RESONATOR DEVICE
    41.
    发明申请
    RESONATOR DEVICE 有权
    谐振器装置

    公开(公告)号:US20160191011A1

    公开(公告)日:2016-06-30

    申请号:US14650658

    申请日:2013-12-13

    摘要: A resonator device 10 is disclosed. The resonator device may be used in a transducer or a sensor such as a pressure, force or acceleration sensor. The resonator device comprises a resonator 20 provided on a diaphragm 30. A cap 40 is provided which may be fusion bonded to the diaphragm 30 to enclose the resonator 20 and form a hermetically sealed package 10. The resonator device is excited by applying electromagnetic stimulation, such as infra-red or optical stimulation, which may be from a laser via a fibre 50. The resonator device may be interrogated by applying an electromagnetic signal into the optical cavity formed between the resonator 20 and the inside surface of the cap 40 to derive a frequency change of the resonator. As the resonator device incorporates a hermetically sealed package and is stimulated by electromagnetic radiation, it is robust and able to operate in harsh environments.

    摘要翻译: 公开了一种谐振器装置10。 谐振器装置可以用在换能器或诸如压力,力或加速度传感器的传感器中。 谐振器装置包括设置在隔膜30上的谐振器20.设置盖40,其可以熔接到隔膜30以包围谐振器20并形成气密密封的封装10.通过施加电磁刺激来激发谐振器装置, 例如红外或光学刺激,其可以来自经由光纤50的激光。可以通过将电磁信号施加到形成在谐振器20和盖40的内表面之间的光学腔中来询问谐振器装置,以导出 谐振器的频率变化。 由于谐振器装置包含密封的封装并且被电磁辐射刺激,所以它是坚固的并且能够在恶劣的环境中操作。

    Optically coupled resonator
    42.
    发明授权
    Optically coupled resonator 有权
    光耦合谐振器

    公开(公告)号:US07605391B2

    公开(公告)日:2009-10-20

    申请号:US11164915

    申请日:2005-12-10

    申请人: David W. Burns

    发明人: David W. Burns

    IPC分类号: H01L27/14 H01L31/00 H01L29/82

    CPC分类号: G01L9/002

    摘要: An optically coupled resonator includes a resonator body having at least one resonator sidewall and a laterally offset photodiode formed in a semiconductor substrate adjacent to the resonator body. The resonator is driven by an electric field generated between the laterally offset photodiode and the resonator body when an incident light strikes the photodiode. A device including an optically coupled resonator and a method of operating an optically coupled resonator are also disclosed.

    摘要翻译: 光耦合谐振器包括具有至少一个谐振器侧壁和形成在与谐振器本体相邻的半导体衬底中的侧向偏移光电二极管的谐振器本体。 当入射光照射到光电二极管时,谐振器由横向偏移光电二极管和谐振器本体之间产生的电场驱动。 还公开了一种包括光耦合谐振器的装置和一种操作光耦合谐振器的方法。

    Optically coupled resonant pressure sensor and process
    43.
    发明授权
    Optically coupled resonant pressure sensor and process 有权
    光耦谐振压力传感器和工艺

    公开(公告)号:US07499604B1

    公开(公告)日:2009-03-03

    申请号:US11164914

    申请日:2005-12-10

    申请人: David W. Burns

    发明人: David W. Burns

    IPC分类号: G02B6/00

    摘要: A process for fabricating an optically coupled resonant pressure sensor includes the steps of forming a sensor die including at least one optically coupled resonator from a first semiconductor substrate and forming a cap die including a fiber hole from a second semiconductor substrate. The sensor die and the cap die are aligned and bonded to form a resonant pressure sensor capsule. The fiber hole in the cap die is aligned with at least one resonator on the sensor die. Also disclosed is an optically coupled resonant pressure sensor formed from steps thereof.

