公开(公告)号：US4408714A

公开(公告)日：1983-10-11

申请号：US349843

申请日：1982-02-18

申请人： Shigeru Kobayashi

发明人： Shigeru Kobayashi

IPC分类号： B60H1/12 ,  B60H1/00 ,  B60H1/02

CPC分类号： B60H1/00042 ,  B60H1/00314 ,  B60H2001/00085 ,  B60H2001/00164

摘要： In a heating apparatus for motor vehicles, there is provided means for permitting part of air just heated by heater means provided in the apparatus to be directed toward a region upstream of the heater means so as to be again heated by the heater means, thereby causing the temperature in the vehicle chamber to be rapidly elevated, while at the same time preventing the humidity therein from being increased.

摘要翻译： 在用于机动车辆的加热装置中，设置有用于允许刚刚通过设置在设备中的加热器装置加热的部分空气被引向加热器装置上游的区域，以便再次被加热装置加热，由此引起 车室中的温度将迅速升高，同时防止其中的湿度增加。

公开(公告)号：US4287242A

公开(公告)日：1981-09-01

申请号：US64760

申请日：1979-08-08

申请人： Takeshi Monden ,  Yoshiro Shiba ,  Toshihiro Momonaka ,  Shigeru Kobayashi ,  Kazuo Oda

发明人： Takeshi Monden ,  Yoshiro Shiba ,  Toshihiro Momonaka ,  Shigeru Kobayashi ,  Kazuo Oda

IPC分类号： E02B3/16 ,  B05D1/02 ,  B05D1/34 ,  B05D5/00 ,  B05D7/00 ,  B05D7/14 ,  B05D7/24 ,  C08L9/00 ,  C08L9/06 ,  C08L11/00 ,  C08L11/02 ,  C08L95/00 ,  C09D195/00

CPC分类号： C09D195/005 ,  B05D1/02 ,  B05D1/34 ,  C08L95/005 ,  B05D2401/20 ,  C08L11/00 ,  C08L11/02 ,  C08L9/00 ,  C08L9/06

摘要： A spray-coating process which comprises spraying a rubber-asphalt anionic emulsion having a total solid content of 70% by weight or more and a 1-15% by weight aqueous solution of a polyvalent metal salt almost simultaneously by means of separate airless type spraying machines to continuously contact and mix said emulsion with said aqueous solution in the space between the spraying machine and the surface of a substrate to be coated and on the substrate surface, thereby forming a rubber-asphalt solid layer on the substrate surface. By this process, a rubber-asphalt solid layer having a thickness of 4 mm or more and having a water-proof, moisture-proof or gas-proof characteristics can be formed rapidly on the substrate surface.

摘要翻译： 一种喷涂方法，其包括通过分开的无空气喷雾几乎同时喷洒总固体含量为70重量％以上的橡胶沥青阴离子乳液和1-15重量％的多价金属盐水溶液 将所述乳液与所述喷雾机与待涂布基材表面之间的空间中的所述水溶液连续接触并混合在基材表面上的机器，从而在基材表面上形成橡胶沥青固体层。 通过该方法，可以在基板表面上快速形成厚度为4mm以上并且具有防水，防湿或防气体特性的橡胶沥青固体层。

公开(公告)号：US20110121913A1

公开(公告)日：2011-05-26

申请号：US13003665

申请日：2009-07-15

申请人： Junji Satou ,  Shigeru Kobayashi ,  Michiaki Matsuo

发明人： Junji Satou ,  Shigeru Kobayashi ,  Michiaki Matsuo

IPC分类号： H01P3/08 ,  H03H7/38

CPC分类号： H01P3/088 ,  H01P3/003 ,  H01P3/006

摘要： There is provided a low loss slow wave transmission line that can be miniaturized. A slow wave transmission line of the present invention has a configuration which includes a repeated arrangement of a low impedance line and a high impedance line and in which the high impedance line is longer than the low impedance line in terms of a line length.

