Device Structures with a Hyper-Abrupt P-N Junction, Methods of Forming a Hyper-Abrupt P-N Junction, and Design Structures for an Integrated Circuit
    41.
    发明申请
    Device Structures with a Hyper-Abrupt P-N Junction, Methods of Forming a Hyper-Abrupt P-N Junction, and Design Structures for an Integrated Circuit 失效
    具有超突发P-N结的器件结构,形成超突发P-N结的方法和集成电路的设计结构

    公开(公告)号:US20090250739A1

    公开(公告)日:2009-10-08

    申请号:US12099316

    申请日:2008-04-08

    IPC分类号: H01L29/93 H01L21/329

    CPC分类号: H01L29/93

    摘要: Device structures with hyper-abrupt p-n junctions, methods of forming hyper-abrupt p-n junctions, and design structures for an integrated circuit containing devices structures with hyper-abrupt p-n junctions. The hyper-abrupt p-n junction is defined in a SOI substrate by implanting a portion of a device layer to have one conductivity type and then implanting a portion of this doped region to have an opposite conductivity type. The counterdoping defines the hyper-abrupt p-n junction. A gate structure carried on a top surface of the device layer operates as a hard mask during the ion implantations to assist in defining a lateral boundary for the hyper-abrupt-n junction.

    摘要翻译: 具有超突变p-n结的器件结构,形成超突变p-n结的方法以及包含具有超突变p-n结的器件结构的集成电路的设计结构。 通过将器件层的一部分注入具有一种导电类型,然后将该掺杂区域的一部分注入具有相反的导电型,在SOI衬底中限定超突变p-n结。 反渗透定义了超突变p-n结。 在离子注入期间,在器件层的顶表面上承载的栅极结构作为硬掩模进行操作,以有助于限定超突变n结的横向边界。

    BICMOS DEVICES ON ETSOI
    44.
    发明申请
    BICMOS DEVICES ON ETSOI 审中-公开
    BICMOS设备在ETSOI

    公开(公告)号:US20130277753A1

    公开(公告)日:2013-10-24

    申请号:US13451806

    申请日:2012-04-20

    摘要: A BiCMOS device structure, method of manufacturing the same and design structure thereof are provided. The BiCMOS device structure includes a substrate having a layer of semiconductor material upon an insulating layer. The BiCMOS device structure further includes a bipolar junction transistor structure formed in a first region of the substrate having an extrinsic base layer formed at least partially from a portion of the layer of semiconductor material.

    摘要翻译: 提供BiCMOS器件结构,其制造方法及其设计结构。 BiCMOS器件结构包括在绝缘层上具有半导体材料层的衬底。 BiCMOS器件结构还包括形成在衬底的第一区域中的双极结型晶体管结构,其具有至少部分地由半导体材料层的一部分形成的非本征基极层。

    Semiconductor device including asymmetric lightly doped drain (LDD) region, related method and design structure
    45.
    发明授权
    Semiconductor device including asymmetric lightly doped drain (LDD) region, related method and design structure 有权
    半导体器件包括非对称轻掺杂漏极(LDD)区域,相关方法和设计结构

    公开(公告)号:US08518782B2

    公开(公告)日:2013-08-27

    申请号:US12963054

    申请日:2010-12-08

    IPC分类号: H01L21/426

    摘要: A semiconductor device is disclosed. The semiconductor device includes a semiconductor substrate including a first source drain region, a second source drain region, and an intrinsic region therebetween; an asymmetric lightly doped drain (LDD) region within the substrate, wherein the asymmetric LDD region extends from the first source drain region into the intrinsic region between the first source drain region and the second source drain region; and a gate positioned atop the semiconductor substrate, wherein an outer edge of the gate overlaps the second source drain region. A related method and design structure are also disclosed.

