人： Kaoru Sakai ,  Shunji Maeda ,  Takafumi Okabe

发明人： Kaoru Sakai ,  Shunji Maeda ,  Takafumi Okabe

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G01N21/95607 ,  G03F1/84 ,  G06T7/32 ,  G06T2207/30148

摘要： The present invention provides a high-precision alignment method, device and code for inspections that compare an inspection image with a reference image and detect defects from their differences. In one embodiment an inspection image and a reference image are divided into multiple regions. An offset is calculated for each pair of sub-images. Out of these multiple offsets, only the offsets with high reliability are used to determine an offset for the entire image. This allows high-precision alignment with little or no dependency on pattern density or shape, differences in luminance between images, and uneven luminance within individual images. Also, detection sensitivity is adjusted as necessary by monitoring alignment precision.

摘要翻译： 本发明提供了一种用于检查的高精度对准方法，装置和代码，其将检查图像与参考图像进行比较，并从其差异中检测缺陷。 在一个实施例中，检查图像和参考图像被分成多个区域。 为每对子图像计算偏移量。 在这些多个偏移量中，仅使用具有高可靠性的偏移量来确定整个图像的偏移。 这允许对图案密度或形状几乎或不依赖的高精度对准，图像之间的亮度差异以及各个图像内的不均匀亮度。 此外，通过监视对准精度，根据需要调整检测灵敏度。

公开(公告)号：US07127126B2

公开(公告)日：2006-10-24

申请号：US11140350

申请日：2005-05-27

申请人： Kaoru Sakai ,  Shunji Maeda ,  Takafumi Okabe

发明人： Kaoru Sakai ,  Shunji Maeda ,  Takafumi Okabe

IPC分类号： G06K9/32

CPC分类号： G06T7/001 ,  G01N21/95607 ,  G03F1/84 ,  G06T7/32 ,  G06T2207/30148

摘要： The present invention provides a high-precision alignment method, device and code for inspections that compare an inspection image with a reference image and detect defects from their differences. In one embodiment an inspection image and a reference image are divided into multiple regions. An offset is calculated for each pair of sub-images. Out of these multiple offsets, only the offsets with high reliability are used to determine an offset for the entire image. This allows high-precision alignment with little or no dependency on pattern density or shape, differences in luminance between images, and uneven luminance within individual images. Also, detection sensitivity is adjusted as necessary by monitoring alignment precision.

摘要翻译： 本发明提供了一种用于检查的高精度对准方法，装置和代码，其将检查图像与参考图像进行比较，并从其差异中检测缺陷。 在一个实施例中，检查图像和参考图像被分成多个区域。 为每对子图像计算偏移量。 在这些多个偏移量中，仅使用具有高可靠性的偏移量来确定整个图像的偏移。 这允许对图案密度或形状几乎或不依赖的高精度对准，图像之间的亮度差异以及各个图像内的不均匀亮度。 此外，通过监视对准精度，根据需要调整检测灵敏度。

公开(公告)号：US20050147287A1

公开(公告)日：2005-07-07

申请号：US10992759

申请日：2004-11-22

申请人： Kaoru Sakai ,  Shunji Maeda ,  Takafumi Okabe

发明人： Kaoru Sakai ,  Shunji Maeda ,  Takafumi Okabe

IPC分类号： G01B11/30 ,  G01N21/95 ,  G01N21/956 ,  G06K9/00 ,  G06T1/00 ,  G06T7/00 ,  H01L21/66

CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T2207/30148

摘要： The present invention relates to a pattern defect inspection method and apparatus that reveal ultramicroscopic defects on an inspection target in which ultramicroscopic circuit patterns are formed, and inspect the defects with high sensitivity and at a high speed. The present invention provides a pattern inspection apparatus for comparing the images of corresponding areas of two formed patterns that should be identical with each other, and judging any mismatched image area as a defect. The pattern inspection apparatus includes means for performing an image comparison process on a plurality of areas in a parallel manner. Further, the pattern inspection apparatus also includes means for converting the gradation of the image signals of compared images in each of a plurality of different processes. Therefore, the present invention can properly detect defects even if the same patterns of compared images differ in brightness.

