公开(公告)号：US06841403B2

公开(公告)日：2005-01-11

申请号：US10348747

申请日：2003-01-21

申请人： Maki Tanaka ,  Shunji Maeda ,  Minori Noguchi ,  Takafumi Okabe ,  Yuji Takagi ,  Chie Shishido

发明人： Maki Tanaka ,  Shunji Maeda ,  Minori Noguchi ,  Takafumi Okabe ,  Yuji Takagi ,  Chie Shishido

IPC分类号： H01L21/00 ,  H01L21/66 ,  G06F19/00

CPC分类号： H01L21/67276 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a method for manufacturing semiconductor device and a method and apparatus for processing detected defect data, making it possible to quickly infer or determine a process and related manufacturing equipment that causes defects in a fabrication line of semiconductor devices, take remedy action, and achieve a constant and high yield. The method of the invention comprises quantitatively evaluating similarity of a defects distribution on a wafer that suffered abnormal occurrence of defects to inspection results for wafers inspected in the past, analyzing cyclicity of data sequence of evaluated similarity, evaluating relationship between the cyclicity of defects obtained from the analysis and the process method according to each manufacturing equipment in the fabrication line, and inferring or determining a causal process and equipment that caused the defects.

摘要翻译： 本发明公开了一种用于制造半导体器件的方法和用于处理检测到的缺陷数据的方法和装置，使得可以快速推断或确定导致半导体器件制造线中的缺陷的处理和相关制造设备，采取补救措施，以及 实现恒定和高收益。 本发明的方法包括定量评估在异常发生缺陷的晶片上的缺陷分布与以往检查的晶片的检查结果的相似性，分析评估的相似性的数据序列的循环性，评估从 根据制造线上每个制造设备的分析和处理方法，并推断或确定引起缺陷的因果过程和设备。

公开(公告)号：US06797526B2

公开(公告)日：2004-09-28

申请号：US10232871

申请日：2002-08-30

申请人： Maki Tanaka ,  Shunji Maeda ,  Minori Noguchi ,  Takafumi Okabe ,  Yuji Takagi ,  Chie Shishido

发明人： Maki Tanaka ,  Shunji Maeda ,  Minori Noguchi ,  Takafumi Okabe ,  Yuji Takagi ,  Chie Shishido

IPC分类号： H01L2100

CPC分类号： H01L21/67276 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a method for manufacturing semiconductor device and a method and apparatus for processing detected defect data, making it possible to quickly infer or determine a process and related manufacturing equipment that causes defects in a fabrication line of semiconductor devices, take remedy action, and achieve a constant and high yield. The method of the invention comprises quantitatively evaluating similarity of a defects distribution on a wafer that suffered abnormal occurrence of defects to inspection results for wafers inspected in the past, analyzing cyclicity of data sequence of evaluated similarity, evaluating relationship between the cyclicity of defects obtained from the analysis and the process method according to each manufacturing equipment in the fabrication line, and inferring or determining a causal process and equipment that caused the defects.

摘要翻译： 本发明公开了一种用于制造半导体器件的方法和用于处理检测到的缺陷数据的方法和装置，使得可以快速推断或确定导致半导体器件制造线中的缺陷的处理和相关制造设备，采取补救措施，以及 实现恒定和高收益。 本发明的方法包括定量评估在异常发生缺陷的晶片上的缺陷分布与以往检查的晶片的检查结果的相似性，分析评估的相似性的数据序列的循环性，评估从 根据制造线上每个制造设备的分析和处理方法，并推断或确定引起缺陷的因果过程和设备。

公开(公告)号：US06587581B1

公开(公告)日：2003-07-01

申请号：US09006371

申请日：1998-01-12

申请人： Yukio Matsuyama ,  Yuji Takagi ,  Takashi Hiroi ,  Maki Tanaka ,  Asahiro Kuni ,  Junzou Azuma ,  Shunji Maeda ,  Chie Shishido

发明人： Yukio Matsuyama ,  Yuji Takagi ,  Takashi Hiroi ,  Maki Tanaka ,  Asahiro Kuni ,  Junzou Azuma ,  Shunji Maeda ,  Chie Shishido

IPC分类号： G06K900

CPC分类号： G06T7/001 ,  G01N21/8851 ,  G01N21/95607 ,  G06T5/008 ,  G06T5/40 ,  G06T5/50 ,  G06T7/30 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01J37/222 ,  H01J37/28 ,  H01J2237/2817

摘要： The present invention provides a scanning electron microscope (SEM) or optical inspection method and apparatus which correct differences in brightness between comparison images and thus which is capable of detecting a fine defect with a high degree of reliability without causing any false defect detection. According to the present invention, the brightness values of a pattern, which should be essentially the same, contained in two detected images to be compared are corrected in such a manner that, even if there may be a brightness difference in a portion free from defects, the brightness difference is reduced to such a degree so that it can be recognized as a normal portion. Also, a limit for the amount of correction is furnished in advance, and correction exceeding such limit value is not performed. Such correction prevents the difference in brightness that should be permitted as non-defective from being falsely recognized as a defect without overlooking great differences in brightness due to a defect.

