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公开(公告)号:US08434908B2
公开(公告)日:2013-05-07
申请号:US13597953
申请日:2012-08-29
申请人: Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
发明人: Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
IPC分类号: F21V29/00
CPC分类号: F21V29/004 , F21K9/20 , F21V19/001 , F21V19/006 , F21V29/67 , F21V29/73 , F21V29/74 , F21Y2115/10 , H01R33/9456 , Y10T29/49879
摘要: A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.
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公开(公告)号:US08427059B2
公开(公告)日:2013-04-23
申请号:US12511522
申请日:2009-07-29
申请人: Nobuhiko Betsuda , Takumi Suwa , Hitoshi Kawano , Akiko Saito , Makoto Bessho , Yusuke Shibahara , Hiroki Tamai , Nobuo Shibano , Keiichi Shimizu
发明人: Nobuhiko Betsuda , Takumi Suwa , Hitoshi Kawano , Akiko Saito , Makoto Bessho , Yusuke Shibahara , Hiroki Tamai , Nobuo Shibano , Keiichi Shimizu
IPC分类号: H01K1/58
CPC分类号: F21V29/02 , F21K9/232 , F21V3/00 , F21V23/0492 , F21V29/67 , F21V29/773 , F21V29/83 , F21Y2115/10
摘要: A substrate is attached to one edge side of a radiator and a globe is attached covering the substrate. Heat-radiating fins are provided on the other edge side of the radiator and an air-cooling unit is rotatably provided inside the heat-radiating fins which enables to freely rotate. A case storing a circuit part is attached to the other edge side of the radiator and a cap is provided to the case. By the wind blast from the air-cooling unit, the heat-radiating fins are caused to be a part of the ventilation path to allow for ventilation of the inside of the radiator.
摘要翻译: 衬底附接到散热器的一个边缘侧,并且将覆盖物覆盖在衬底上。 散热片设置在散热器的另一边缘侧,并且空气冷却单元可旋转地设置在能够自由旋转的散热片内。 存储电路部分的壳体附接到散热器的另一边缘侧,并且在壳体上设置盖。 通过来自空气冷却单元的风吹,使散热片成为通风路径的一部分,以允许散热器内部的通风。
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公开(公告)号:US07847490B2
公开(公告)日:2010-12-07
申请号:US11909291
申请日:2006-03-24
申请人: Hiroshi Kubota , Shinya Hakuta , Mari Nakamura , Ryota Irie , Katsuyuki Kobayashi , Hitoshi Kawano , Yoshikazu Ito , Yasuhiro Shida
发明人: Hiroshi Kubota , Shinya Hakuta , Mari Nakamura , Ryota Irie , Katsuyuki Kobayashi , Hitoshi Kawano , Yoshikazu Ito , Yasuhiro Shida
摘要: A self-ballasted fluorescent lamp capable of achieving a similar appearance to that of an electric light bulb for general illumination includes a base that is attached to a bottom end of a cover and a luminous tube that is supported at a top end of the cover. Electronic components forming a lighting circuit are mounted on a substrate. The substrate is formed to have such a width dimension that allows the substrate to be inserted into the base. The substrate is vertically disposed along a center axis of the base at a position offset from the center axis. Large electronic components are disposed on a first face of the substrate, which faces a large component area in the base formed by the offset substrate.
摘要翻译: 能够实现与用于一般照明的电灯泡类似的外观的自镇流荧光灯包括附接到盖的底端的基座和支撑在盖的顶端的发光管。 形成照明电路的电子部件安装在基板上。 衬底被形成为具有这样的宽度尺寸,即允许衬底插入到底座中。 基板沿着与基板的中心轴线在偏离中心轴线的位置处垂直设置。 大的电子部件设置在基板的第一面上,该第一面面对由偏移基板形成的底座中的大的部件面积。
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公开(公告)号:US20090066254A1
公开(公告)日:2009-03-12
申请号:US11909291
申请日:2006-03-24
申请人: Hiroshi Kubota , Shinya Hakuta , Mari Nakamura , Ryota Irie , Katsuyuki Kobayashi , Hitoshi Kawano , Yoshikazu Ito , Yasuhiro Shida
发明人: Hiroshi Kubota , Shinya Hakuta , Mari Nakamura , Ryota Irie , Katsuyuki Kobayashi , Hitoshi Kawano , Yoshikazu Ito , Yasuhiro Shida
IPC分类号: H01J7/44
摘要: A self-ballasted fluorescent lamp capable of achieving a similar appearance to that of an electric light bulb for general illumination includes a base that is attached to a bottom end of a cover and a luminous tube that is supported at a top end of the cover. Electronic components forming a lighting circuit are mounted on a substrate. The substrate is formed to have such a width dimension that allows the substrate to be inserted into the base. The substrate is vertically disposed along a center axis of the base at a position offset from the center axis. Large electronic components are disposed on a first face of the substrate, which faces a large component area in the base formed by the offset substrate.
