公开(公告)号：US11803190B2

公开(公告)日：2023-10-31

申请号：US17348327

申请日：2021-06-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Hun Lee ,  Young Do Kwon ,  Heum Yong Park ,  Min Jae Kim ,  Min Woo Ryu

IPC: B25J19/02 ,  G05D1/02 ,  B25J9/16 ,  B25J9/00 ,  B25J11/00 ,  A47L9/28 ,  A47L9/00 ,  A47L9/30 ,  A47L11/40

CPC classification number: G05D1/024 ,  A47L9/009 ,  A47L9/2805 ,  A47L9/2852 ,  A47L9/30 ,  A47L11/4011 ,  A47L11/4061 ,  B25J9/00 ,  B25J9/16 ,  B25J11/00 ,  B25J11/0085 ,  B25J19/02 ,  B25J19/022 ,  G05D1/02 ,  A47L2201/04

Abstract: Provided are a cleaning robot and a method of controlling the same, and more specifically, a cleaning robot provided to detect an obstacle in various directions and a method of controlling the same. The cleaning robot includes a light emitter configured to radiate light, a plurality of light receivers configured to receive a radiation of the light in a predetermined direction among radiations of the light reflected from an obstacle when the radiated light is reflected from the obstacle, a support plate to which the light emitter and the light receiver are fixed and which is rotatably provided, and a controller configured to detect the obstacle on the basis of output signals transmitted from the light emitter and the plurality of light receivers and rotation information of the support plate.

公开(公告)号：US11640973B2

公开(公告)日：2023-05-02

申请号：US17508197

申请日：2021-10-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung Gil Yang ,  Dong Il Bae ,  Chang Woo Sohn ,  Seung Min Song ,  Dong Hun Lee

IPC: H01L29/06 ,  H01L21/8234 ,  H01L29/66 ,  H01L29/08 ,  H01L21/8238 ,  H01L27/088 ,  H01L29/165 ,  H01L29/10 ,  H01L27/092 ,  H01L27/02 ,  H01L29/423 ,  H01L29/78 ,  H01L29/786

Abstract: A semiconductor device and a fabricating method thereof are provided. The semiconductor device includes a substrate, a first nanowire spaced apart from a first region of the substrate, a first gate electrode surrounding a periphery of the first nanowire, a second nanowire spaced apart from a second region of the substrate and extending in a first direction and having a first width in a second direction intersecting the first direction, a supporting pattern contacting the second nanowire and positioned under the second nanowire, and a second gate electrode extending in the second direction and surrounding the second nanowire and the supporting pattern.

公开(公告)号：US11164943B2

公开(公告)日：2021-11-02

申请号：US16928439

申请日：2020-07-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung Gil Yang ,  Dong Il Bae ,  Chang Woo Sohn ,  Seung Min Song ,  Dong Hun Lee

IPC: H01L29/06 ,  H01L29/66 ,  H01L29/08 ,  H01L21/8238 ,  H01L21/8234 ,  H01L27/088 ,  H01L29/165 ,  H01L29/10 ,  H01L27/092 ,  H01L27/02 ,  H01L29/423 ,  H01L29/78 ,  H01L29/786

Abstract: A semiconductor device and a fabricating method thereof are provided. The semiconductor device includes a substrate, a first nanowire spaced apart from a first region of the substrate, a first gate electrode surrounding a periphery of the first nanowire, a second nanowire spaced apart from a second region of the substrate and extending in a first direction and having a first width in a second direction intersecting the first direction, a supporting pattern contacting the second nanowire and positioned under the second nanowire, and a second gate electrode extending in the second direction and surrounding the second nanowire and the supporting pattern.

公开(公告)号：US11152304B2

公开(公告)日：2021-10-19

申请号：US16580153

申请日：2019-09-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong Hun Lee ,  Sang Jin Lee ,  Min-Sek Jang

IPC: H01L23/528 ,  H01L23/522 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor package includes a frame including wiring layers and having a recess portion in which a stopper layer is disposed on a bottom surface, a semiconductor chip having an active surface and an inactive surface, the inactive surface being disposed in the recess portion and facing the stopper layer, a first connection portion on the connection pad, a second connection portion on the uppermost wiring layer, a stiffener on the upper surface of the frame and surround at least a portion of the second connection portion, the stiffener being spaced apart from second connection portion, an encapsulant covering at least portions of each of the frame and the semiconductor chip, and filling at least a portion of the recess portion, and a connection structure on the frame and the semiconductor chip, and including a redistribution layer electrically connected to the first and second connection portions.

公开(公告)号：US10972693B2

公开(公告)日：2021-04-06

申请号：US16727571

申请日：2019-12-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Hong Kim ,  Seung Hyun Lim ,  Han Kook Cho ,  Dong Hun Lee ,  Seog Heon Ham

IPC: H04N5/374 ,  H04N5/3745 ,  H04N5/365 ,  H04N5/378

Abstract: An image sensor and an image processing system including the same are provided. The image sensor includes a pixel array including a plurality of pixels each connected to one of first through m-th column lines to output a pixel signal, where “m” is an integer of at least 2; analog-to-digital converters each configured to receive the pixel signal corresponding to one of the first through m-th column lines, to compare the pixel signal with a ramp signal, and to convert the pixel signal to a digital pixel signal; and a blocking circuit connected to an input terminal of at least one of the analog-to-digital converters to block an influence of an operation of others among the analog-to-digital converters.