摘要翻译： 本发明提供了一种扫描电子显微镜（SEM）或光学检查方法和装置，其校正比较图像之间的亮度差异，从而能够以高可靠性检测精细缺陷而不引起任何假缺陷检测。 根据本发明，将要被比较的两个检测图像中包含的基本上相同的图案的亮度值以这样的方式进行校正：即使在没有缺陷的部分中可能存在亮度差 ，亮度差降低到这样的程度，从而可以将其识别为正常部分。 此外，预先提供校正量的限制，并且不执行超过该限制值的校正。 这样的校正可以防止由于缺陷而将不允许的亮度差错误地识别为缺陷，而不会因为缺陷而忽略亮度的很大差异。

公开(公告)号：US20120128230A1

公开(公告)日：2012-05-24

申请号：US13362151

申请日：2012-01-31

申请人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

发明人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

摘要： An inspection method, including: illuminating a light on a wafer on which plural chips having identical patterns are formed; imaging corresponding areas of two chips formed on the wafer to obtain inspection images and reference images with an image sensor; and processing the obtained inspection image and the reference image to produce a difference image which indicates a difference between the inspection image and the reference image and detect a defect by comparing the difference image with a threshold, wherein a threshold applied to a difference image which is produced by comparing the inspection image and the reference image obtained by imaging peripheral portion of the wafer is different from a threshold applied to a difference image which is produced by comparing the inspection image and the reference image obtained by imaging central portion of the wafer.

摘要翻译： 一种检查方法，包括：在其上形成有多个具有相同图案的芯片的晶片上照射光; 对形成在晶片上的两个芯片的对应区域进行成像，以获得具有图像传感器的检查图像和参考图像; 并且处理所获得的检查图像和参考图像以产生指示检查图像和参考图像之间的差异的差异图像，并且通过将差异图像与阈值进行比较来检测缺陷，其中应用于差分图像的阈值是 通过比较检查图像和通过对晶片的周边部分进行成像获得的参考图像而产生的参考图像与通过比较检查图像和通过对晶片的中心部分进行成像而获得的参考图像而产生的差分图像的阈值不同。

公开(公告)号：US07274813B2

公开(公告)日：2007-09-25

申请号：US11204181

申请日：2005-08-16

申请人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

发明人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

摘要： A method of inspecting defects of a plurality of patterns that are formed on a substrate to have naturally the same shape. According to this method, in order to detect very small defects of the patterns with high sensitivity without being affected by irregular brightness due to the thickness difference between the patterns formed on a semiconductor wafer, a first pattern being inspected is detected to produce a first image of the first pattern, the first image is stored, a second pattern being inspected is detected to produce a second image of said second pattern, the stored first image and the second image are matched in brightness, and the brightness-matched first and second images are compared with each other so that the patterns can be inspected.

摘要翻译： 检查在基板上形成的具有自然相同形状的多个图案的缺陷的方法。 根据该方法，为了以高灵敏度检测图案的非常小的缺陷，不受由于在半导体晶片上形成的图案之间的厚度差而引起的不规则亮度的影响，检测出被检查的第一图案以产生第一图像 第一图案被存储，检测出被检查的第二图案以产生所述第二图案的第二图像，所存储的第一图像和第二图像的亮度相匹配，并且亮度匹配的第一和第二图像 彼此进行比较，从而可以检查图案。

公开(公告)号：US07916929B2

公开(公告)日：2011-03-29

申请号：US12359452

申请日：2009-01-26

申请人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

发明人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

摘要： A method of inspecting patterns, including: adjusting a brightness of at least one of a first bright field image and a second bright field image detected from a specimen and directed to similar patterns on differing parts of the specimen, so as to more closely match a brightness; comparing the images which are adjusted in brightness to match with each other to detect dissimilarities indicative of a defect of the pattern, wherein in adjusting the brightness, the brightness between the first bright field image and the second bright field image is adjusted by performing a gradation conversion of at least one of the brightness between the first bright field image and the second bright field image; and wherein in the comparing, said defect of the pattern is detected by using information of a scattered diagram of brightness of the first bright field image and the second bright field image.