    摘要翻译: 公开了一种半导体器件。 半导体器件包括:半导体衬底,包括第一源极漏极区域,第二源极漏极区域及其之间的固有区域; 在所述衬底内的不对称轻掺杂漏极(LDD)区域,其中所述不对称LDD区域从所述第一源极漏极区域延伸到所述第一源极漏极区域和所述第二源极漏极区域之间的本征区域; 以及位于所述半导体衬底顶部的栅极,其中所述栅极的外边缘与所述第二源极漏极区重叠。 还公开了相关的方法和设计结构。

    Isolated Zener diode
    46.
    发明授权
    Isolated Zener diode 有权
    隔离齐纳二极管

    公开(公告)号:US08492866B1

    公开(公告)日:2013-07-23

    申请号:US13345881

    申请日:2012-01-09

    摘要: Disclosed is a Zener diode having a scalable reverse-bias breakdown voltage (Vb) as a function of the position of a cathode contact region relative to the interface between adjacent cathode and anode well regions. Specifically, cathode and anode contact regions are positioned adjacent to corresponding cathode and anode well regions and are further separated by an isolation region. However, while the anode contact region is contained entirely within the anode well region, one end of the cathode contact region extends laterally into the anode well region. The length of this end can be predetermined in order to selectively adjust the Vb of the diode (e.g., increasing the length reduces Vb of the diode and vice versa). Also disclosed are an integrated circuit, incorporating multiple instances of the diode with different reverse-bias breakdown voltages, a method of forming the diode and a design structure for the diode.

    摘要翻译: 公开了一种齐纳二极管,其具有作为阴极接触区域相对于相邻阴极和阳极阱区域之间的界面的位置的函数的可分级反向偏压击穿电压(Vb)。 具体地,阴极和阳极接触区域被定位成与相应的阴极和阳极阱区域相邻,并进一步被隔离区域分离。 然而,当阳极接触区域完全包含在阳极阱区域内时,阴极接触区域的一端横向延伸到阳极阱区域中。 为了选择性地调节二极管的Vb(例如,增加长度减小二极管的Vb,反之亦然),可以预定该端的长度。 还公开了一种集成电路,其结合具有不同反向偏压击穿电压的二极管的多个实例,形成二极管的方法和二极管的设计结构。

    SHIELDING FOR HIGH-VOLTAGE SEMICONDUCTOR-ON-INSULATOR DEVICES
    47.
    发明申请
    SHIELDING FOR HIGH-VOLTAGE SEMICONDUCTOR-ON-INSULATOR DEVICES 有权
    用于高压半导体绝缘体器件的屏蔽

    公开(公告)号:US20120319229A1

    公开(公告)日:2012-12-20

    申请号:US13596410

    申请日:2012-08-28

    IPC分类号: H01L27/12

    摘要: Integrated circuits having doped bands in a substrate and beneath high-voltage semiconductor-on-insulator (SOI) devices are provided. In one embodiment, the invention provides an integrated circuit comprising: a semiconductor-on-insulator (SOI) wafer including: a substrate; a buried oxide (BOX) layer atop the substrate; and a semiconductor layer atop the BOX layer; a plurality of high voltage (HV) devices connected in series within the semiconductor layer; a doped band within the substrate and below a first of the plurality of HV devices; and a contact extending from the semiconductor layer and through the BOX layer to the doped band.

    摘要翻译: 提供了在衬底中和在绝缘体上绝缘体(SOI)器件上的高压绝缘体(SOI)器件下面具有掺杂带的集成电路。 在一个实施例中,本发明提供一种集成电路,包括:绝缘体上半导体(SOI)晶片,其包括:基板; 衬底上的掩埋氧化物(BOX)层; 以及位于BOX层顶部的半导体层; 在半导体层内串联连接的多个高压(HV)器件; 在所述衬底内并在所述多个HV器件中的第一个之下的掺杂带; 以及从半导体层和BOX层延伸到掺杂带的接触。

    MULTI-METRIC TRENDING STORYBOARD
    48.
    发明申请
    MULTI-METRIC TRENDING STORYBOARD 审中-公开
    多媒体趋势故事板

    公开(公告)号:US20120284111A1

    公开(公告)日:2012-11-08

    申请号:US13098794

    申请日:2011-05-02

    IPC分类号: G06Q30/00

    CPC分类号: G06Q30/0241

    摘要: A graphical user interface for displaying internet advertising metrics and comparisons of internet advertising metrics is provided. The graphical user interface comprises a trending display area that displays a plurality of trending graphs in the same viewable area. Each trending graph displays a different internet advertising metric and is configured to display a plurality of internet advertising trending comparisons. As well, a detail display area displays a detail view of at least one of the trending graphs. The detail view is in the same viewable area as the plurality of trending graphs.