公开(公告)号：US10756179B2

公开(公告)日：2020-08-25

申请号：US16423641

申请日：2019-05-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung Gil Yang ,  Dong Il Bae ,  Chang Woo Sohn ,  Seung Min Song ,  Dong Hun Lee

IPC: H01L29/06 ,  H01L21/8234 ,  H01L29/66 ,  H01L29/08 ,  H01L21/8238 ,  H01L27/088 ,  H01L29/165 ,  H01L29/10 ,  H01L27/092 ,  H01L27/02 ,  H01L29/423 ,  H01L29/78 ,  H01L29/786

Abstract: A semiconductor device and a fabricating method thereof are provided. The semiconductor device includes a substrate, a first nanowire spaced apart from a first region of the substrate, a first gate electrode surrounding a periphery of the first nanowire, a second nanowire spaced apart from a second region of the substrate and extending in a first direction and having a first width in a second direction intersecting the first direction, a supporting pattern contacting the second nanowire and positioned under the second nanowire, and a second gate electrode extending in the second direction and surrounding the second nanowire and the supporting pattern.

公开(公告)号：US20200185296A1

公开(公告)日：2020-06-11

申请号：US16791031

申请日：2020-02-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong Hun Lee

IPC: H01L23/31 ,  H01L23/498 ,  H01L25/18 ,  H01L25/10 ,  H01L25/16 ,  H01L23/00 ,  H01L23/16

Abstract: A semiconductor package including an organic interposer includes: the organic interposer including insulating layers and wiring layers formed on the insulating layers; a stiffener disposed on the interposer and having a through-hole; a first semiconductor chip disposed in the organic through-hole on the organic interposer; a second semiconductor chips disposed adjacent to the first semiconductor chip in the through-hole on the organic interposer; and an underfill resin filling at least portions of the through-hole and fixing the first semiconductor chip and the second semiconductor chip, wherein the connection pads of the first semiconductor chip and the second semiconductor chip are electrically connected to each other through the wiring layers of the organic interposer.

公开(公告)号：US10646086B2

公开(公告)日：2020-05-12

申请号：US15782783

申请日：2017-10-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min Woo Ryu ,  Dong Hun Lee ,  Jae Yoon Jeong ,  Young Do Kwon

IPC: A47L9/28 ,  G05D1/02 ,  H04B17/318 ,  A47L5/30

Abstract: Embodiments of the present disclosure relate to a cleaning robot and a method of controlling the same, and more particularly, to a cleaning robot docking to a station based on a radio frequency (RF) signal and a method of controlling the same.An aspect of the present disclosure, there is provided a cleaning robot comprising a cleaning robot antenna unit configured to receive a radio frequency (RF) signal transmitted from a station; and a controller configured to extract a received signal strength indicator (RSSI) value by processing the RF signal received by the cleaning robot antenna unit and control movement of the cleaning robot to dock to the station based on the extracted RSSI value.

公开(公告)号：US10542859B2

公开(公告)日：2020-01-28

申请号：US15548008

申请日：2016-02-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Hyun Lee ,  In Joo Kim ,  Dong Min Shin ,  Jeong Ki Yoo ,  Dong Hun Lee ,  Ji Won Chun

IPC: A47L9/28 ,  A47L5/22 ,  A47L9/00 ,  A47L9/04 ,  B25J9/00 ,  B25J19/04 ,  G05D1/02 ,  G06K9/00 ,  H04N5/225

Abstract: Disclosed is a cleaning robot for creating a 3Dimensional (3D) obstacle map including information about a height of an object existing on an area to be cleaned, and cleaning the area to be cleaned based on the 3D obstacle map, and a method of controlling the cleaning robot. In accordance with an aspect of the present disclosure, there is provided. The cleaning robot includes a main body, a moving portion configured to move the main body, an obstacle sensor configured to sense a height of an obstacle, and a controller configured to create an obstacle map including information about the height of the obstacle.

公开(公告)号：US10405720B2

公开(公告)日：2019-09-10

申请号：US15302416

申请日：2015-03-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heum Yong Park ,  Sung Jin Park ,  Dong Hun Lee ,  Shin Kim

IPC: A47L9/32 ,  A47L5/28 ,  A47L5/30

Abstract: In accordance with one aspect of the present invention, a cleaner includes a gravity compensation apparatus for applying compensation force to a handle unit, the gravity compensation apparatus having an elastic member connected to one side of the handle unit to generate compensation force and a sliding member for making translational movement in conjunction with turning motion of the handle unit to keep the compensation force in a constant direction regardless of an angle of the handle unit. The torque due to gravity applied to a handle unit of a vacuum cleaner may be precisely compensated, thereby relieving the burden of the user from the weight of the handle unit while the user holds the handle unit for cleaning.