摘要:
An organic electroluminescence device includes: a first electrode layer; an insulating film arranged on the first electrode layer; an organic layer that is arranged on the insulating film, and is in contact with the first electrode layer at an opening portion provided in the insulating film; a second electrode layer arranged on the organic layer; and a metal layer that is in contact with an end surface of the organic layer and an end surface of the second electrode layer, and is arranged on the second electrode layer.
摘要:
A highly transparent fiber composite material is provided that can be manufactured through a simplified process using reduced amounts of raw materials and that has high flexibility and low thermal expansivity and retains good functionality of the fiber material. The fiber composite material includes: a fiber assembly having an average fiber diameter of 4 to 200 nm and a 50 μm-thick visible light transmittance of 3% or more; and a coating layer that coats and smoothes the surface of the fiber assembly, wherein the fiber composite material has a 50 μm-thick visible light transmittance of 60% or more. With this fiber assembly, the scattering of light caused by the irregularities on the surface can be suppressed by coating the surface with the coating layer to smooth the surface, whereby a highly transparent fiber composite material can be obtained.
摘要:
A hybrid organic light-emitting transistor device and a manufacturing method thereof are provided. The hybrid organic light-emitting transistor device includes at least one organic light-emitting diode device and at least one organic thin-film transistor device placed on the same substrate. The organic light-emitting diode device has a first organic layer placed between an anode and a cathode, and the organic thin-film transistor device has a second organic layer placed on a source electrode and a drain electrode. The first organic layer and the second organic layer are spatially isolated from each other, and an organic material forming the second organic layer is identical to an organic material forming the first organic layer. The hybrid organic light-emitting transistor with a reduced pixel size and an improved aperture ratio can be easily obtained.
摘要:
An organic luminescent device according to the present invention includes a substrate, an organic luminescent layer, and a reflection electrode. Here, the substrate has first and second principal surfaces opposed to each other; the organic luminescent layer is arranged on the first principal surface of the substrate, and is held between a pair of electrodes at least one of which is a transparent electrode; and the reflection electrode is adjacent to a luminescent area of the organic luminescent layer and is arranged on a front surface or a back surface of the transparent electrode. The transparent electrode is arranged on the first principal surface of the substrate, while the reflection electrode is arranged on the transparent electrode. The second principal surface of the substrate is formed into a rough surface at least on its part opposed to the reflection electrode. This configuration improves light extraction efficiency.
摘要:
A method of producing a semiconductor device is disclosed, in which a through hole is formed in the upper surface of a semiconductor substrate from the lower surface thereof, and an opening of a desired size is formed in a desired position on the upper surface of the substrate. A guide that functions as an etching stopper is formed in the semiconductor substrate. An opening having a width W2 is formed in the guide. The opening faces an opening in a mask used in the formation of a through hole, and the width W2 thereof is narrower than a width W4 of the opening in the mask. The direction in which etching progresses is controlled by the opening formed in the guide as etching is conducted from a lower surface of the substrate to an upper surface of the substrate, and thus deviations in the width W1 and position of an opening in the upper surface of the substrate can be controlled.
摘要:
Provides a semiconductor device that can separate components easily. Gate electrode 42 is formed only within component forming region 32, and gate electrode 42 and aluminum wiring 48 are connected in component forming region 32. Therefore, there is almost no inversion of the surface of the semiconductor substrate 36 that is under field oxide film 38 due to the voltage of the concerned connection area and gate electrode 42. Also, there is interlayer film 44 between aluminum wiring 48 and field oxide film 38, so there is almost no inversion of the surface of the semiconductor substrate 36 that is under field oxide film 38 due to the voltage of aluminum wiring 48. Therefore, it is possible to separate components without increasing overall length L1 of field oxide film 38, increasing the film thickness of field oxide film 38, or increasing the concentration of channel stop ions implanted into the surface of the semiconductor substrate 36 that is under field oxide film 38.
摘要:
(a) At first a semiconductor substrate (11) having a lacunose layer (12) disposed at a equal depth (h) from the surface of a semiconductor layer (1) is formed; (b) then electric components (2), for example, transistors, or lines (3) for an electric circuit are formed on the semiconductor layer (1) at the surface side with respect to the lacunose layer (12); (c) then the semiconductor substrate is separated at the lacunose layer; (d) and an insulating layer (5) is formed on the surface exposed by the separation. The ultrathin semiconductor device has a thickness lower than 20 micro meters. As a result, a thin semiconductor device, having an SOI structure, for example can be fabricated, without the electric components and the insulating layer being influenced by charging up, which may appear during the manufacturing process. And it is also possible to realize a three dimensional semiconductor device.
摘要:
It is an object of the present invention to provide a semiconductor memory device and a method of manufacturing thereof capable of increasing the integration thereof and having a high operation reliability. Anisotropic etching having a high selectivity to silicon oxide (SAS etching) is carried out by using a resist layer 56, a stacked gate 46, a thermal oxidation layer 58 as a mask. A field oxidation layer 44 located between low density sources LS is selectively removed by carrying out the SAS etching. A width w3 of the field oxidation layer 44 thus removed is not much less than a width w2 between the stacked gates 46 located adjacently because the thermal oxidation layer 58 formed on sides of the stacked gate 46 is thin in its thickness. A diffusion source wiring 55 formed by carrying out subsequent processes such as ion implantation and thermal diffusion can be formed in an appropriate width. A gate edge 59 of the stacked gate 46 can fully be protected with the thermal oxidation layer 58 even in the SAS etching while the thermal oxidation layer 58 is etched in its height during the SAS etching.
摘要:
A poly-silicon or amorphous silicon plate having cone-like protrusions is provided on a Si substrate in a tunnel window area such that the edges of the protrusions are placed very close to a floating gate. Alternatively, the top surface of a Si substrate is shaped into protrusions.
摘要:
The present invention provides nonvolatile semiconductor memory which has advantages permitting the cell of the memory circuit to integrate, the memory circuit to be easy to manufacture, and the manufacturing expense to be cut down. The nonvolatile memory (21) comprises a P type well (2) for which a N+ type source (4) and a N+ type drain (3) is provided. A surface of a space between the source (4) and the drain (3) comprises a first portion (10a) and a second portion (10b). An insulating layer (6) for holding electrons spans the surface of the first portion (10a). A memory gate electrode (5) is on the insulating layer (6) and spans the first portion (10a). A conductive body 23 is provided on an insulating layer (8) so that it spans the second portion (10b) and is electrically disconnected from the memory gate electrode (5).