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公开(公告)号：US20240324158A1
公开(公告)日：2024-09-26
申请号：US18672815
申请日：2024-05-23
发明人： Yoshihito OTSUBO , Morio TAKEUCHI
CPC分类号： H05K9/0081 , H05K1/0233
摘要： A module includes: a first substrate having a first surface and a second surface facing opposite sides; and a second substrate having a third surface and a fourth surface facing opposite sides, wherein the second substrate is disposed to overlap the first substrate with the third surface facing the first substrate, while being spaced apart from the first substrate on the second surface side of the first substrate, the first substrate and the second substrate are electrically connected, an inductor is mounted on the third surface, and at least one shield electrode is fixed to the first substrate with the shield electrode being positioned so as to cross a path of a magnetic flux, and each of the at least one shield electrode is grounded.
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公开(公告)号：US20240322793A1
公开(公告)日：2024-09-26
申请号：US18736605
申请日：2024-06-07
发明人： Kazunori INOUE
CPC分类号： H03H9/585 , H03H9/02031 , H03H9/02118 , H03H9/02157 , H03H9/02228 , H03H9/173 , H03H9/176 , H03H9/581 , H03H9/587 , H03H9/605 , H03H9/703
摘要： An acoustic wave device includes a first piezoelectric layer including a first main surface and a second main surface, a first support portion including a first support substrate that overlaps the first piezoelectric layer in a first direction, a first resonator provided on at least the first main surface of the first piezoelectric layer, a second piezoelectric layer including a third main surface and a fourth main surface, a second support portion including a second support substrate overlapping the second piezoelectric layer in the first direction, and a second resonator provided on at least the third main surface of the second piezoelectric layer. The first resonator and the second resonator each include a functional electrode. The support portion includes a space portion that overlaps at least a portion of the functional electrode of the resonator in a plan view in the first direction.
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53.发明公开公开(公告)号：US20240321946A1
公开(公告)日：2024-09-26
申请号：US18614450
申请日：2024-03-22
IPC分类号： H01L23/00
CPC分类号： H01L28/91 , H01L24/13 , H01L28/92 , H01L24/04 , H01L24/05 , H01L2224/0401 , H01L2224/05647 , H01L2224/13021 , H01L2224/13147
摘要： An integrated device that includes: a substrate; a metal barrier layer above the substrate; a layer including a porous region of anodized metal having a plurality of substantially straight pores that extend from a top surface of the porous region, perpendicularly to the top surface of the porous region, towards the metal barrier layer so as to reach the metal barrier layer, wherein the porous region includes a zone of pores that open onto the metal barrier layer surrounded by peripheral pores that are plugged up at their bottom ends by an oxide plug of the metal barrier, and the porous region further includes: an island of pores plugged up at their bottom end by an oxide plug of the metal barrier, and/or a protuberance of pores plugged up at their bottom end by an oxide plug of the metal barrier.
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54.发明公开公开(公告)号：US20240321782A1
公开(公告)日：2024-09-26
申请号：US18614266
申请日：2024-03-22
发明人： Sébastien IOCHEM , Stéphane BOUVIER
IPC分类号： H01L23/62 , H01L21/027 , H01L25/16 , H01L27/06
CPC分类号： H01L23/62 , H01L21/0274 , H01L25/16 , H01L27/0682 , H01L27/0688 , H01L28/90
摘要： A resistor-capacitor component that includes: a capacitor having at least a first electrode structure and a second electrode structure separated by a dielectric structure; an insulating layer on the second electrode structure, the insulating layer having contact holes distributed across a surface of the insulating layer, each of the contact holes delimiting an opening onto the second electrode structure having a corrugated edge; and a conductive layer on the insulating layer and filling the contact holes to form electrical contacts with the second electrode structure.
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公开(公告)号：US20240321516A1
公开(公告)日：2024-09-26
申请号：US18678525
申请日：2024-05-30
发明人： Takuya GOITSUKA
摘要： To provide ceramic electronic component capable of increasing strength of identification mark against physical impact from outside while suppressing decrease in recognition accuracy of identification mark. Ceramic electronic component includes element body containing ceramic as main material, and identification mark formed on surface of element body, at least a part of identification mark protruding from surface of element body. Element body includes first portion that surrounds identification mark and is in contact with outer edge portion of identification mark when viewed from thickness direction orthogonal to surface of element body, and second portion surrounding first portion when viewed from thickness. First portion is raised with respect to second portion.
