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公开(公告)号：US09179574B2
公开(公告)日：2015-11-03
申请号：US13114203
申请日：2011-05-24
CPC分类号： H05K7/1497 , F25B25/005 , F25B2700/2106 , F25B2700/21173 , F25D11/003 , F25D17/02 , H05K7/2079 , Y10T29/49359
摘要： A cooling unit and cooling method are provided for a container-type data center. The cooling unit includes a heat rejection unit, for rejecting heat from coolant passing through a coolant loop to air passing across the heat rejection unit, and a refrigeration unit controllable to selectively provide auxiliary cooling to at least a portion of the coolant passing through the coolant loop. The heat rejection unit includes a heat exchange assembly, having a first heat exchanger and a second heat exchanger, and one or more air-moving devices providing airflow across the first and second heat exchangers. The first heat exchanger couples in fluid communication with the coolant loop, and the second heat exchanger is coupled in fluid communication with a refrigeration loop of the refrigeration unit for rejecting heat from refrigerant passing through the refrigeration loop to the airflow passing across the second heat exchanger.
摘要翻译： 为集装箱式数据中心提供冷却装置和冷却方法。 冷却单元包括排热单元，用于将来自通过冷却剂回路的冷却剂的热量排除通过散热单元的空气;以及制冷单元，其可控制以选择性地向通过冷却剂的冷却剂的至少一部分提供辅助冷却 循环。 散热单元包括具有第一热交换器和第二热交换器的热交换组件，以及提供横跨第一和第二热交换器的气流的一个或多个气动装置。 所述第一热交换器与所述冷却剂回路流体连通，并且所述第二热交换器与所述制冷单元的制冷回路流体连通地联接，用于将通过所述制冷回路的制冷剂的热量排出到穿过所述第二热交换器的气流 。
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42.发明授权公开(公告)号：US08755948B2
公开(公告)日：2014-06-17
申请号：US12945958
申请日：2010-11-15
CPC分类号： G05D23/1934 , H05K7/20772 , H05K7/20836
摘要： Methods and systems for controlling fluid coolant flow in cooling systems of computing devices are disclosed. According to an aspect, a method may include determining a temperature of a fluid coolant in a cooling system of a computing device. For example, a temperature of water exiting a cooling system of a server may be determined. The method may also include determining an operational condition of the computing device. For example, a temperature of a processor, memory, or input/output (I/O) component may be determined. Further, the method may include controlling a flow of the fluid coolant through the cooling system based on the temperature of the fluid coolant and/or the operational condition.
摘要翻译： 公开了用于控制计算设备的冷却系统中的流体冷却剂流的方法和系统。 根据一个方面，一种方法可以包括确定计算装置的冷却系统中的流体冷却剂的温度。 例如，可以确定离开服务器的冷却系统的水的温度。 该方法还可以包括确定计算设备的操作条件。 例如，可以确定处理器，存储器或输入/输出（I / O）组件的温度。 此外，该方法可以包括基于流体冷却剂的温度和/或操作条件来控制通过冷却系统的流体冷却剂的流动。
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公开(公告)号：US20110080700A1
公开(公告)日：2011-04-07
申请号：US12572301
申请日：2009-10-02
IPC分类号： G06F1/20
CPC分类号： G06F1/20
摘要： Method and apparatus providing airflow through a chassis including an upstream column of memory modules and a downstream column of memory modules. The airflow is divided into first and second separate airflow streams extending from an upstream end of the upstream column to a downstream end of the downstream column. The first airflow stream is guided into contact with a single memory module operably-installed in the upstream column and to avoid contact with any memory module in the downstream column. The second airflow stream is guided to avoid contact with any memory module in the upstream column and into contact with a single memory module operably-installed in the downstream column. The improved cooling enables the extended use of a single memory module per channel, even though the thermal load on such a memory module is greater. The result is an overall savings of power, since cooling requirements no longer dictate the installation of additional memory modules per channel in order to share and distribute the thermal load.