摘要翻译： 本发明涉及一种图案缺陷检查方法和装置，其在形成超微电路图案的检查对象上显露超显微缺陷，并以高灵敏度和高速检查缺陷。 本发明提供了一种图案检查装置，用于将两个形成的图案的相应区域的图像进行比较，该图形将彼此相同，并且将任何不匹配的图像区域判断为缺陷。 图案检查装置包括用于以并行方式对多个区域执行图像比较处理的装置。 此外，图案检查装置还包括用于在多个不同处理中的每一个中转换比较图像的图像信号的灰度的装置。 因此，即使相同的比较图像的图案的亮度不同，本发明也可以适当地检测缺陷。

公开(公告)号：US06799130B2

公开(公告)日：2004-09-28

申请号：US10241589

申请日：2002-09-12

申请人： Takafumi Okabe ,  Shunji Maeda ,  Kaoru Sakai

发明人： Takafumi Okabe ,  Shunji Maeda ,  Kaoru Sakai

IPC分类号： G01N3700

CPC分类号： G01N21/95607

摘要： The present invention relates to a tool for analyzing by priority a defect having a high possibility of causing an electrical failure when inspecting a particle and a pattern defect in a piece of work which constitutes an electronic device such as a semiconductor integrated circuit, and relates to a system therefor. On the basis of the result of comparison between defect information which is the result of inspection by an inspection tool and layout data stored in an auxiliary storage device, or on the basis of the result of reinspection by comparison between a defect and a wiring pattern as a background by an inspection processing operation unit, an object to be reviewed is selected using review conditions stored in the auxiliary storage device.

摘要翻译： 本发明涉及一种用于优先分析在检查构成诸如半导体集成电路之类的电子设备的工件中的颗粒和图案缺陷时引起电气故障的可能性高的缺陷的工具， 一个系统。 基于作为检查工具的检查结果的缺陷信息与存储在辅助存储装置中的布局数据之间的比较的结果，或者基于通过比较缺陷和布线图案之间的重新检查的结果， 通过检查处理操作单元的背景，使用存储在辅助存储装置中的检查条件来选择要检查的对象。

公开(公告)号：US06721047B2

公开(公告)日：2004-04-13

申请号：US09944858

申请日：2001-08-31

申请人： Atsushi Shimoda ,  Sachio Uto ,  Minoru Yoshida ,  Shunji Maeda ,  Toshihiko Nakata

发明人： Atsushi Shimoda ,  Sachio Uto ,  Minoru Yoshida ,  Shunji Maeda ,  Toshihiko Nakata

IPC分类号： G01N2100

CPC分类号： G01N21/95684

摘要： The object of the invention is to provide high-sensitivity detection of fine patterns on a transparent inter-layer insulative film and defects on the same layer. Detection is performed with lower-layer patterns and defects on the same layer defocused, thus allowing detection of just the defects from the process that is intended for inspection. An inspection apparatus for a specimen on which a plurality of patterns intended to have identical shapes are arranged in a uniform manner includes: an imaging optical system with a relationship between illumination wavelength and objective lens numerical aperture that provides a resolution of no more than 0.18 microns, or preferably no more than 0.13 microns; an opto-electric converter disposed at an imaging position of the imaging optical system; an auto-focus optical system formed with an optical path disposed separate from the imaging optical system, with illumination applied at an incident angle of at least 85 degrees, preferably at least 88 degrees; means for adjusting a focal position of the imaging optical system based on a detection signal from the auto-focus optical system; and means for processing electronic signals from the opto-electrical converter.