摘要翻译： 一种检查图案的方法，包括：调整从样本检测到的第一明视野图像和第二亮视场图像中的至少一个的亮度，并且针对样本的不同部分上的相似图案，以便更紧密地匹配 亮度; 将亮度调整后的图像进行比较以相互匹配，以检测表示图案缺陷的不相似性，其中在调整亮度时，通过执行渐变来调整第一亮场图像和第二亮视场图像之间的亮度 第一亮场图像和第二亮场图像之间的亮度中的至少一个的转换; 并且其中在所述比较中，通过使用所述第一亮场图像和所述第二亮视场图像的亮度的散射图的信息来检测所述图案的所述缺陷。

公开(公告)号：US20090214102A1

公开(公告)日：2009-08-27

申请号：US12359452

申请日：2009-01-26

申请人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

发明人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

摘要： A method of inspecting patterns, including: adjusting a brightness of at least one of a first bright field image and a second bright field image detected from a specimen and directed to similar patterns on differing parts of the specimen, so as to more closely match a brightness; comparing the images which are adjusted in brightness to match with each other to detect dissimilarities indicative of a defect of the pattern, wherein in adjusting the brightness, the brightness between the first bright field image and the second bright field image is adjusted by performing a gradation conversion of at least one of the brightness between the first bright field image and the second bright field image; and wherein in the comparing, said defect of the pattern is detected by using information of a scattered diagram of brightness of the first bright field image and the second bright field image.

摘要翻译： 一种检查图案的方法，包括：调整从样本检测到的第一明视野图像和第二亮视场图像中的至少一个的亮度，并指示到样本的不同部分上的相似图案，以便更紧密地匹配 亮度; 将亮度调整后的图像进行比较以相互匹配，以检测表示图案缺陷的不相似性，其中在调整亮度时，通过执行渐变来调整第一亮场图像和第二亮视场图像之间的亮度 第一亮场图像和第二亮场图像之间的亮度中的至少一个的转换; 并且其中在所述比较中，通过使用所述第一亮场图像和所述第二亮视场图像的亮度的散射图的信息来检测所述图案的所述缺陷。

公开(公告)号：US20080101685A1

公开(公告)日：2008-05-01

申请号：US11858215

申请日：2007-09-20

申请人： Shunji MAEDA ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

发明人： Shunji MAEDA ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

摘要： A method of inspecting patterns to detect a defect of the patterns by using information of a scattered diagram of brightness of said first and second images.

摘要翻译： 通过使用所述第一和第二图像的亮度的散射图的信息来检查图案以检测图案的缺陷的方法。

公开(公告)号：US06947587B1

公开(公告)日：2005-09-20

申请号：US09294137

申请日：1999-04-20

申请人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

发明人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

IPC分类号： G01N21/95 ,  G01N21/956 ,  G06K9/00 ,  G06T7/00

CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

摘要： A method of inspecting defects of a plurality of patterns that are formed on a substrate to have naturally the same shape. According to this method, in order to detect very small defects of the patterns with high sensitivity without being affected by irregular brightness due to the thickness difference between the patterns formed on a semiconductor wafer, a first pattern being inspected is detected to produce a first image of the first pattern, the first image is stored, a second pattern being inspected is detected to produce a second image of said second pattern, the stored first image and the second image are matched in brightness, and the brightness-matched first and second images are compared with each other so that the patterns can be inspected.

摘要翻译： 检查在基板上形成的具有自然相同形状的多个图案的缺陷的方法。 根据该方法，为了以高灵敏度检测图案的非常小的缺陷，不受由于在半导体晶片上形成的图案之间的厚度差而引起的不规则亮度的影响，检测出被检查的第一图案以产生第一图像 第一图案被存储，检测出被检查的第二图案以产生所述第二图案的第二图像，所存储的第一图像和第二图像的亮度相匹配，并且亮度匹配的第一和第二图像 彼此进行比较，从而可以检查图案。

公开(公告)号：US08107717B2

公开(公告)日：2012-01-31

申请号：US13072102

申请日：2011-03-25

申请人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

发明人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

摘要： Arrangements for inspecting a specimen on which plural patterns are formed; capturing a first image of a first area; capturing a second image of a second area in which patterns which are essentially the same with the patterns formed in the first area; creating data relating to corresponding pixels of the first and second images, for each pixel; determining a threshold for each pixel for detecting defects directly in accordance with the first and second images; and detecting defects on the specimen by processing the first and second images by using the threshold for each pixel and information of a scattered diagram of brightness of the first and second images, wherein the threshold is determined by using information of brightness of a local region of at least one of the first and second images, with the local region including an aimed pixel and peripheral pixels of the aimed pixel.

摘要翻译： 用于检查形成多个图案的样本的布置; 捕获第一区域的第一图像; 捕获与形成在第一区域中的图案基本上相同的图案的第二区域的第二图像; 为每个像素创建与第一和第二图像的相应像素有关的数据; 根据第一和第二图像确定用于检测缺陷的每个像素的阈值; 以及通过使用每个像素的阈值和第一和第二图像的亮度的散射图的信息来处理第一和第二图像来检测样本上的缺陷，其中，通过使用第一和第二图像的局部区域的亮度的信息来确定阈值 第一和第二图像中的至少一个，其中局部区域包括目标像素和目标像素的外围像素。