摘要翻译： 提供通过包括存储器模块的上游列和存储器模块的下游列的底盘的气流的方法和装置。 气流被分为从上游塔的上游端延伸到下游塔的下游端的第一和第二分开的气流。 第一气流引导与可操作地安装在上游塔中的单个存储器模块接触，并且避免与下游塔中的任何存储器模块接触。 引导第二气流流以避免与上游塔中的任何存储器模块接触并与可操作地安装在下游塔中的单个存储器模块接触。 即使在这样的存储器模块上的热负载较大，改进的冷却也能够每通道扩展使用单个存储器模块。 结果是总体上节省了电力，因为冷却要求不再要求每个通道安装额外的内存模块，以便共享和分配热负载。
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公开(公告)号：US07791882B2
公开(公告)日：2010-09-07
申请号：US12108020
申请日：2008-04-23
CPC分类号： H05K7/20745 , H05K7/20836
摘要： Apparatus and method are provided for cooling an electronics rack in an energy efficient, dynamic manner. The apparatus includes one or more extraction mechanisms for facilitating cooling of the electronics rack, an enclosure, a heat removal unit, and a control unit. The enclosure has an outer wall, a cover coupled to the outer wall and a central opening sized to surround the electronics rack and the heat extraction mechanism. A liquid coolant loop couples the heat removal unit in fluid communication with the heat extraction mechanism, which removes heat from liquid coolant passing therethrough. The control unit is coupled to the heat removal unit for dynamically adjusting energy consumption of the heat removal unit to limit its energy consumption, while providing a required cooling to the electronics rack employing the liquid coolant passing through the heat extraction mechanism.
摘要翻译： 提供了用于以节能，动态的方式冷却电子机架的装置和方法。 该装置包括用于促进电子机架的冷却，外壳，散热单元和控制单元的一个或多个提取机构。 外壳具有外壁，联接到外壁的盖和大小为围绕电子机架和散热机构的中心开口。 液体冷却剂回路联接散热单元与散热机构的流体连通，其从通过其中的液体冷却剂中除去热量。 控制单元联接到除热单元，用于动态地调节散热单元的能量消耗以限制其能量消耗，同时使用通过热提取机构的液体冷却剂向电子机架提供所需的冷却。
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45.发明授权Rack system providing flexible configuration of computer systems with front access 有权机架系统提供具有前端访问功能的计算机系统的灵活配置公开(公告)号：US07639486B2
公开(公告)日：2009-12-29
申请号：US11955865
申请日：2007-12-13
申请人： David Frederick Champion , Karl Klaus Dittus , Brian Gormley , Vinod Kamath , Michael Sven Miller
发明人： David Frederick Champion , Karl Klaus Dittus , Brian Gormley , Vinod Kamath , Michael Sven Miller
IPC分类号： H05K7/20
CPC分类号： G06F1/183 , G06F1/20 , G06F2200/201 , H05K7/1488 , H05K7/20781
摘要： A system for receiving and supporting a plurality of devices connected to a network. The system comprises a rack having a front side providing access to a plurality of chassis bays for receiving a chassis and aligning a back end of the chassis for blind docking with an electrical power source. The chassis includes a power supply, a fan, and a front side providing access to a plurality of module bays for receiving a module and aligning a back end of the module for blind docking with the power supply. A compute module is received in a module bay and directly blind docked to the power supply. The system further includes at least one other module received in a module bay within the same chassis as the compute module and directly blind docked with the same power supply along with the compute module. The at least one other module is interchangeably selected from the group consisting of a second compute module and an expansion module, wherein the one or more components of the expansion module are controlled by the motherboard of the compute module within the same chassis.