    摘要翻译: 一种用于制造光耦合谐振压力传感器的方法包括以下步骤:从第一半导体衬底形成包括至少一个光耦合谐振器的传感器管芯,并形成包括来自第二半导体衬底的光纤孔的帽模。 传感器芯片和盖模具对准并结合以形成共振压力传感器胶囊。 盖模具中的光纤孔与传感器裸片上的至少一个谐振器对准。 还公开了由其步骤形成的光耦合谐振压力传感器。

    Optically coupled sealed-cavity resonator and process
    44.
    发明授权
    Optically coupled sealed-cavity resonator and process 有权
    光耦合密封腔谐振器和工艺

    公开(公告)号:US07176048B1

    公开(公告)日:2007-02-13

    申请号:US10905036

    申请日:2004-12-12

    申请人: David W. Burns

    发明人: David W. Burns

    IPC分类号: H01L21/00

    摘要: A process to form a laterally offset photodiode for an optically coupled resonator includes implanting a semiconductor substrate to form the laterally offset photodiode adjacent to the resonator. The resonator masks the implanting underneath the resonator when the semiconductor substrate is implanted. Also disclosed is an optically coupled resonator, a process for fabricating an optically coupled resonator, and a device including an optically coupled resonator having a laterally offset photodiode.

    摘要翻译: 形成用于光耦合谐振器的横向偏移光电二极管的工艺包括:注入半导体衬底以形成与谐振器相邻的侧向偏移光电二极管。 当植入半导体衬底时,谐振器掩盖在谐振器下方的注入。 还公开了光耦合谐振器,用于制造光耦合谐振器的工艺,以及包括具有侧向偏移光电二极管的光耦合谐振器的器件。

    Optical pressure sensor
    45.
    发明授权
    Optical pressure sensor 有权
    光学压力传感器

    公开(公告)号:US06894787B2

    公开(公告)日:2005-05-17

    申请号:US10036629

    申请日:2001-12-21

    IPC分类号: G01L9/00 G01B9/02

    CPC分类号: G01L9/002

    摘要: A pressure sensor is formed on a substrate, the surface of the substrate having a p-n junction and a shell with a beam inside the shell over the p-n junction. The beam and the shell and the p-n junction surface form optical Fabry-Pérot cavities. An optical fiber is positioned in a hole formed in the underside of the substrate below the p-n junction. Light from the fiber charges the p-n junction and drives it into vibration mode. Pressure changes change the tension in the diaphram to vary the frequency with changes in pressure, so that pressure can be detected.

    摘要翻译: 在衬底上形成压力传感器,衬底的表面具有p-n结,壳体上具有在壳体内的光束在p-n结上。 光束和外壳以及p-n结表面形成光学法布里 - 珀罗腔。 光纤被定位在形成在p-n结下面的衬底下侧的孔中。 来自光纤的光对p-n结进行充电并将其驱动到振动模式。 压力变化改变了膜中的张力,随着压力的变化而改变频率,从而可以检测压力。

    Optical pressure sensor
    46.
    发明申请
    Optical pressure sensor 有权
    光学压力传感器

    公开(公告)号:US20040244502A1

    公开(公告)日:2004-12-09

    申请号:US10884292

    申请日:2004-07-02

    IPC分类号: G01T001/10

    CPC分类号: G01L9/002

    摘要: A pressure sensor is formed on a substrate, the surface of the substrate having a p-n junction and a shell with a beam inside the shell over the p-n junction. The beam and the shell and the p-n junction surface form optical Fabry-Pnullrot cavities. An optical fiber is positioned in a hole formed in the underside of the substrate below the p-n junction. Light from the fiber charges the p-n junction and drives it into vibration mode. Pressure changes change the tension in the diaphram to vary the frequency with changes in pressure, so that pressure can be detected.

    摘要翻译: 在衬底上形成压力传感器,衬底的表面具有p-n结,壳体上具有在壳体内的光束在p-n结上。 光束和外壳以及p-n结表面形成光学法布里 - 珀罗腔。 光纤被定位在形成在p-n结下面的衬底下侧的孔中。 来自光纤的光对p-n结进行充电并将其驱动到振动模式。 压力变化改变了膜中的张力,随着压力的变化而改变频率,从而可以检测压力。

    High temperature resonant integrated microstructure sensor
    47.
    发明授权
    High temperature resonant integrated microstructure sensor 失效
    高温谐振集成微结构传感器

    公开(公告)号:US6031944A

    公开(公告)日:2000-02-29

    申请号:US999165

    申请日:1997-12-30

    摘要: A very high temperature microbeam sensor of a resonant integrated microstructure having an electrostatic beam driver and an optical fiber pick-up for sensed light from the beam. The high temperature sensor has no components that are vulnerable to temperatures up to 600 degrees C. Associated components for detection, processing and driving are remote from the sensor environment. By using different materials in the beam assembly, such as tungsten for the beam, and sapphire for the substrate and the shell, the sensor can withstand temperatures up to 1000 degrees C. Also, optical fiber may be used for long distance connections between processing electronics and the driver in the sensing device, by locating a photo detector just outside the very or ultra high temperature sensing environment, and then using optical fiber for sending long distance signals from the processor to the driver photo detector, for eliminating electrical signal-to-noise problems.

