摘要:
A resonator device 10 is disclosed. The resonator device may be used in a transducer or a sensor such as a pressure, force or acceleration sensor. The resonator device comprises a resonator 20 provided on a diaphragm 30. A cap 40 is provided which may be fusion bonded to the diaphragm 30 to enclose the resonator 20 and form a hermetically sealed package 10. The resonator device is excited by applying electromagnetic stimulation, such as infra-red or optical stimulation, which may be from a laser via a fibre 50. The resonator device may be interrogated by applying an electromagnetic signal into the optical cavity formed between the resonator 20 and the inside surface of the cap 40 to derive a frequency change of the resonator. As the resonator device incorporates a hermetically sealed package and is stimulated by electromagnetic radiation, it is robust and able to operate in harsh environments.
摘要:
An optically coupled resonator includes a resonator body having at least one resonator sidewall and a laterally offset photodiode formed in a semiconductor substrate adjacent to the resonator body. The resonator is driven by an electric field generated between the laterally offset photodiode and the resonator body when an incident light strikes the photodiode. A device including an optically coupled resonator and a method of operating an optically coupled resonator are also disclosed.
摘要:
A process for fabricating an optically coupled resonant pressure sensor includes the steps of forming a sensor die including at least one optically coupled resonator from a first semiconductor substrate and forming a cap die including a fiber hole from a second semiconductor substrate. The sensor die and the cap die are aligned and bonded to form a resonant pressure sensor capsule. The fiber hole in the cap die is aligned with at least one resonator on the sensor die. Also disclosed is an optically coupled resonant pressure sensor formed from steps thereof.
摘要:
A process to form a laterally offset photodiode for an optically coupled resonator includes implanting a semiconductor substrate to form the laterally offset photodiode adjacent to the resonator. The resonator masks the implanting underneath the resonator when the semiconductor substrate is implanted. Also disclosed is an optically coupled resonator, a process for fabricating an optically coupled resonator, and a device including an optically coupled resonator having a laterally offset photodiode.
摘要:
A pressure sensor is formed on a substrate, the surface of the substrate having a p-n junction and a shell with a beam inside the shell over the p-n junction. The beam and the shell and the p-n junction surface form optical Fabry-Pérot cavities. An optical fiber is positioned in a hole formed in the underside of the substrate below the p-n junction. Light from the fiber charges the p-n junction and drives it into vibration mode. Pressure changes change the tension in the diaphram to vary the frequency with changes in pressure, so that pressure can be detected.
摘要:
A pressure sensor is formed on a substrate, the surface of the substrate having a p-n junction and a shell with a beam inside the shell over the p-n junction. The beam and the shell and the p-n junction surface form optical Fabry-Pnullrot cavities. An optical fiber is positioned in a hole formed in the underside of the substrate below the p-n junction. Light from the fiber charges the p-n junction and drives it into vibration mode. Pressure changes change the tension in the diaphram to vary the frequency with changes in pressure, so that pressure can be detected.
摘要:
A very high temperature microbeam sensor of a resonant integrated microstructure having an electrostatic beam driver and an optical fiber pick-up for sensed light from the beam. The high temperature sensor has no components that are vulnerable to temperatures up to 600 degrees C. Associated components for detection, processing and driving are remote from the sensor environment. By using different materials in the beam assembly, such as tungsten for the beam, and sapphire for the substrate and the shell, the sensor can withstand temperatures up to 1000 degrees C. Also, optical fiber may be used for long distance connections between processing electronics and the driver in the sensing device, by locating a photo detector just outside the very or ultra high temperature sensing environment, and then using optical fiber for sending long distance signals from the processor to the driver photo detector, for eliminating electrical signal-to-noise problems.
摘要:
A micromechnical sensor having a polysilicon beam that is an integral part of the diaphragm resulting in a frequency of the beam that is a direct result of the pressure applied to the external surface of the diaphragm. Fabrication of this resonant microbeam sensor has no backside wafer processing, and involves a process and layout independent of wafer thickness for high yield and robustness. Both the diaphragm and resonant beam are formed from polysilicon. The sensor may have more than one resonant beam. The sensor beam or beams may be driven and sensed by electrical or optical mechanisms. For stress isolation, the sensor may be situated on a cantilevered single crystal silicon paddle. The sensor may be recessed on the isolating die for non-interfering interfacing with optical or electrical devices. The sensor die may be circular for ease in mounting with fiber optic components.
摘要:
The present invention relates to microstructures fabricated from semiconductor material and having a flexible member which is excited into various modes of resonance and in which such resonance is read optically. By coupling the microstructure to a surface or material of interest, a drive means will excite the flexible member into a characteristic resonance which when read optically gives indication of certain physical phenomena influencing the surface or material of interest. The microstructures of the present invention may be configured to self-resonate, as a so-called active device, under certain conditions. Many different physical phenomena may be quantified using the device of the present invention.
摘要:
In a method for monitoring strain variations of a strain responsive element of a micromachined sensor device while subjected to outside parameter conditions, at least two oscillation resonance modes of said element are activated and interrogated optically. Thereby correspondingly at least two resonance frequencies are obtained. From parameter/frequency characteristics of said device correspondingly at least two parameter values are derived.