摘要翻译： 一种用于接收和支持连接到网络的多个设备的系统。 该系统包括一个机架，其具有前侧，提供对多个机箱托架的访问，用于接收底盘并使底盘的后端与电源盲对接。 机箱包括电源，风扇和前侧，提供对多个模块托架的访问，用于接收模块并对准模块的后端以与电源盲对接。 一个计算模块被接收在一个模块托架中，并且直接盲接在电源上。 该系统还包括至少一个其它模块，其接收在与计算模块相同的底盘内的模块托架中，并与计算模块一起直接与对置的同一电源对接。 所述至少一个其他模块可从由第二计算模块和扩展模块组成的组中可互换地选择，其中所述扩展模块的所述一个或多个组件由所述计算模块的所述主板在同一机架内控制。
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公开(公告)号：US07612446B2
公开(公告)日：2009-11-03
申请号：US11604152
申请日：2006-11-22
申请人： Hien P. Dang , Vinod Kamath , Vijayeshwar D. Khanna , Gerard McVicker , Sri M. Sri-Jayantha , Jung H. Yoon
发明人： Hien P. Dang , Vinod Kamath , Vijayeshwar D. Khanna , Gerard McVicker , Sri M. Sri-Jayantha , Jung H. Yoon
CPC分类号： H01L23/4093 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module; openings at a left-side, right-side and a bottom of the structure for easily affixing and removing the structure from the in-line chip module; a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and comprising an angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface; a center horizontal part; a gap between the center horizontal part and the plurality of chips; and a flared bottom area of the structure.
摘要翻译： 用于直列芯片模块的弹簧状冷却结构由具有前侧和后侧的导热材料的连续片材形成，所述片材以基本上以一百八十度的角度折叠，其中长度 的结构基本上与直列芯片模块的长度相关，并且该结构的宽度比直列芯片模块的宽度宽，使得该结构适合于并且基本上围绕在线芯片模块; 在结构的左侧，右侧和底部的开口，用于容易地从线内芯片模块固定和移除结构; 顶部，其包括顶部表面，所述顶部表面设置在所述直列芯片模块的顶部上，当固定到所述在线芯片模块时，并且包括从所述直列芯片模块向外扩张的成角度的表面， 顶面 中心水平部分; 中心水平部分和多个芯片之间的间隙; 和结构的扩口底部区域。
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公开(公告)号：US07595986B2
公开(公告)日：2009-09-29
申请号：US11936104
申请日：2007-11-07
IPC分类号： H05K7/20
CPC分类号： H05K7/20727 , G06F1/20
摘要： Computer chassis configured for controlled airflow including at least one component board; a segmented curtain suspended across a region of airflow in the computer chassis above the component board; and at least one component mounted on the component board displacing at least one segment of the segmented curtain creating an airflow channel under the displaced segment. Segmented curtains for controlling airflow in a computer chassis including one or more segments capable of being displaced by components mounted on a component board in the computer chassis; and one or more fasteners for suspending the segmented curtain across a region of airflow in the computer chassis. Controlling airflow in a computer chassis including inserting a component board into the computer chassis; displacing, a segment of a segmented curtain thereby creating an airflow channel; and providing airflow through the airflow channel created by the displacement of the segment of the segmented curtain.
摘要翻译： 配置用于受控气流的计算机机箱，包括至少一个组件板; 分段幕帘悬挂在组件板上方的计算机机箱中的气流区域; 以及安装在所述部件板上的至少一个部件移动所述分段幕的至少一个部分，从而在所述移位部分下面形成气流通道。 用于控制计算机机箱中的气流的分段帘幕，包括能够被安装在计算机机箱中的部件板上的部件移位的一个或多个部分; 以及一个或多个紧固件，用于将分段的帘幕悬挂在计算机机箱中的气流区域中。 控制计算机机箱中的气流，包括将组件板插入计算机机箱; 移位分段帘幕的一段，从而形成气流通道; 并且通过由分段帘幕的段的位移产生的气流通道提供气流。
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公开(公告)号：US20060221578A1
公开(公告)日：2006-10-05
申请号：US11093445
申请日：2005-03-30
申请人： Jimmy Foster , Michael June , Vinod Kamath , Beth Loebach , Albert Makley , Jason Matteson
发明人： Jimmy Foster , Michael June , Vinod Kamath , Beth Loebach , Albert Makley , Jason Matteson
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , G06F1/184 , G06F1/185 , G06F1/186 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A h9eat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.
