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    Ink jet recording apparatus, and method for controlling recording head temperature
    41.
    发明授权
    Ink jet recording apparatus, and method for controlling recording head temperature 有权
    喷墨记录装置，以及用于控制记录头温度的方法

    公开(公告)号：US08038249B2

    公开(公告)日：2011-10-18

    申请号：US11693457

    申请日：2007-03-29

    申请人： Satoshi Hayashi ,  Yasunori Fujimoto ,  Jun Shimoji

    发明人： Satoshi Hayashi ,  Yasunori Fujimoto ,  Jun Shimoji

    IPC分类号： B41J29/38

    CPC分类号： B41J2/0458 ,  B41J2/04541 ,  B41J2/04563

    摘要： An ink jet recording apparatus for effecting recording using a recording head for ejecting ink, the ink jet recording apparatus including a heating section for heating the recording head, a detecting unit for detecting a temperature of the recording head, a setting unit for setting a target temperature of the recording head, and a controller for controlling the target temperature of the recording head at or above the target temperature. The controller controls the temperature by heating control for heating the recording head and by diffusing control for diffusing the heat supplied by the heating control.

    摘要翻译： 一种用于使用用于喷射墨水的记录头进行记录的喷墨记录装置，该喷墨记录装置包括用于加热记录头的加热部分，用于检测记录头的温度的检测单元，用于设定目标的设定单元 记录头的温度，以及用于在目标温度以上控制记录头的目标温度的控制器。 控制器通过加热控制来控制温度，以加热记录头，并且通过扩散控制以扩散由加热控制提供的热量。

    Ic Chip Manufacturing Method
    42.
    发明申请
    Ic Chip Manufacturing Method 审中-公开
    Ic芯片制造方法

    公开(公告)号：US20080314507A1

    公开(公告)日：2008-12-25

    申请号：US11658880

    申请日：2004-08-02

    申请人： Munehiro Hatai ,  Satoshi Hayashi ,  Masateru Fukuoka ,  Shigeru Danjo ,  Yasuhiko Oyama ,  Kazuhiro Shimomura ,  Daihei Sugita ,  Yoshikazu Kitajima

    发明人： Munehiro Hatai ,  Satoshi Hayashi ,  Masateru Fukuoka ,  Shigeru Danjo ,  Yasuhiko Oyama ,  Kazuhiro Shimomura ,  Daihei Sugita ,  Yoshikazu Kitajima

    IPC分类号： B32B38/10

    CPC分类号： C09J5/00 ,  C08K5/23 ,  C09J5/08 ,  C09J7/38 ,  C09J7/385 ,  C09J2201/128 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/302 ,  C09J2433/00 ,  H01L21/67115

    摘要： It is an object of the invention to provide a method for producing an IC chip capable of producing an IC chip with a thickness as extremely thin as 50 μm or thinner, for example, about 25 to 30 μm at a high productivity.The invention is a method for producing an IC chip, which comprises; at least a step 1 of fixing a wafer in a support plate by sticking the wafer to the gas generating agent-containing face of a pressure sensitive adhesive double-faced tape having a pressure sensitive adhesive layer containing a gas generating agent for generating a gas by light radiation in at least one face; a step 2 of grinding the wafer in a state of being fixed in the support plate through the pressure sensitive adhesive double-faced tape; a step 3 of radiating light to the pressure sensitive adhesive double-faced tape; and a step 4 of separating the pressure sensitive adhesive double-faced tape from the wafer, a gas releasing speed from the pressure sensitive adhesive double-faced tape being 5 L/cm2·min or higher in the step 3.

    摘要翻译： 本发明的目的是提供一种制造IC芯片的方法，所述IC芯片能够以高生产率制造厚度极薄至50μm或更薄，例如约25至30μm的IC芯片。 本发明是一种制造IC芯片的方法，包括： 至少步骤1，通过将晶片粘贴到具有压敏粘合剂层的压敏粘合剂双面胶带的气体发生剂含有面上，将晶片固定在支撑板中，该压敏粘合剂层含有用于产生气体的气体发生剂 至少一面的光辐射; 在通过压敏双面胶带固定在支撑板上的状态下研磨晶片的步骤2; 向压敏胶双面胶带照射光的步骤3; 以及在步骤3中将压敏粘合剂双面胶带从晶片分离的步骤4，压敏粘合剂双面胶带的气体释放速度为5L / cm2.min以上。

    Method for manufacturing semiconductor chip
    43.
    发明授权
    Method for manufacturing semiconductor chip 有权
    制造半导体芯片的方法

    公开(公告)号：US07335578B2

    公开(公告)日：2008-02-26

    申请号：US10490557

    申请日：2003-04-09

    申请人： Masateru Fukuoka ,  Munehiro Hatai ,  Satoshi Hayashi ,  Yasuhiko Oyama ,  Shigeru Danjo ,  Masahiko Kitamura ,  Koichi Yajima

    发明人： Masateru Fukuoka ,  Munehiro Hatai ,  Satoshi Hayashi ,  Yasuhiko Oyama ,  Shigeru Danjo ,  Masahiko Kitamura ,  Koichi Yajima

    IPC分类号： H01L21/00

    CPC分类号： H01L21/6835 ,  B24B7/228 ,  B24B41/068 ,  H01L21/304 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10S438/977

    摘要： A semiconductor wafer (W) where circuits are formed in the area divided by streets is split into semiconductor chips having individual circuits. By interposing an adhesive sheet, whose adhesive force is lowered by stimulation, between the semiconductor wafer (W) and the support plate (13), the front side of the semiconductor wafer (W) is adhered to the support plate (13), thereby exposing the rear face (10) of the semiconductor wafer (W). The rear face (10) of the semiconductor wafer (W) with the support plate (13) is ground. After the grinding is finished, the semiconductor wafer (W) held with the rear face (10) up is diced into semiconductor chips (C). The adhesive sheet is given stimulus to lower the adhesive force and the semiconductor chips (C) are removed from the support plate (13). The semiconductor wafer and semiconductor chips are always supported by the support plate, avoiding damage and deformation.