    摘要翻译: 具有静电束驱动器和用于来自光束的感测光的光纤拾取器的谐振集成微结构的非常高温的微束传感器。 高温传感器没有易受温度高达600摄氏度影响的组件。用于检测,处理和驱动的相关组件远离传感器环境。 通过在梁组件中使用不同的材料,例如用于梁的钨,以及用于衬底和壳的蓝宝石,传感器可以承受高达1000摄氏度的温度。此外,光纤可用于处理电子器件之间的长距离连接 以及感测装置中的驱动器,通过将光电检测器定位在非常或超高温感测环境之外,然后使用光纤将长距离信号从处理器发送到驱动器光电检测器,以消除电信号 - 噪音问题。

    Thin film resonant microbeam absolute pressure sensor
    48.
    发明授权
    Thin film resonant microbeam absolute pressure sensor 失效
    薄膜谐振微波绝对压力传感器

    公开(公告)号:US5808210A

    公开(公告)日:1998-09-15

    申请号:US777651

    申请日:1996-12-31

    IPC分类号: G01L9/00 G01C11/00

    CPC分类号: G01L9/002

    摘要: A micromechnical sensor having a polysilicon beam that is an integral part of the diaphragm resulting in a frequency of the beam that is a direct result of the pressure applied to the external surface of the diaphragm. Fabrication of this resonant microbeam sensor has no backside wafer processing, and involves a process and layout independent of wafer thickness for high yield and robustness. Both the diaphragm and resonant beam are formed from polysilicon. The sensor may have more than one resonant beam. The sensor beam or beams may be driven and sensed by electrical or optical mechanisms. For stress isolation, the sensor may be situated on a cantilevered single crystal silicon paddle. The sensor may be recessed on the isolating die for non-interfering interfacing with optical or electrical devices. The sensor die may be circular for ease in mounting with fiber optic components.

    摘要翻译: 一种微技术传感器,其具有作为隔膜的整体部分的多晶硅束,其导致直接由施加到隔膜的外表面的压力导致的光束的频率。 这种谐振微束传感器的制造没有背面晶片处理,并且涉及与晶片厚度无关的工艺和布局,用于高产率和鲁棒性。 膜片和谐振光束均由多晶硅形成。 传感器可以具有多于一个谐振波束。 传感器光束或光束可以由电或光学机构驱动和感测。 对于应力隔离,传感器可以位于悬臂单晶硅片上。 传感器可以凹入隔离管芯,用于与光学或电气设备的非干扰接口。 传感器芯片可以是圆形的,以便于光纤部件的安装。

    Micromachined sensor device using a beam of light with a frequency swept
modulated intensity to activate at least two resonance modes of the
sensor element
    50.
    发明授权
    Micromachined sensor device using a beam of light with a frequency swept modulated intensity to activate at least two resonance modes of the sensor element 失效
    使用具有频率扫描调制强度的光束来激活传感器元件的至少两个谐振模式的微加工传感器装置

    公开(公告)号:US5338929A

    公开(公告)日:1994-08-16

    申请号:US24995

    申请日:1993-03-02

    IPC分类号: G01L1/10 G01L9/00

    CPC分类号: G01L9/002 G01L1/103

    摘要: In a method for monitoring strain variations of a strain responsive element of a micromachined sensor device while subjected to outside parameter conditions, at least two oscillation resonance modes of said element are activated and interrogated optically. Thereby correspondingly at least two resonance frequencies are obtained. From parameter/frequency characteristics of said device correspondingly at least two parameter values are derived.

    摘要翻译: 在用于监测微机械传感器装置的应变响应元件的受到外部参数条件的应变变化的方法中,所述元件的至少两个振荡谐振模式被激活并被光学询问。 从而相应地获得至少两个谐振频率。 从所述装置的参数/频率特性相应地导出至少两个参数值。