摘要翻译: 能够实现与用于一般照明的电灯泡类似的外观的自镇流荧光灯包括附接到盖的底端的基座和支撑在盖的顶端的发光管。 形成照明电路的电子部件安装在基板上。 衬底被形成为具有这样的宽度尺寸,即允许衬底插入到底座中。 基板沿着与基板的中心轴线在偏离中心轴线的位置处垂直设置。 大的电子部件设置在基板的第一面上,该第一面面对由偏移基板形成的底座中的大的部件面积。
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公开(公告)号:US20070115191A1
公开(公告)日:2007-05-24
申请号:US11545655
申请日:2006-10-10
IPC分类号: H01Q1/32
CPC分类号: H01Q1/3241 , E05B81/78 , H01Q1/3283
摘要: Provided is an internal antenna device in such a form as a door handle for a smart entry system and an electronic key that can provide a metallic appearance similar to that of a metallic plating while avoiding a loss in the antenna output and ensuring a stable communication. A metallic thin film is deposited on a surface of an outer cover (9) that receives an antenna of the internal antenna device by sputtering. Cr (chromium) may be selected for the sputtering target, and the film thickness may be in the range of 0.05 μm to 0.20 μm to produce the appearance of a metallic surface. A double layer structure may be used by forming a coating consisting of acrylic urethane paint and having a thickness of 5 μm to 50 μm on the metallic film (16) to protect the metallic film (16) on the surface of the outer cover (9).
摘要翻译: 提供了一种内部天线装置,其形式为用于智能进入系统的门把手和电子钥匙,其可以提供类似于金属电镀的金属外观,同时避免天线输出的损失并确保稳定的通信。 金属薄膜沉积在通过溅射接收内部天线装置的天线的外盖(9)的表面上。 可以选择Cr(铬)作为溅射靶,并且膜厚可以在0.05μm至0.20μm的范围内,以产生金属表面的外观。 可以通过在金属膜(16)上形成由丙烯酸聚氨酯涂料组成的涂层并具有5μm至50μm的厚度的涂层来保护双层结构,以保护外盖(9)的表面上的金属膜(16) )。
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公开(公告)号:US6095054A
公开(公告)日:2000-08-01
申请号:US52625
申请日:1998-03-31
申请人: Hitoshi Kawano , Masanao Murata , Tanaka Tsuyoshi , Atsushi Okuno
发明人: Hitoshi Kawano , Masanao Murata , Tanaka Tsuyoshi , Atsushi Okuno
CPC分类号: B61B13/04
摘要: A transport system has a track provided along a transport route forming a main route and at least one branch route connected to the main route at a branch point. A first power supply line is provided along the main route; a second power supply line is provided along the branch route and a transport vehicle moves along the track. There is a drive unit for driving the transport vehicle along the track with the drive unit being attached to the transport vehicle, a route selector for selecting a branch route at the branch point and a power receiver for receiving electric power from the first and second power supply lines to supply electric power to the drive unit.
摘要翻译: 运输系统沿着形成主路线的运输路线和在分支点处连接到主路线的至少一条分支路线设置轨道。 沿着主路线提供第一电源线; 沿着分支路线设置第二供电线路,并且运输车辆沿轨道移动。 具有驱动单元,用于沿着轨道驱动运输车辆,其中驱动单元附接到运输车辆;路线选择器,用于选择分支点处的分支路线;以及电力接收器,用于从第一和第二电力接收电力 供电线路为驱动单元提供电力。
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公开(公告)号:US5974077A
公开(公告)日:1999-10-26
申请号:US943186
申请日:1997-10-03
申请人: Kenji Abiko , Hitoshi Kawano , Yoshihiro Ashino
发明人: Kenji Abiko , Hitoshi Kawano , Yoshihiro Ashino
IPC分类号: C21C5/52 , C21C7/10 , C22B9/00 , C22B9/04 , F27B14/04 , F27B14/06 , F27B17/00 , F27D7/06 , F27D9/00 , F27D19/00
CPC分类号: F27B14/063 , C22B9/003 , C22B9/04 , F27B14/04 , F27B17/00 , F27D9/00 , C21C5/5241 , C21C7/10 , F27B2014/045 , F27D2007/066 , F27D2009/0013 , F27D2009/0083 , F27D2019/0003 , Y02P10/216 , Y02P10/253
摘要: A method of refining metal to be processed to a high degree of purity by heat-melting the metal in a melting furnace in the form of a metal crucible placed in a vacuum vessel. The method includes evacuating prior to melting, preheating the inside of the entire vacuum atmosphere including the inner wall surface of the vacuum vessel, component parts inside the vessel and the like in order to keep the total pressure within the vessel at 1.times.10.sup.-8 Torr or lower, and effecting high frequency induction heating while controlling the partial pressure of each of O.sub.2, H.sub.2, CO in the atmosphere inside the vessel. Further, the vacuum vessel, the metal crucible and an induction heating coil attached to the crucible, each of which has double jacket structure, are heated or cooled by supplying circulating heating or cooling water in a water-passage space of each of the vacuum vessel, the metal crucible and the induction heating coil, so that the inside of the melting furnace is baked.