摘要翻译： 本发明的目的是提供在透明层间绝缘膜上的精细图案的高灵敏度检测和同一层上的缺陷。 以相同层上的较低层图案和缺陷进行检测，散焦，从而允许仅检测来自用于检查的过程的缺陷。 用于其上具有相同形状的多个图案的样本的检查装置以均匀的方式布置包括：具有提供不超过0.18微米的分辨率的照明波长和物镜数值孔径之间的关系的成像光学系统 ，或优选不超过0.13微米; 设置在成像光学系统的成像位置处的光电转换器; 形成有与成像光学系统分开设置的光路的自动聚焦光学系统，其入射角至少为85度，优选为至少88度; 用于基于来自所述自动聚焦光学系统的检测信号调整所述成像光学系统的焦点位置的装置; 以及用于处理来自光电转换器的电子信号的装置。

公开(公告)号：US06841403B2

公开(公告)日：2005-01-11

申请号：US10348747

申请日：2003-01-21

申请人： Maki Tanaka ,  Shunji Maeda ,  Minori Noguchi ,  Takafumi Okabe ,  Yuji Takagi ,  Chie Shishido

发明人： Maki Tanaka ,  Shunji Maeda ,  Minori Noguchi ,  Takafumi Okabe ,  Yuji Takagi ,  Chie Shishido

IPC分类号： H01L21/00 ,  H01L21/66 ,  G06F19/00

CPC分类号： H01L21/67276 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a method for manufacturing semiconductor device and a method and apparatus for processing detected defect data, making it possible to quickly infer or determine a process and related manufacturing equipment that causes defects in a fabrication line of semiconductor devices, take remedy action, and achieve a constant and high yield. The method of the invention comprises quantitatively evaluating similarity of a defects distribution on a wafer that suffered abnormal occurrence of defects to inspection results for wafers inspected in the past, analyzing cyclicity of data sequence of evaluated similarity, evaluating relationship between the cyclicity of defects obtained from the analysis and the process method according to each manufacturing equipment in the fabrication line, and inferring or determining a causal process and equipment that caused the defects.

摘要翻译： 本发明公开了一种用于制造半导体器件的方法和用于处理检测到的缺陷数据的方法和装置，使得可以快速推断或确定导致半导体器件制造线中的缺陷的处理和相关制造设备，采取补救措施，以及 实现恒定和高收益。 本发明的方法包括定量评估在异常发生缺陷的晶片上的缺陷分布与以往检查的晶片的检查结果的相似性，分析评估的相似性的数据序列的循环性，评估从 根据制造线上每个制造设备的分析和处理方法，并推断或确定引起缺陷的因果过程和设备。

公开(公告)号：US06797526B2

公开(公告)日：2004-09-28

申请号：US10232871

申请日：2002-08-30

申请人： Maki Tanaka ,  Shunji Maeda ,  Minori Noguchi ,  Takafumi Okabe ,  Yuji Takagi ,  Chie Shishido

发明人： Maki Tanaka ,  Shunji Maeda ,  Minori Noguchi ,  Takafumi Okabe ,  Yuji Takagi ,  Chie Shishido

IPC分类号： H01L2100

CPC分类号： H01L21/67276 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a method for manufacturing semiconductor device and a method and apparatus for processing detected defect data, making it possible to quickly infer or determine a process and related manufacturing equipment that causes defects in a fabrication line of semiconductor devices, take remedy action, and achieve a constant and high yield. The method of the invention comprises quantitatively evaluating similarity of a defects distribution on a wafer that suffered abnormal occurrence of defects to inspection results for wafers inspected in the past, analyzing cyclicity of data sequence of evaluated similarity, evaluating relationship between the cyclicity of defects obtained from the analysis and the process method according to each manufacturing equipment in the fabrication line, and inferring or determining a causal process and equipment that caused the defects.

