Silicon carbide semiconductor device
    41.
    发明申请
    Silicon carbide semiconductor device 有权
    碳化硅半导体器件

    公开(公告)号:US20060284217A1

    公开(公告)日:2006-12-21

    申请号:US11501777

    申请日:2006-08-10

    CPC classification number: H01L29/8083 H01L29/1608

    Abstract: A silicon carbide semiconductor device includes: a semiconductor substrate including first and second gate layers, a channel layer, a source layer, and a trench; a gate wiring having a first portion and a plurality of second portions; and a source wiring having a third portion and a plurality of fourth portions. The trench extends in a predetermined extending direction. The first portion connects to the first gate layer in the trench, and extends to the extending direction. The second portions protrude perpendicularly to be a comb shape. The third portion extends to the extending direction. The fourth portions protrude perpendicularly to be a comb shape, and electrically connect to the source layer. Each of the second portions connects to the second gate layer through a contact hole.

    Abstract translation: 碳化硅半导体器件包括:包括第一和第二栅极层,沟道层,源极层和沟槽的半导体衬底; 栅极布线,具有第一部分和多个第二部分; 以及具有第三部分和多个第四部分的源极布线。 沟槽沿预定的延伸方向延伸。 第一部分连接到沟槽中的第一栅极层,并延伸到延伸方向。 第二部分垂直突出成为梳形。 第三部分延伸到延伸方向。 第四部分垂直突出成梳状,并且电连接到源层。 每个第二部分通过接触孔连接到第二栅极层。

    Silicon carbide semiconductor device having junction field effect transistor and method for manufacturing the same
    46.
    发明授权
    Silicon carbide semiconductor device having junction field effect transistor and method for manufacturing the same 有权
    具有结场效应晶体管的碳化硅半导体器件及其制造方法

    公开(公告)号:US07005678B2

    公开(公告)日:2006-02-28

    申请号:US10984953

    申请日:2004-11-10

    CPC classification number: H01L29/66068 H01L29/1608 H01L29/8083 Y10S438/931

    Abstract: A silicon carbide semiconductor device includes: a semiconductor substrate including a base substrate, a first semiconductor layer, a second semiconductor layer and a third semiconductor layer, which are laminated in this order; a cell portion disposed in the semiconductor substrate and providing an electric part forming portion; and a periphery portion surrounding the cell portion. The periphery portion includes a trench, which penetrates the second and the third semiconductor layers, reaches the first semiconductor layer, and surrounds the cell portion so that the second and the third semiconductor layers are divided by the trench substantially. The periphery portion further includes a fourth semiconductor layer disposed on an inner wall of the trench.

    Abstract translation: 碳化硅半导体器件包括:依次层叠的包括基底基板,第一半导体层,第二半导体层和第三半导体层的半导体基板; 设置在所述半导体衬底中并提供电气部件形成部分的单元部分; 以及围绕单元部分的周边部分。 周边部分包括穿透第二和第三半导体层的沟槽到达第一半导体层,并且围绕电池部分,使得第二和第三半导体层基本上被沟槽划分。 外围部分还包括设置在沟槽的内壁上的第四半导体层。

    Silicon carbide semiconductor device having junction field effect transistor and method for manufacturing the same
    50.
    发明申请
    Silicon carbide semiconductor device having junction field effect transistor and method for manufacturing the same 有权
    具有结场效应晶体管的碳化硅半导体器件及其制造方法

    公开(公告)号:US20050151158A1

    公开(公告)日:2005-07-14

    申请号:US10984953

    申请日:2004-11-10

    CPC classification number: H01L29/66068 H01L29/1608 H01L29/8083 Y10S438/931

    Abstract: A silicon carbide semiconductor device includes: a semiconductor substrate including a base substrate, a first semiconductor layer, a second semiconductor layer and a third semiconductor layer, which are laminated in this order; a cell portion disposed in the semiconductor substrate and providing an electric part forming portion; and a periphery portion surrounding the cell portion. The periphery portion includes a trench, which penetrates the second and the third semiconductor layers, reaches the first semiconductor layer, and surrounds the cell portion so that the second and the third semiconductor layers are divided by the trench substantially. The periphery portion further includes a fourth semiconductor layer disposed on an inner wall of the trench.

    Abstract translation: 碳化硅半导体器件包括:依次层叠的包括基底基板,第一半导体层,第二半导体层和第三半导体层的半导体基板; 设置在所述半导体衬底中并提供电气部件形成部分的单元部分; 以及围绕单元部分的周边部分。 周边部分包括穿透第二和第三半导体层的沟槽到达第一半导体层,并且围绕电池部分,使得第二和第三半导体层基本上被沟槽划分。 外围部分还包括设置在沟槽的内壁上的第四半导体层。

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