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公开(公告)号:US5806574A
公开(公告)日:1998-09-15
申请号:US565945
申请日:1995-12-01
IPC分类号: H01L21/673 , B65B31/00
CPC分类号: H01L21/67772 , H01L21/67373
摘要: A portable closed container has a container body, and a lid for opening and hermetically closing the opening of the container body, in which an internal atmosphere thereof is replaced with an inner atmosphere suitable for an article contained in the container through a gas purging operation. The container is improved such that the lid is a hollowed body with at least one purging wall hole.
摘要翻译: 便携式密闭容器具有容器主体和用于打开和密封容器主体的开口的盖,其中内部气氛通过气体吹扫操作被适合于容纳在容器中的物品的内部气氛所代替。 容器被改进,使得盖子是具有至少一个清洗壁孔的中空体。
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公开(公告)号:US5443346A
公开(公告)日:1995-08-22
申请号:US85109
申请日:1993-07-02
申请人: Masanao Murata , Teppei Yamashita , Tsuyoshi Tanaka , Takahide Hoshiko , Mitsuji Karita , Hitoshi Kawano , Tutomu Shinya
发明人: Masanao Murata , Teppei Yamashita , Tsuyoshi Tanaka , Takahide Hoshiko , Mitsuji Karita , Hitoshi Kawano , Tutomu Shinya
IPC分类号: B65G1/00 , B65G49/07 , H01L21/677
CPC分类号: H01L21/67727 , H01L21/67736 , Y10S414/137 , Y10S414/14
摘要: Disclosed is a wafer conveying system for a clean room which is high in wafer conveying efficiency, and makes it possible to achieve a variety of processing operations with high efficiency. The wafer conveying system in a clean room comprises: an interface equipment cooperating with a conveying system to transfer wafers therebetween which is adapted to convey articles between manufacturing lines; a conveying path extended from the interface equipment; on intra-bay wafer conveying equipment which is moved along the conveying path; and a single or plural wafer processing equipments arranged along the conveying path, thus forming one processing line, the conveying system operating to convey cassettes containing wafers, the interface equipment operating to take a specified number of wafers out of a single or plural cassettes which are delivered to the interface equipment, and place the wafers in an auxiliary cassette provided for the one processing line only, and the intra-bay wafer conveying equipment operating to receive the auxiliary cassette, and move to a specified one of the wafer processing equipments, and to give the wafers to the specified wafer processing equipment and receive wafers therefrom.
摘要翻译: 公开了一种晶片输送效率高的洁净室用晶片输送系统,能够以高效率实现各种加工作业。 洁净室中的晶片输送系统包括:与输送系统配合以在其间转移晶片的界面设备,其适于在制造线之间输送物品; 从接口设备延伸的输送路径; 在沿着输送路径移动的台架间输送设备上; 以及沿输送路径布置的单个或多个晶片处理设备,从而形成一条处理线,该输送系统用于输送含有晶片的盒,该操作用于从单个或多个盒中取出指定数量的晶片的接口设备 传送到接口设备,并且将晶片放置在仅用于一个处理线的辅助盒中,以及操作以接收辅助盒的间隔间晶片输送设备,并移动到指定的一个晶片处理设备,以及 将晶片提供给指定的晶片处理设备并从其接收晶片。
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公开(公告)号:US5389769A
公开(公告)日:1995-02-14
申请号:US037976
申请日:1993-03-26
申请人: Teppei Yamashita , Masanao Murata , Tsuyoshi Tanaka , Teruya Morita , Hitoshi Kawano , Atsushi Okuno , Masanori Tsuda , Mitsuhiro Hayashi
发明人: Teppei Yamashita , Masanao Murata , Tsuyoshi Tanaka , Teruya Morita , Hitoshi Kawano , Atsushi Okuno , Masanori Tsuda , Mitsuhiro Hayashi
CPC分类号: G06K17/00 , G06K2017/0045 , G06K2017/0087
摘要: An ID recognizing system for a semiconductor manufacturing system includes IC modules set in surfaces of containers which accommodate wafers and are conveyed from one device to another in the semiconductor manufacturing system. Each IC module is capable of transmitting and receiving signals from fixed stations and includes a reloadable memory. The semiconductor manufacturing system is made up of a number of devices for performing manufacturing operations on the wafers in the containers, and each of the devices include one of the fixed stations. The IC module is powered by the energy of radio waves received from the fixed station in the device in which said container has been placed for processing of the wafers therein. The radio communication is in the form of communication packets which include data on individual wafers in the cassettes so that the individual wafers can be processed separately. The position or off-set of the data within the packet indicates the position of the corresponding wafer within the container.
摘要翻译: 用于半导体制造系统的ID识别系统包括设置在容纳晶片的容器的表面中的IC模块,并且在半导体制造系统中从一个装置传送到另一个装置。 每个IC模块能够从固定站发送和接收信号,并且包括可重新加载的存储器。 半导体制造系统由用于对容器中的晶片进行制造操作的多个装置组成,并且每个装置包括固定站之一。 IC模块由在其中已经放置所述容器用于处理其中的晶片的装置中的固定站接收的无线电波的能量供电。 无线电通信是通信分组的形式,其包括在盒中的单个晶片上的数据,使得可以单独处理各个晶片。 分组内的数据的位置或偏移指示了相应晶片在容器内的位置。
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