摘要翻译： 本发明公开了一种用于制造半导体器件的方法和用于处理检测到的缺陷数据的方法和装置，使得可以快速推断或确定导致半导体器件制造线中的缺陷的处理和相关制造设备，采取补救措施，以及 实现恒定和高收益。 本发明的方法包括定量评估在异常发生缺陷的晶片上的缺陷分布与以往检查的晶片的检查结果的相似性，分析评估的相似性的数据序列的循环性，评估从 根据制造线上每个制造设备的分析和处理方法，并推断或确定引起缺陷的因果过程和设备。

公开(公告)号：US07372561B2

公开(公告)日：2008-05-13

申请号：US11139594

申请日：2005-05-31

申请人： Yukihiro Shibata ,  Shunji Maeda ,  Takafumi Okabe ,  Yoichi Takahara

发明人： Yukihiro Shibata ,  Shunji Maeda ,  Takafumi Okabe ,  Yoichi Takahara

IPC分类号： G01N21/00

CPC分类号： H01L21/67253 ,  G01N21/95607 ,  G01N2021/4792 ,  H01L21/67028 ,  H01L21/67057

摘要： The present invention relates to a high-sensitivity defect inspection method, apparatus, and system adapted for the fine-structuring of patterns; wherein, in addition to a cleaning tank which chemically cleans a sample and rinses the sample, a defect inspection apparatus having a liquid-immersion element by which the interspace between the sample and the objective lens of an optical system is filled with a liquid, and a drying tank which dries the sample, the invention uses liquid-immersion transfer means from said cleaning tank through said liquid-immersion means of said defect inspection apparatus to said drying tank so that the sample is transferred in a liquid-immersed state from said cleaning tank to said liquid-immersion means.

摘要翻译： 本发明涉及一种适用于精细构图的高灵敏度缺陷检查方法，装置和系统， 其特征在于，除了对样品进行化学清洗并冲洗样品的清洗槽以外，还具有具有液体浸渍元件的缺陷检查装置，通过该液浸元件将样品与光学系统的物镜之间的间隙填充液体， 干燥箱，干燥箱，将所述清洗槽的浸液转移装置通过所述缺陷检查装置的浸液装置使用于所述干燥箱，使样品以浸液状态从所述清洗 罐到所说的液浸装置。

公开(公告)号：US20050264802A1

公开(公告)日：2005-12-01

申请号：US11139594

申请日：2005-05-31

申请人： Yukihiro Shibata ,  Shunji Maeda ,  Takafumi Okabe ,  Yoichi Takahara

发明人： Yukihiro Shibata ,  Shunji Maeda ,  Takafumi Okabe ,  Yoichi Takahara

IPC分类号： G01N21/88 ,  G01N21/956 ,  H01L21/00 ,  H01L21/66

CPC分类号： H01L21/67253 ,  G01N21/95607 ,  G01N2021/4792 ,  H01L21/67028 ,  H01L21/67057

摘要： The present invention relates to a high-sensitivity defect inspection method, apparatus, and system adapted for the fine-structuring of patterns; wherein, in addition to a cleaning tank which chemically cleans a sample and rinses the sample, a defect inspection apparatus having a liquid-immersion element by which the interspace between the sample and the objective lens of an optical system is filled with a liquid, and a drying tank which dries the sample, the invention uses liquid-immersion transfer means from said cleaning tank through said liquid-immersion means of said defect inspection apparatus to said drying tank so that the sample is transferred in a liquid-immersed state from said cleaning tank to said liquid-immersion means.

摘要翻译： 本发明涉及一种适用于精细构图的高灵敏度缺陷检查方法，装置和系统， 其特征在于，除了对样品进行化学清洗并冲洗样品的清洗槽以外，还具有具有液体浸渍元件的缺陷检查装置，通过该液浸元件将样品与光学系统的物镜之间的间隙填充液体， 干燥箱，干燥箱，将所述清洗槽的浸液转移装置通过所述缺陷检查装置的浸液装置使用于所述干燥箱，使样品以浸液状态从所述清洗 罐到所说的液浸装置。