摘要:
An electric soldering iron tip includes a U-shaped metallic heating member formed from an elongated strip of Kovar or other low expansion iron-nickel alloys. The base portion of the Ushaped heating member has an elongated strip of ceramic material, such as beryllium oxide, attached to one side thereof for receiving heat from the heating member and forming a soldering surface for engaging the work to be soldered in order to apply heat thereto for soldering purposes. A second ceramic strip, formed of alumina, is connected to the opposite side of the base portion of the heating member from the first ceramic strip for preventing deformation of the tip due to differences in the coefficients of expansion of the first ceramic strip and the heating member to which it is attached. The ceramic strips are brazed to the heating member to provide a strong bond having excellent thermal conductivity characteristics. The arm sections of the U-shaped heating member are adapted to be connected to a source of electrical energy to effect flow of heating current through the member.
摘要:
A heat flow control system for a heated tool whereby the work engaging tip of the tool is maintained at a low temperature during standby periods to retard tip corrosion but can be almost instantaneously raised to a high working temperature when needed.
摘要:
An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.
摘要:
An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.
摘要:
An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.
摘要:
A solar cell module comprises a solar cell die that is soldered to a substrate. The substrate comprises one or more power contacts. A power conductor is soldered to a power contact, thereby electrically coupling the power conductor to the solar cell die. A pre-heat module heats a first side of the substrate at a first area to a first temperature for a first duration. Then, a solder heat source solders a power conductor to a power contact at a second area of the substrate at a second temperature for a second duration. The resulting solder connection at the power conductor is less prone to cold-solder defects. The temperature of the pre-heat module is controlled to promote curing of an RTV sealant used in the manufacture of the solar cell module. The temperature of the solder heat source is controlled to avoid burning and degrading of the RTV sealant.
摘要:
In a baffle device 20 fixedly provided in an air passage of a mechanism for blowing out hot air to a solder treatment portion, vanes inclined with a predetermined inclination angle with respect to an air flow are provided substantially radially with a predetermined interval. Also, in a nozzle to be attached to the hot air blower for solder treatment, the baffle device 20 is fixedly provided in an in-nozzle air passage. Moreover, in the hot air blower for solder treatment which blows out hot air to the solder treatment portion, the baffle device 20 is fixedly provided in an in-blower air passage.
摘要:
An improvement in a reflow soldering apparatus for bonding a connector element such as flexible circuitry or a pin type input/output (I/O) connector to a printed circuit board (PCB) is disclosed wherein a fixture tray included in the apparatus automatically aligns or self levels itself with the heating bars, or thermodes, of the apparatus. The fixture tray includes a body for supporting the connector/PCB assembly and cylindrical rods extending from the body. The rods are rotatably supported in corresponding grooves on the surface of the fixture tray table. As a thermode is pressed onto the connector/PCB assembly, the fixture tray rotates about its axis of rotation until the work area is aligned with the thermode. In a sandwich type soldering application including a pair of thermodes for simultaneously soldering opposite sides of a connector/PCB assembly, the fixture tray rests on an upper plate of a tray table supported by resilient means such as springs. Pressing an upper thermode onto the upper work surface of the connector/PCB assembly causes the work surface to rotate into alignment with the thermodes, and further causes the upper plate to descend until the bottom work surface of the connector/PCB assembly contacts the lower thermode prior to initiation of a reflow soldering cycle.