摘要翻译： 提供了可以小型化的低损耗慢波传输线。 本发明的慢波传输线具有包括低阻抗线路和高阻抗线路的重复配置，并且其中高阻抗线路比线路长度上的低阻抗线路长。

公开(公告)号：US20100271148A1

公开(公告)日：2010-10-28

申请号：US12810361

申请日：2008-12-25

申请人： Shigeru Kobayashi ,  Michiaki Matsuo ,  Junji Sato

发明人： Shigeru Kobayashi ,  Michiaki Matsuo ,  Junji Sato

IPC分类号： H03K7/00 ,  H03C3/00

CPC分类号： H03K7/06 ,  H03C1/36 ,  H03C5/00 ,  H04L27/12

摘要： A signal modulator that can control transmission power if level adjustment of a continuous signal from an oscillator is executed is provided. A pulse generator of one example of a signal modulator includes an oscillator, a control signal generator, a multiplier, a filter, and a control section. The oscillator and the multiplier are active circuits formed of active elements. A continuous signal is output from the oscillator and is input to the multiplier and the multiplier intermittently operates by a control signal output from the control signal generator, whereby a pulse signal is generated and the power level is easily adjusted by a signal from the control section.

摘要翻译： 提供了如果执行来自振荡器的连续信号的电平调整，则可以控制发送功率的信号调制器。 信号调制器的一个示例的脉冲发生器包括振荡器，控制信号发生器，乘法器，滤波器和控制部分。 振荡器和乘法器是由有源元件形成的有源电路。 从振荡器输出连续信号并输入到乘法器，并且乘法器通过从控制信号发生器输出的控制信号间歇地操作，从而产生脉冲信号，并且通过来自控制部分的信号容易地调整功率电平 。

公开(公告)号：US07703775B2

公开(公告)日：2010-04-27

申请号：US11666458

申请日：2005-10-27

申请人： Yoshitaka Matsushita ,  Shigeru Kobayashi ,  Shinichi Hirayama ,  Tsunehiko Abe ,  Naoki Takeda

发明人： Yoshitaka Matsushita ,  Shigeru Kobayashi ,  Shinichi Hirayama ,  Tsunehiko Abe ,  Naoki Takeda

IPC分类号： F02F11/00

CPC分类号： F16J15/0831 ,  F16J15/0825 ,  F16J2015/085 ,  F16J2015/0868

摘要： A metal gasket for a cylinder head has a lamination of plates. The gasket includes two base metal plates each of which includes cylinder holes, circumferential beads formed around the peripheries of individual cylinder holes, cooling water holes formed outside the peripheries of the circumferential beads, and an outer bead formed so as to entirely enclose the circumferential beads and the cooling water holes. The circumferential beads of the two base plates are aligned in a direction of thickness of the gasket. Claw shaped protrusions are provided for one of an outer step adjustment metal plate and an inner step adjustment metal plate and extend from a cooling water jacket to the outer edges of the base plates into engagement holes in the other of the inner step adjustment plate and the outer step adjustment plate.

摘要翻译： 用于气缸盖的金属垫圈具有板的层压。 垫圈包括两个基体金属板，每个基体金属板包括气缸孔，围绕各个气缸孔的周边形成的周向胎圈，形成在周向胎圈周边外部的冷却水孔，以及形成为完全包围周向胎圈的外胎圈 和冷却水孔。 两个基板的周向珠沿垫片的厚度方向排列。 针对外台阶调节金属板和内台阶调整金属板之一设置有爪形突起，并且从冷却水套延伸到基板的外边缘，成为内台阶调整板中的另一个中的接合孔， 外台阶调节板。

公开(公告)号：US20100086392A1

公开(公告)日：2010-04-08

申请号：US12569328

申请日：2009-09-29

申请人： Yoshiaki Kobayashi ,  Shigeru Kobayashi ,  Kenji Tokunaga ,  Koji Kato ,  Teruo Minami

发明人： Yoshiaki Kobayashi ,  Shigeru Kobayashi ,  Kenji Tokunaga ,  Koji Kato ,  Teruo Minami

IPC分类号： H01L21/677

CPC分类号： H01L21/67775 ,  H01L21/6735 ,  H01L21/67772

摘要： A method is provided of manufacturing semiconductor devices formed on a semiconductor wafer, including placing the wafer in a semiconductor container and conveying the container to a semiconductor manufacturing apparatus. An opening of the container is opposed to an opening of the apparatus such that an opener of the apparatus holds a lid of the opening the container. A key of the opener is inserted to a latch groove of the lid, and the key is rotated to contact a latch of the lid. The openings are connected such that a velocity differential pressure ratio obtained by dividing the maximum velocity when the opener holding the lid horizontally moves away from the opening of the container, by the differential pressure between the inside pressure and the outside pressure of the apparatus, is set to be 0.06 ((m/s)/Pa) or less, and then the wafer is processed.