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公开(公告)号：US20240321487A1
公开(公告)日：2024-09-26
申请号：US18671036
申请日：2024-05-22
发明人： Tomoya OOSHIMA , Yuuta HOSHINO , Mitsuru NAKANO , Koichi YAMADA , Miki SASAKI
CPC分类号： H01C7/041 , H01C1/1413
摘要： An electronic component that includes: a base body; a glass film covering at least a part of an outer surface of the base body; and an underlayer electrode covering a part of a surface of the glass film, wherein the base body contains a Mn oxide, the underlayer electrode contains a conductive metal and a glass component, the base body has a reaction layer containing a composite oxide of Mn and the conductive metal at an end portion of the underlayer electrode, and the reaction layer has a void.
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公开(公告)号：US12100885B2
公开(公告)日：2024-09-24
申请号：US16998335
申请日：2020-08-20
发明人： Takatoshi Kato
CPC分类号： H01Q1/2283 , H01L23/66 , H01P5/028 , H01P5/08
摘要： A millimeter wave module includes an insulating substrate, signal conductor patterns, ground conductor patterns, and a connection member. The connection member is disposed between the signal conductor patterns in the thickness direction and electrically connects the signal conductor patterns. The connection member includes a first conductive member, a second conductive member, and a dielectric block. The connection member has a structure in which the first conductive member and the second conductive member sandwich a dielectric block therebetween. The first conductive member is connected to the signal conductor patterns. The second conductive member is connected to the ground conductor pattern.
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公开(公告)号：US20240313744A1
公开(公告)日：2024-09-19
申请号：US18602414
申请日：2024-03-12
发明人： Kouji YAMAGUCHI , Sho OKAMOTO , Muneharu KATO
CPC分类号： H03H19/004 , H03H7/0115 , H03H2001/0085
摘要： A tracker module is provided that includes a module laminate, an IC chip disposed at the module laminate, and a filter circuit including a plurality of inductors. The IC chip includes at least one switch included in a switched-capacitor circuit and at least one switch included in a supply modulator. The plurality of inductors include a first inductor and a second inductor that are disposed at the module laminate. The first inductor and the second inductor are adjacent to each other. A magnetic flux direction of the first inductor and a magnetic flux direction of the second inductor are perpendicular to each other.
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公开(公告)号：US20240313714A1
公开(公告)日：2024-09-19
申请号：US18598394
申请日：2024-03-07
发明人： Tatsuya BANNO , Atsushi HIRONO , Kazuto HIRAI
CPC分类号： H03F3/195 , H01L23/66 , H01L25/16 , H03F3/245 , H01L2223/6616 , H01L2223/6677 , H03F2200/451
摘要： A tracker module includes a module laminate, a first IC chip, and a second IC chip. The first IC chip is disposed on the module laminate. The second IC chip is configured to control a power amplifier. The first IC chip includes at least one switch included in a switched-capacitor circuit and at least one switch included in a supply modulator. The switched-capacitor circuit is configured to generate a plurality of discrete voltages based on an input voltage, and the supply modulator is configured to selectively output at least one of the plurality of discrete voltages to the power amplifier. The second IC chip is disposed on the module laminate and coupled to the first IC chip.
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公开(公告)号：US12095448B2
公开(公告)日：2024-09-17
申请号：US17497961
申请日：2021-10-10
发明人： Patrick Turner , Mike Eddy , Andrew Kay , Ventsislav Yantchev
CPC分类号： H03H9/25 , H03H9/02228 , H03H9/02992 , H03H9/105 , H03H9/1085 , H03H9/586 , H03H9/6406
摘要： Methods of making acoustic resonator devices and filters are disclosed. A method of fabricating an acoustic resonator device includes fabricating an acoustic resonator chip including: attaching a back surface of a piezoelectric plate to a front surface of a substrate, such that portions of the piezoelectric plate form at least first and second diaphragms spanning at least first and second cavities, and forming a first conductor pattern as one or more conductor layers on the piezoelectric plate. The first conductor pattern includes at least first and second interdigitated transducers (IDTs) and a first plurality of contact pads. The method further includes fabricating an interposer having front and back surface and a second plurality of contact pads on the interposer back surface, forming conductive balls, and bonding each of the first plurality of contact pads to a respective pad of the second plurality of contact pads using the respective conductive ball.
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