公开(公告)号：US20150381156A1

公开(公告)日：2015-12-31

申请号：US14318857

申请日：2014-06-30

申请人： Sebastian Sievert ,  Assaf Ben-Bassat ,  Ofir Degani ,  Rotem Banin

发明人： Sebastian Sievert ,  Assaf Ben-Bassat ,  Ofir Degani ,  Rotem Banin

IPC分类号： H03K5/1252 ,  H04B15/00

CPC分类号： H03K5/1252 ,  H03K5/135 ,  H03L7/081 ,  H03L7/0814 ,  H03L7/0995 ,  H03L7/0998

摘要： This application discusses, among other things, an interpolator architecture for digital-to-time converters (DTCs). In an example, an interpolator can include interpolation cells and retention cells configured provide an interpolated output based on at least two offset clock signals. In certain examples, an example interpolator can provide contention free control of the interpolator output with improved noise immunity.

摘要翻译： 此应用程序除了其他内容之外还讨论了数字时间转换器（DTC）的内插器架构。 在一个示例中，内插器可以包括内插单元和配置的保持单元基于至少两个偏移时钟信号提供内插输出。 在某些示例中，示例性内插器可以提供具有改进的抗噪声能力的内插器输出的无竞争力控制。

公开(公告)号：US09093950B2

公开(公告)日：2015-07-28

申请号：US13997592

申请日：2011-12-19

申请人： Ori Ashckenazi ,  Rotem Banin ,  Ofir Degani

发明人： Ori Ashckenazi ,  Rotem Banin ,  Ofir Degani

IPC分类号： H04B1/38 ,  H03B5/12

CPC分类号： H03B5/1212 ,  H03B5/1228 ,  H03B5/124 ,  H03B5/1243 ,  H03B5/1265 ,  H03B5/1296

摘要： Embodiments provide a voltage controlled oscillator (VCO) having reduced single-ended capacitance. In one embodiment, the VCO may include a transformer, a capacitor bank, and a gain stage. The transformer may include a primary inductor and a secondary inductor, and the secondary inductor may be inductively coupled to the primary inductor. The capacitor bank may be coupled to the secondary inductor and may provide a majority of a total capacitance of the VCO. The gain stage may be coupled to the primary inductor and configured to receive a supply signal and to drive a differential current in the primary inductor, thereby inducing an output signal across the secondary inductor having a frequency equal to a resonant frequency of the VCO.

摘要翻译： 实施例提供具有减小的单端电容的压控振荡器（VCO）。 在一个实施例中，VCO可以包括变压器，电容器组和增益级。 变压器可以包括初级电感器和次级电感器，并且次级电感器可以感应耦合到初级电感器。 电容器组可以耦合到次级电感器并且可以提供VCO的总电容的大部分。 增益级可以耦合到主电感器并且被配置为接收电源信号并驱动初级电感器中的差分电流，从而在频率等于VCO的谐振频率的次级电感器两端产生输出信号。

公开(公告)号：US20140176368A1

公开(公告)日：2014-06-26

申请号：US13721245

申请日：2012-12-20

申请人： Telesphor Kamgaing ,  Valluri R. Rao ,  Ofir Degani

发明人： Telesphor Kamgaing ,  Valluri R. Rao ,  Ofir Degani

IPC分类号： H01Q1/38 ,  H01P11/00

CPC分类号： H01Q9/045 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01P11/00 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/526 ,  H01Q21/0006 ,  Y10T29/49018

摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.

摘要翻译： 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法和结构可以包括形成包括设置在设备的背侧的分立天线的封装结构，其中分立天线包括天线基板，通过天线基板垂直设置的通过天线基板。 垂直设置在器件内的穿通器件衬底通孔经由天线衬底与封装衬底耦合，并且封装衬底与器件的有源侧耦合。

公开(公告)号：US20120129468A1

公开(公告)日：2012-05-24

申请号：US12949008

申请日：2010-11-18

申请人： Tzvi Maimon ,  Ofir Degani

发明人： Tzvi Maimon ,  Ofir Degani

IPC分类号： H04B1/38

CPC分类号： H04B1/48 ,  H04B1/0458 ,  H04B1/18 ,  H04B1/44 ,  H04W88/06

摘要： An apparatus comprises a transmit network to transmit an input from a first amplifier to an antenna, a receive network to provide an input from an antenna to a second amplifier, a first switch to selectively decouple the transmit network from the antenna, and a second switch to selectively decouple the receive network from the antenna. Other embodiments may be described.

摘要翻译： 一种装置包括：传输网络，用于将输入从第一放大器传输到天线;接收网络，用于提供从天线到第二放大器的输入;第一开关，用于选择性地将发射网络与天线分离;以及第二开关 以选择性地将接收网络与天线分离。 可以描述其他实施例。

公开(公告)号：US20090322427A1

公开(公告)日：2009-12-31

申请号：US12164219

申请日：2008-06-30

申请人： Ofir Degani ,  Mark Ruberto

发明人： Ofir Degani ,  Mark Ruberto

IPC分类号： H03F3/45

CPC分类号： H03F3/45188 ,  H01L23/66 ,  H01L24/48 ,  H01L2223/6638 ,  H01L2223/6644 ,  H01L2223/6655 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3011 ,  H03F3/195 ,  H03F3/245 ,  H03F2203/45386 ,  H03F2203/45464 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated CMOS power amplifier system to improve amplifier performance, the integrated CMOS power amplifier system including a plurality of differential main amplifier cores, a plurality of ground pads, and a plurality of routes to connect the plurality of differential main amplifier cores to the plurality of ground pads. Each differential main amplifier core includes a pair of collocated main amplifier core transistors. Each ground pad is connected to a subset of the differential main amplifier cores. Embodiments of the integrated CMOS power amplifier system decrease parasitic inductance to ground and increase the transconductance and amplification of the integrated CMOS power amplifier system, thus improving performance.

摘要翻译： 一种用于提高放大器性能的集成CMOS功率放大器系统，包括多个差分主放大器核心，多个接地焊盘以及将多个差分主放大器核连接到多个接地焊盘的多条路线的集成CMOS功率放大器系统 接地垫 每个差分主放大器核心包括一对并置的主放大器核心晶体管。 每个接地焊盘连接到差分主放大器核心的子集。 集成CMOS功率放大器系统的实施例减小对地的寄生电感，并增加集成CMOS功率放大器系统的跨导和放大，从而提高性能。