    摘要翻译： 在由街道划分的区域中形成电路的半导体晶片（W）被分成具有单独电路的半导体芯片。 通过在半导体晶片（W）和支撑板（13）之间插入粘合剂片（其粘合力被刺激而降低），半导体晶片（W）的前侧被粘附到支撑板（13），由此 暴露半导体晶片（W）的背面（10）。 研磨具有支撑板（13）的半导体晶片（W）的背面（10）。 研磨完成后，将保持有背面（10）的半导体晶片（W）切成半导体芯片（C）。 给予粘合片刺激以降低粘合力，并且将半导体芯片（C）从支撑板（13）移除。 半导体晶片和半导体芯片总是由支撑板支撑，避免损坏和变形。

    TOC component removing apparatus and process for removing TOC components
    45.
    发明申请
    TOC component removing apparatus and process for removing TOC components 失效
    TOC成分除去装置及去除TOC成分的处理

    公开(公告)号：US20060016764A1

    公开(公告)日：2006-01-26

    申请号：US11181896

    申请日：2005-07-15

    申请人： Satoshi Hayashi

    发明人： Satoshi Hayashi

    IPC分类号： C02F1/32

    CPC分类号： C02F1/32 ,  C02F1/42 ,  C02F1/444 ,  C02F1/725 ,  C02F9/00 ,  C02F2103/04 ,  C02F2301/046 ,  C02F2305/10

    摘要： A TOC component removing apparatus of the present invention is for removing TOC components contained in ultrapure water or pure water, including a treatment tank 2 into which the ultrapure water or the pure water is introduced, a plurality of spherical catalyst particles 3 of which surfaces are photocatalyst, a tabular translucent holding body 4 which holds the catalyst particles 3 on one surface 31a, and an ultraviolet-ray light source 5 which is arranged near the translucent holding body 4 and radiates ultraviolet rays with a wavelength of 254 nm.

    摘要翻译： 本发明的TOC成分除去装置是用于除去超纯水或纯水中含有的超纯水或纯水的处理槽2中的TOC成分，多个球状催化剂粒子3，其表面为 光催化剂，将催化剂颗粒3保持在一个表面31a上的片状半透明保持体4和布置在半透明保持体4附近的紫外线光源5，并且辐射波长为254nm的紫外线。

    Piezoelectric type actuator
    48.
    发明授权
    Piezoelectric type actuator 失效
    压电式执行器

    公开(公告)号：US5004945A

    公开(公告)日：1991-04-02

    申请号：US410525

    申请日：1989-09-22

    申请人： Masahiro Tomita ,  Satoshi Hayashi ,  Shinro Oda ,  Akira Fujii ,  Masayoshi Tanigawa

    发明人： Masahiro Tomita ,  Satoshi Hayashi ,  Shinro Oda ,  Akira Fujii ,  Masayoshi Tanigawa

    IPC分类号： H01L41/053 ,  H01L41/083 ,  H02N2/04

    CPC分类号： H01L41/0536 ,  H01L41/083

    摘要： According to the present invention there is provided a piezoelectric type actuator wherein a compressive force is exerted on a piezoelectric laminate, using a coil spring having a relatively small spring constant and a coned disc spring having a relatively large spring constant, the said compressive force being in the range of 4.0 to 50 in terms of the ratio of the spring constant of the coned disc spring to that of the coil spring.Under the above construction, the performance of the piezoelectric laminate is not deteriorated under any conditions during use, and the size of the piezoelectric type actuator can be reduced.

    摘要翻译： 根据本发明，提供了一种压电式致动器，其中使用具有相对小的弹簧常数的螺旋弹簧和具有相对较大的弹簧常数的锥形弹簧将压缩力施加在压电层压板上，所述压缩力为 在盘形弹簧的弹簧常数与螺旋弹簧的弹簧常数之比为4.0〜50的范围内。 在上述结构中，压电层叠体的性能在使用过程中的任何条件下都不会劣化，并且可以减小压电型致动器的尺寸。

    Pneumatic tire
    50.
    发明授权
    Pneumatic tire 有权
    气动轮胎

    公开(公告)号：US09381776B2

    公开(公告)日：2016-07-05

    申请号：US14237735

    申请日：2012-08-09

    申请人： Satoshi Hayashi

    发明人： Satoshi Hayashi

    IPC分类号： B60C13/02 ,  B60C17/00

    CPC分类号： B60C13/02 ,  B60C17/0009

    摘要： A tire having a large number of circular dimples 62 on sidewalls thereof is disclosed. Each dimple 62 has a slope surface 66 and a bottom surface 68. The dimple 62 has a small projection 70. The small projection 70 is annular and is formed on the slope surface 66. A cross-sectional shape of the small projection 70 is substantially a rectangle. The small projection 70 is arranged so as to be concentric with the contour of the dimple 62. The surface area of the slope surface 66 having the small projection 70 is larger than the surface area of the slope surface when it is postulated that the small projection 70 does not exist thereon.

    摘要翻译： 公开了一种在其侧壁上具有大量圆形凹坑62的轮胎。 每个凹坑62具有倾斜表面66和底面68.凹坑62具有小的凸起70.小突起70是环形的并且形成在斜面66上。小突起70的横截面形状基本上 一个矩形 小突起70被布置成与凹坑62的轮廓同心。当假定具有小突起70的倾斜面66的表面积大于倾斜面的表面积时，假定小突起70 70不存在于其上。