摘要翻译： 提供一种制造形成在半导体晶片上的半导体器件的方法，包括将晶片放置在半导体容器中并将容器输送到半导体制造装置。 容器的开口与装置的开口相对，使得装置的开启器保持容器的开口盖。 开启器的钥匙被插入到盖的闩锁槽中，并且钥匙被旋转以接触盖的闩锁。 这些开口被连接成使得通过将保持盖的开启器水平地移动离开容器的开口的最大速度获得的速度差压比通过内部压力和设备的外部压力之间的压差来实现， 设定为0.06（（m / s）/ Pa）以下，然后处理晶片。

公开(公告)号：US07690152B2

公开(公告)日：2010-04-06

申请号：US11390418

申请日：2006-03-28

申请人： Shigeru Kobayashi ,  Kazuyuki Hirai

发明人： Shigeru Kobayashi ,  Kazuyuki Hirai

IPC分类号： E05F15/02

CPC分类号： H02H7/0851 ,  E05F15/41 ,  E05Y2400/554 ,  E05Y2900/55 ,  G05B19/4061 ,  G05B2219/37624 ,  G05B2219/45242 ,  H02H3/006 ,  H02H3/44

摘要： An opening and closing member control system includes a rotation sensing device, which outputs a pulse signal synchronously to a movement of a window glass, and a controller, which senses pinching of an object by an opening and closing member based on the pulse signal. The controller has leaning stored data Δωm based on the pulse signal. The controller computes a rotational speed difference Δω at a current position of the window glass based on the pulse signal while the window glass is driven in a closing direction. The controller computes a difference between the rotational speed difference Δω and leaning stored data Δωm in such a manner that the controller determines whether the pinching of the object based on a comparison between the difference and a pinching determining threshold value β.

摘要翻译： 开闭构件控制系统包括：旋转检测装置，其与窗玻璃的移动同步地输出脉冲信号;以及控制器，其基于脉冲信号感测由打开和关闭构件夹持物体。 控制器基于脉冲信号倾斜存储数据＆Dgr;ωm。 控制器根据脉冲信号计算窗玻璃的当前位置处的转速差Dgr;ω，同时窗玻璃沿闭合方向被驱动。 控制器以这样的方式计算旋转速度差Dgr;ω和倾斜存储数据Dgr;ωm之间的差异，使得控制器基于差异和捏合确定阈值bgr之间的比较来确定对象的捏合。

公开(公告)号：US07314345B2

公开(公告)日：2008-01-01

申请号：US11391640

申请日：2006-03-29

申请人： Yoshiaki Kobayashi ,  Shigeru Kobayashi ,  Kenji Tokunaga ,  Koji Kato ,  Teruo Minami

发明人： Yoshiaki Kobayashi ,  Shigeru Kobayashi ,  Kenji Tokunaga ,  Koji Kato ,  Teruo Minami

IPC分类号： H01L21/677

CPC分类号： H01L21/67775 ,  H01L21/6735 ,  H01L21/67772

摘要： When a conventional semiconductor container opening/closing apparatus opens a lid of a semiconductor container, foreign particles enter into the container from outside through a gap between the container and a wall surface of the container opening/closing apparatus and adhere to a wafer in the container. An apparatus is provided to reduce the number of foreign particles adhering to the wafer by preventing foreign particles from entering into the container at the time of opening the container by the opening/closing apparatus. To achieve this, a velocity-differential pressure ratio obtained by dividing the maximum velocity at the time of opening the lid of the container in a vertical direction to an opening of the container, by the differential pressure between the inside pressure and the outside pressure of said semiconductor manufacturing apparatus, is set to be 0.06 ((m/s) Pa) or less.