    摘要翻译: 提供了一种用于显示互联网广告指标和互联网广告指标比较的图形用户界面。 图形用户界面包括在同一可视区域中显示多个趋势图的趋势显示区域。 每个趋势图显示不同的互联网广告指标,并被配置为显示多个互联网广告趋势比较。 同样,细节显示区域显示至少一个趋势图的详细视图。 细节视图与多个趋势图在同一可视区域。

    LATERAL HYPERABRUPT JUNCTION VARACTOR DIODE IN AN SOI SUBSTRATE
    49.
    发明申请
    LATERAL HYPERABRUPT JUNCTION VARACTOR DIODE IN AN SOI SUBSTRATE 有权
    SOI衬底中的横向高压连接变压器二极管

    公开(公告)号:US20120199907A1

    公开(公告)日:2012-08-09

    申请号:US13449419

    申请日:2012-04-18

    IPC分类号: H01L27/12 G06F17/50

    CPC分类号: H01L29/93 H01L29/7391

    摘要: A varactor diode includes a portion of a top semiconductor layer of a semiconductor-on-insulator (SOI) substrate and a gate electrode located thereupon. A first electrode having a doping of a first conductivity type laterally abuts a doped semiconductor region having the first conductivity type, which laterally abuts a second electrode having a doping of a second conductivity type, which is the opposite of the first conductivity type. A hyperabrupt junction is formed between the second doped semiconductor region and the second electrode. The gate electrode controls the depletion of the first and second doped semiconductor regions, thereby varying the capacitance of the varactor diode. A design structure for the varactor diode is also provided.

    摘要翻译: 变容二极管包括绝缘体上半导体(SOI)衬底的顶部半导体层的一部分和位于其上的栅电极。 具有第一导电类型的掺杂的第一电极横向邻接具有第一导电类型的掺杂半导体区域,其横向邻接具有与第一导电类型相反的第二导电类型的掺杂的第二电极。 在第二掺杂半导体区域和第二电极之间形成超破坏结。 栅电极控制第一和第二掺杂半导体区的耗尽,从而改变变容二极管的电容。 还提供了变容二极管的设计结构。

    HIGH-VOLTAGE SEMICONDUCTOR-ON-INSULATOR DEVICE
    50.
    发明申请
    HIGH-VOLTAGE SEMICONDUCTOR-ON-INSULATOR DEVICE 审中-公开
    高压半导体绝缘体器件

    公开(公告)号:US20120132994A1

    公开(公告)日:2012-05-31

    申请号:US12955088

    申请日:2010-11-29

    IPC分类号: H01L27/12 H01L21/322

    CPC分类号: H01L21/84 H01L27/1203

    摘要: Embodiments of the present invention relate generally to semiconductor devices and, more particularly, to a structure for high-voltage (HV) semiconductor-on-insulator (SOI) devices and methods for their formation. In one embodiment, the invention provides a semiconductor-on-insulator (SOI) device comprising: a substrate; an insulator layer atop the substrate; a polysilicon layer atop the insulator layer; a device layer atop the polysilicon layer, the device layer comprising: a P-well; an N-well; and an undoped silicon region between the P-well and the N-well; and a trench isolation adjacent one of the P-well and the N-well and extending through the device layer and the polysilicon layer to the insulator layer.

    摘要翻译: 本发明的实施例大体上涉及半导体器件,更具体地,涉及一种用于高电压(HV)绝缘体上半导体(SOI)器件的结构及其形成方法。 在一个实施例中,本发明提供了一种绝缘体上半导体器件(SOI)器件,包括:衬底; 位于基板顶部的绝缘体层; 在绝缘体层顶上的多晶硅层; 所述多晶硅层顶部的器件层,所述器件层包括:P阱; 一个N井; 以及P阱和N阱之间的未掺杂的硅区; 以及邻近P阱和N阱中的一个的沟槽隔离并延伸穿过器件层和多晶硅层到绝缘体层。