公开(公告)号：US20220071000A1

公开(公告)日：2022-03-03

申请号：US17149664

申请日：2021-01-14

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Shao-Chien Lee ,  John Hon-Shing Lau ,  Chen-Hua Cheng ,  Ra-Min Tain

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/02 ,  H05K3/00

Abstract: The disclosure provides a circuit board structure including at least two sub-circuit boards and at least one connector. Each of the sub-circuit boards includes a plurality of carrier units. The connector is connected between the sub-circuit boards, and a plurality of stress-relaxation gaps are defined between the sub-circuit boards.

公开(公告)号：US20220022317A1

公开(公告)日：2022-01-20

申请号：US17406115

申请日：2021-08-19

Applicant: Unimicron Technology Corp.

Inventor： Yu-Shen Chen ,  I-Ta Tsai ,  Chien-Chih Chen

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/40 ,  H05K1/18

Abstract: An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.

公开(公告)号：US20220022316A1

公开(公告)日：2022-01-20

申请号：US16996911

申请日：2020-08-19

Applicant: Unimicron Technology Corp.

Inventor： Po-Wei Chen ,  Wei-Ti Lin ,  Chun-Hsien Chien

IPC: H05K1/11 ,  H05K3/10 ,  H05K3/46 ,  H05K3/18 ,  H01L23/498

Abstract: A package carrier includes a build-up circuit structure, a first insulation protective layer, a plurality of connection pads, and a plurality of metal balls. The build-up circuit structure has an upper surface. The first insulation protective layer is disposed on the upper surface of the build-up circuit structure and has a plurality of first openings. The connection pads are respectively disposed in the first openings of the first insulation protective layer and are structurally and electrically connected to the build-up circuit structure. Each of the connection pads has an arc-shaped groove. The metal balls are respectively disposed in the arc-shaped groove of the connection pads. The metal balls and the corresponding connection pads define a plurality of bump structures, and a plurality of top surfaces of the bump structures are on a same plane.

公开(公告)号：US20210327861A1

公开(公告)日：2021-10-21

申请号：US16907183

申请日：2020-06-20

Applicant: Unimicron Technology Corp.

Inventor： Ming-Ru Chen ,  Tzyy-Jang Tseng ,  Cheng-Chung Lo

IPC: H01L25/16 ,  H01L33/62

Abstract: A manufacturing method of a light emitting diode (LED) package structure includes the following steps. A carrier is provided. A redistribution layer is formed on the carrier. A plurality of active devices are formed on the carrier. A plurality of LEDs are transferred on the redistribution layer. The LEDs and the active devices are respectively electrically connected to the redistribution layer. The active devices are adapted to drive the LEDs, respectively. A molding compound is formed on the redistribution layer to encapsulate the LEDs. The carrier is removed to expose a bottom surface of the redistribution layer.

公开(公告)号：US20210291740A1

公开(公告)日：2021-09-23

申请号：US17335084

申请日：2021-06-01

Applicant: Unimicron Technology Corp.

Inventor： Shih-Yao Lin ,  An-sheng Lee ,  Ming-Yuan Hsu ,  Meng-Chia Chan

IPC: B60R1/12 ,  G02F1/155 ,  G06F3/041 ,  G02F1/153 ,  B60R1/08

Abstract: A rearview mirror with display function includes a display structure layer, a rearview mirror structure layer, a plastic frame and an electrochromic material. The display structure layer includes a first transparent substrate, a display body layer and a transflective layer on opposite sides of the first transparent substrate. The rearview mirror structure layer is disposed on one side of the display structure layer, and includes a second transparent substrate, a ring-shaped shielding layer, a touch sensing layer, an insulating substrate, and a transparent electrode layer. The ring-shaped shielding layer is disposed around a third surface of the second transparent substrate, and the touch sensing layer covers the third surface and the ring-shaped shielding layer. The ring-shaped shielding layer is electrically insulated from the touch sensing layer. The plastic frame, the transflective layer and the transparent electrode layer define an accommodating space. The electrochromic material is filled in the accommodating space.

公开(公告)号：US20210289614A1

公开(公告)日：2021-09-16

申请号：US16845069

申请日：2020-04-10

Applicant: Unimicron Technology Corp.

Inventor： Chang-Fu Chen ,  Ho-Shing Lee ,  Chien-Chen Lin

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K3/06 ,  H05K1/11

Abstract: A circuit carrier structure includes an inner circuit structure, at least one first circuit layer, and at least one heat dissipating structure. The inner circuit structure has a first surface and a second surface opposite to the first surface. The first circuit layer is disposed on the first surface of the inner circuit structure. The heat dissipating structure is disposed in the first circuit layer. The heat dissipating structure includes a first heat dissipating pattern, a second heat dissipating pattern and an interlayer metal layer. The first heat dissipating pattern is embedded in the corresponding first circuit layer. The second heat dissipating pattern is disposed on the first heat dissipating pattern. The interlayer metal layer is disposed between the first heat dissipating pattern and the second heat dissipating pattern. A manufacturing method of the circuit carrier structure is also provided.

公开(公告)号：US11114782B2

公开(公告)日：2021-09-07

申请号：US16540038

申请日：2019-08-13

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Pei-Wei Wang ,  Ching-Ho Hsieh ,  Shao-Chien Lee ,  Kuo-Wei Li

IPC: H05K1/02 ,  H01R12/62 ,  H05K1/14 ,  H05K1/11 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

公开(公告)号：US11058012B2

公开(公告)日：2021-07-06

申请号：US16544936

申请日：2019-08-20

Applicant: Unimicron Technology Corp.

Inventor： Chien-Chen Lin

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/32 ,  H05K3/46

Abstract: A circuit board structure includes a circuit layer structure, an electronic component, and a stopper. The circuit layer structure includes a plurality of dielectric layers and circuits in the dielectric layers. The electronic component is disposed in the circuit layer structure; the electronic component includes a chip and a conductive bump; the chip has a first surface and a second surface that are oppositely disposed, and the first surface of the chip contacts one of the dielectric layers; the conductive bump is on the second surface of the chip and is electrically connected to the chip. The stopper is within the circuit layer structure and abuts against the conductive bump. A method for fabricating a circuit board structure is also provided herein.

公开(公告)号：US11037869B2

公开(公告)日：2021-06-15

申请号：US16690143

申请日：2019-11-21

Applicant: Unimicron Technology Corp.

Inventor： Fu-Yang Chen ,  Chun-Hsien Chien ,  Cheng-Hui Wu ,  Wei-Ti Lin

IPC: H01L21/48 ,  H01L23/498

Abstract: A method of preparing a package structure is provided, which includes providing a carrier plate including a supporting layer, a first release layer, and a first metal layer; forming a first dielectric layer over the first metal layer, the first dielectric layer having a plurality of holes, each of the holes having an end portion substantially coplanar with each other at a same plane; forming a plurality of conductive protrusions filling the holes, each of the conductive protrusions having a first end and a second end opposite thereto; forming a circuit layer structure including at least one circuit layer and at least one second dielectric layer, the circuit layer being connected to the second end, the second dielectric layer being disposed over the circuit layer; removing the carrier plate; and removing a portion of the first dielectric layer to expose the conductive protrusions. A package structure is also provided.

公开(公告)号：USD919528S1

公开(公告)日：2021-05-18

申请号：US29716933

申请日：2019-12-13

Applicant: Unimicron Technology Corp.

Designer： Shih-Yao Lin ,  Ming-Yuan Hsu ,  Meng-Chia Chan ,  Kuo-Chuan Huang ,  Cheng-Jui Chang