摘要翻译： 当传统的半导体容器打开/关闭装置打开半导体容器的盖子时，异物通过容器和容器打开/关闭装置的壁表面之间的间隙从外部进入容器，并且粘附到容器中的晶片 。 提供了一种装置，用于通过打开/关闭装置打开容器时防止异物进入容器，从而减少附着在晶片上的异物的数量。 为了实现这一点，通过将容器的盖子在垂直方向上打开时的最大速度除以容器的开口之间的内压和外部压力之间的压差来获得的速度差压比 所述半导体制造装置设定为0.06（（m / s）Pa）以下。

公开(公告)号：US20050271328A1

公开(公告)日：2005-12-08

申请号：US11146710

申请日：2005-06-07

申请人： Nobuaki Ohtsu ,  Takehiro Hayashi ,  Shigeru Kobayashi

发明人： Nobuaki Ohtsu ,  Takehiro Hayashi ,  Shigeru Kobayashi

IPC分类号： G02B6/40 ,  G02B6/38

CPC分类号： G02B6/3879 ,  G02B6/3829 ,  G02B6/3849 ,  G02B6/3885

摘要： A first guiding mechanism is formed by the interior shape of an engagement portion of a plug housing and the exterior shape of an engagement portion of a receptacle housing, to be guided and inserted into the engagement portion. A second guiding mechanism is formed by guide posts and guide holes. A third guiding mechanism is formed by the interior shape of the engagement portion of the receptacle housing and the exterior shapes of first multi core ferrules of the plug side optical connector, to be inserted into the engagement portion of the receptacle housing. A fourth guiding mechanism is formed by guide pins of second multi core ferrules and guide pin apertures, for receiving the guide pins of the first multi core ferrules. The first, second, third, and fourth guiding mechanisms operate in this order during engagement of a receptacle side optical connector and a plug side optical connector.

摘要翻译： 第一引导机构由插头壳体的接合部分的内部形状和插座壳体的接合部分的外部形状形成，以被引导并插入到接合部分中。 第二引导机构由引导柱和引导孔形成。 第三引导机构由插座壳体的接合部分的内部形状和插头侧光学连接器的第一多芯套圈的外部形状形成，以插入插座壳体的接合部分。 第四引导机构由第二多芯套圈和导向销孔的导销形成，用于接收第一多芯套圈的导向销。 第一，第二，第三和第四引导机构在插座侧光学连接器和插头侧光学连接器的接合期间按顺序操作。

公开(公告)号：US20050111937A1

公开(公告)日：2005-05-26

申请号：US10974819

申请日：2004-10-28

申请人： Yoshiaki Kobayashi ,  Shigeru Kobayashi ,  Kenji Tokunaga ,  Koji Kato ,  Teruo Minami

发明人： Yoshiaki Kobayashi ,  Shigeru Kobayashi ,  Kenji Tokunaga ,  Koji Kato ,  Teruo Minami

IPC分类号： B65G1/00 ,  H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67775 ,  H01L21/6735 ,  H01L21/67772

摘要： When a conventional semiconductor container opening/closing apparatus opens a lid of a semiconductor container, foreign particles enter into the container from outside through a gap between the container and a wall surface of the container opening/closing apparatus and adhere to a wafer in the container. A method is provided to reduce the number of foreign particles adhering to the wafer by preventing foreign particles from entering into the container at the time of opening the container by the opening/closing apparatus. To achieve this, a velocity-differential pressure ratio obtained by dividing the maximum velocity at the time of opening the lid of the container in a vertical direction to an opening of the container, by the differential pressure between the inside pressure and the outside pressure of said semiconductor manufacturing apparatus, is set to be 0.06 ((m/s) Pa) or less.

摘要翻译： 当传统的半导体容器打开/关闭装置打开半导体容器的盖子时，异物通过容器和容器打开/关闭装置的壁表面之间的间隙从外部进入容器，并且粘附到容器中的晶片 。 提供了一种方法，用于通过打开/关闭装置打开容器时防止异物进入容器，从而减少附着在晶片上的异物的数量。 为了实现这一点，通过将容器的盖子在垂直方向上打开容器的最大速度与容器的开口之间的内压和外部压力之间的压差相除来获得的速度差压比 所述半导体制造装置设定为0.06（（m / s）Pa）以下。