摘要翻译： 用于常规存储器模块（例如DIMM）的h9接收器设备，其被配置为定位在安装在印刷电路板上的基本上平行的连接器中的相邻存储器模块之间。 每个散热装置包括配置成与常规存储器模块的电子部件热耦合的导热第一和第二部件。 第一和第二构件可以被弹性地偏离彼此偏离，使得当放置在相邻的存储器模块之间时，弹性偏置使得构件邻接相应的电子部件。 可以提供单独的楔形物或杠杆安装的楔形物，用于插入在构件之间以将它们彼此远离并且与邻近的存储器模块的相对表面上的电子部件邻接。 当抵靠相对的电子部件时，单个散热器件便于从两个相邻的存储器模块散热。
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49.发明申请Mechanism for maintaining consistent thermal interface layer in an integrated circuit assembly 审中-公开在集成电路组件中保持一致的热界面层的机构公开(公告)号：US20050133907A1
公开(公告)日：2005-06-23
申请号：US10744835
申请日：2003-12-23
申请人： Thomas Hildner , Vinod Kamath
发明人： Thomas Hildner , Vinod Kamath
IPC分类号： H01L23/36 , H01L23/427 , H01L23/34
CPC分类号： H01L23/4275 , H01L23/36 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit assembly includes an integrated circuit overlying a printed circuit board and a thermal solution interface such as a fan sink or a heat pipe overlying the integrated circuit. The lower surface of the thermal solution interface has a plurality of spacer structures to enforce a uniform displacement between the lower surface and an underlying surface contacted by the spacers. A heat transfer material, such as a thermal phase change material or a thermal grease, is positioned between the thermal solution interface and the underlying surface contacted by the spacers. The assembly may include a socket connected to the printed circuit board into which the integrated circuit is inserted. The spacers likely enforce a uniform displacement in the range of approximately 0.001 to 0.005 inches. The spacers may be configured as a set of substantially hemispherical protrusions or a set of substantially parallel elongated ridge protrusions.
摘要翻译： 集成电路组件包括覆盖印刷电路板的集成电路和诸如风扇接收器或覆盖集成电路的热管的热解决方案接口。 热溶液界面的下表面具有多个间隔结构，以在下表面和与间隔物接触的下表面之间施加均匀位移。 传热材料，例如热相变材料或导热油脂，位于热溶液界面和与间隔物接触的下面的表面之间。 组件可以包括连接到印刷电路板的插座，集成电路插入该插座中。 间隔件可能在大约0.001至0.005英寸的范围内强制均匀位移。 间隔件可以被配置为一组基本上半球形的突起或一组基本上平行的细长突起。
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公开(公告)号：US06445580B1
公开(公告)日：2002-09-03
申请号：US09591011
申请日：2000-06-09
IPC分类号： G06F120
CPC分类号： H01L23/38 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A cooling apparatus, method and article of manufacture are disclosed which provide for selectively providing power to an attached heat-dissipating apparatus having a cooling probe in thermal contact with a cooling unit, to remove heat generated by a heat-generating source within the computer to an external environment outside of the computer. Power may be conserved, portable battery life extended, higher-speed processors utilized, and overall dimensional characteristics of a personal computer may be slimmed and reduced by utilizing the apparatus with a personal computer. Heat energy is transferred across a thermal connection interface from the heat-generating source of the personal computer to a collection face of the apparatus, and thereafter collected heat energy is dissipated in relation to the available power of the power source and/or the planned operating speed of the processor.
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