RESET CIRCUIT, CORRESPONDING DEVICE AND METHOD
    541.
    发明申请

    公开(公告)号:US20190354152A1

    公开(公告)日:2019-11-21

    申请号:US16405086

    申请日:2019-05-07

    Abstract: A circuit includes a first node configured to receive a reset signal. A reset drive stage drives a reset node. The reset drive stage is coupled to the first node via a reset signal path to propagate the reset signal to the reset drive stage. The reset drive stage is activated as a result of assertion of a reset actuation state of the reset signal. A sensing node is coupled to the reset node via a signal sensing path. The sensing node is sensitive to a signal level of the reset node reaching a reset threshold. A reset signal hold circuit block is coupled to the first node and is configured to receive a reset command signal and assert the reset actuation state of the reset signal at the first node as a result of the reset command signal received.

    INTERFACE ELECTRONIC CIRCUIT FOR A MICROELECTROMECHANICAL ACOUSTIC TRANSDUCER AND CORRESPONDING METHOD

    公开(公告)号:US20190326867A1

    公开(公告)日:2019-10-24

    申请号:US16378872

    申请日:2019-04-09

    Abstract: In at least one embodiment, an interface electronic circuit for a capacitive acoustic transducer having a sensing capacitor is provided. The interface electronic circuit includes an amplifier, a voltage regulator, a common-mode control circuit, and a reference generator. The amplifier has an input coupled to an electrode of the sensing capacitor. The voltage regulator is configured to receive a regulator reference voltage, generate a regulated voltage based on the regulator reference voltage, and supply the regulated voltage to a supply input of the amplifier. The common-mode control circuit controls a common-mode voltage present on the input of the amplifier based on a common-mode reference voltage. The reference generator receives a supply voltage and generates the regulator reference voltage and the common-mode reference voltage with respective values that are variable as a function of the supply voltage.

    PROCESS FOR MANUFACTURING A STRAINED SEMICONDUCTOR DEVICE AND CORRESPONDING STRAINED SEMICONDUCTOR DEVICE

    公开(公告)号:US20190326231A1

    公开(公告)日:2019-10-24

    申请号:US16389849

    申请日:2019-04-19

    Abstract: A process for manufacturing a strained semiconductor device envisages: providing a die of semiconductor material, in which elementary components of the semiconductor device have been integrated by means of initial front-end steps; and coupling, using the die-attach technique, the die to a support, at a coupling temperature. The aforesaid coupling step envisages selecting the value of the coupling temperature at a value higher than an operating temperature of use of the semiconductor device, and moreover selecting the material of the support so that it is different from the material of the die in order to determine, at the operating temperature, a coupling stress that is a function of the different values of the coefficients of thermal expansion of the materials of the die and of the support and of the temperature difference between the coupling temperature and the operating temperature. Furthermore, additional stress can be enhanced by means of different embodiments involving the support, such as ring or multi-layer frame.

    DRIVE CIRCUIT FOR HALF-BRIDGES, CORRESPONDING DRIVER, DEVICE AND METHOD

    公开(公告)号:US20190319617A1

    公开(公告)日:2019-10-17

    申请号:US16375233

    申请日:2019-04-04

    Abstract: A dead-time circuit includes a signal propagation path from a first input node receiving a PWM modulated control signal to an output node, such signal propagation path switchable between a non-conductive state and a conductive state, such that the signal at the first input node is transferred to the output node when the signal propagation path is in the conductive state. The dead-time circuit further includes a differentiator circuit block coupled to a second input node and to the signal propagation path, the second input node configured to be coupled to an intermediate node of a half-bridge circuit. The differentiator circuit block switches the signal propagation path between the non-conductive state and the conductive state as a function of a time derivative of a signal at the second input node. At least one time-delay circuit component delays transfer of the signal at the first input node to the output node.

    Power Supply System
    549.
    发明申请
    Power Supply System 审中-公开

    公开(公告)号:US20190319538A1

    公开(公告)日:2019-10-17

    申请号:US16385284

    申请日:2019-04-16

    Abstract: A power supply system includes a voltage application source, and a switched mode power supply having an output coupled to the voltage application source through a first path and through a second path different from the first path. A first node is coupled to the output of the switched mode power supply, the switched mode power supply being configured to couple the first node to the voltage application source through the first path in a first operating mode and through the second path in a different second operating mode. A digital regulator is coupled to the first node. A digital circuit is coupled to an output of the digital regulator. An analog regulator is coupled to the first node and an analog circuit coupled to an output of the analog regulator.

    BALLISTIC TRANSPORT DEVICE AND CORRESPONDING COMPONENT

    公开(公告)号:US20190312136A1

    公开(公告)日:2019-10-10

    申请号:US16377080

    申请日:2019-04-05

    Abstract: A device includes a particle propagation channel, a particle deflector, a particle source, and a particle sink. The particle deflector facilitates ballistic transport of particles from a particle inflow portion through a particle flow deflection portion to a particle outflow portion. The particle deflector is arranged at the particle flow deflection portion and is activatable to deflect particles in the flow deflection portion and is configured to selectively prevent the particles from reaching the particle outflow portion. The particle source and particle sink are configured to cause a current path of the particles through the device.

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