Apparatus for synchronous ethernet
    51.
    发明授权

    公开(公告)号:US12130770B2

    公开(公告)日:2024-10-29

    申请号:US18125483

    申请日:2023-03-23

    CPC classification number: G06F13/4291 G06F2213/0016 G06F2213/0026

    Abstract: An apparatus for synchronous Ethernet comprises a processor, a field programmable gate array, a synchronizer, a physical layer implementor and a media accessing controller, wherein, the processor transmits a control data through a first transmission interface; the field programmable gate array receives the control data, generates a control instruction in accordance with the control data and transmits the control instruction through a second transmission interface; the synchronizer receives the control instruction and generates a synchronous clock in accordance with the control instruction; and each of the physical layer implementor and the media accessing controller receives and works in accordance with the synchronous clock and media accessing control protocol.

    Loudspeaker control system
    52.
    发明授权

    公开(公告)号:US11979720B2

    公开(公告)日:2024-05-07

    申请号:US17832725

    申请日:2022-06-06

    Inventor: Tzu-Chih Lin

    Abstract: A system for automatically adjusting a volume of a loudspeaker includes a loudspeaker and a processor. An infrared sensor, which generates a sensing signal when sensing IR radiation from a heat-radiating source, is disposed on the loudspeaker. The sensing signal provides a size information commensurate with a size of the heat-radiating source. The processor receives a plurality of the sensing signals at different time points to obtain a plurality of corresponding size information, realizes a change of distance between the heat-radiating source and the loudspeaker according to a change of the size information, and generates a volume-adjusting signal according to the change of distance between the heat-radiating source and the loudspeaker. The volume-adjusting signal is transmitted to the loudspeaker to adjust the volume of the loudspeaker accordingly.

    Mounting seat for doorbell and doorbell assembly

    公开(公告)号:US11927209B2

    公开(公告)日:2024-03-12

    申请号:US17743076

    申请日:2022-05-12

    CPC classification number: F16B2/02 G03B17/561

    Abstract: A mounting seat is connected to a doorbell includes a mounting portion, an extendable portion, and a connecting portion. The mounting portion is connected to a mounting surface. The extendable portion is connected to the mounting portion. The extendable portion could be extended or retracted by exerting force. The extendable portion includes a first extendable section and a second extendable section. The connecting portion is connected between the extendable portion and the doorbell. When the first extendable section is extended or retracted relative to the mounting portion, the extendable portion drives the connecting portion and the doorbell to turn along a first axis. When the second extendable section is extended or retracted relative to the mounting portion, the extendable portion drives the connecting portion and the doorbell to turn along a second axis. The first axis is not parallel to the second axis.

    Aluminum or copper foil heat dissipator and electronic device having the same

    公开(公告)号:US11864356B2

    公开(公告)日:2024-01-02

    申请号:US17706004

    申请日:2022-03-28

    Inventor: Tzu-Chih Lin

    CPC classification number: H05K7/20454

    Abstract: An electronic device having an aluminum or copper foil heat dissipator includes a casing, an electronic structure disposed in the casing, and an aluminum or copper foil heat dissipator. A surface of the electronic structure has a heat source element. The aluminum or copper foil heat dissipator is a 3D aluminum or copper foil structure formed by stamping and includes a bottom, a surrounding portion, and a 3D space formed between the bottom and the surrounding portion. The bottom is thermal conductively coupled to the heat source element. A surface of the aluminum or copper foil heat dissipator is partially/entirely thermal conductively coupled to an inner surface of the casing. With the characteristics of aluminum or copper foil that is easy to expand into a 3D shape during processing and could closely fit the inner surface, the heat generated by the heat source element could be dissipated from the 3D aluminum or copper foil with a large contact area, achieving better heat dissipation effect.

    THERMAL MODULE
    55.
    发明公开
    THERMAL MODULE 审中-公开

    公开(公告)号:US20230328917A1

    公开(公告)日:2023-10-12

    申请号:US17863209

    申请日:2022-07-12

    Inventor: TZU-CHIH LIN

    CPC classification number: H05K7/20172

    Abstract: A thermal module for being disposed in an electronic device comprises a driving device and at least one thermal device. The driving device includes a driving member and a driven member which are connected together, wherein the driving member is adapted to drive the driven member to operate. The at least one thermal device includes a fan, wherein two opposite ends of the fan respectively have a mating portion and a connecting portion. The mating portion is adapted to be connected to the driven member, so that the driving member drives the driven member to drive the fan to rotate. The connecting portion of the fan is adapted to be connected to the mating portion of a fan of another thermal device, so that when the driving member drives the fan to rotate, the fan drives the fan of the another thermal device to rotate.

    Heat dissipation structure having housing made of high thermal resistance material and electronic apparatus having the same

    公开(公告)号:US11778726B2

    公开(公告)日:2023-10-03

    申请号:US17680341

    申请日:2022-02-25

    CPC classification number: H05K1/0204

    Abstract: A heat dissipation structure and an electronic apparatus having the heat dissipation structure are provided. The electronic apparatus includes a printed circuit board, a high thermal-resisting housing, a thermal pad and a metal bracket. Heat is transferred between the thermal pad and an electronic component mounted on the printed circuit board. The high thermal-resisting housing defines an inner space for accommodating the printed circuit board. A columnar space is formed in the high thermal-resisting housing, and a metal layer is arranged outside the columnar space. The thermal conductivity of the high thermal-resisting housing is not greater than 1 W/m·K. The metal bracket and the printed circuit board are disposed at two opposite sides of the high thermal-resisting housing, respectively. A fastening member penetrates through the metal bracket and is inserted into the columnar space to urge the metal bracket to be in contact with the metal layer.

    Periodic metal array structure
    57.
    发明授权

    公开(公告)号:US11777205B2

    公开(公告)日:2023-10-03

    申请号:US17694666

    申请日:2022-03-15

    CPC classification number: H01Q1/523 H01Q21/0025 H01Q21/065

    Abstract: A periodic metal array structure can be disposed between two antenna modules and include rows of metal unit assemblies that each includes metal units connected to each other in a longitudinal direction. Each metal unit has a first longitudinal strip, two first transverse strips, two second transverse strips, and two second longitudinal strips having shorter longitudinal lengths than that of the first longitudinal strip, and being respectively disposed on the left and right sides of the first longitudinal strip and respectively spaced apart therefrom by intervals at which the second transverse strips are located. The top and bottom ends of the first longitudinal strip are respectively connected with the first transverse strips. At least one first transverse strip can be connected to a first transverse strip of an adjacent metal unit. Each second transverse strip can be connected to the first longitudinal strip and a corresponding second longitudinal strip.

    Airflow detection device for detecting whether air output path is obstructed

    公开(公告)号:US11733076B2

    公开(公告)日:2023-08-22

    申请号:US17500826

    申请日:2021-10-13

    Inventor: Wei-Hung Tsai

    CPC classification number: G01F1/11 G01F15/06 G01F15/14

    Abstract: An airflow detection device for detecting whether an air output path is obstructed can be mounted in the air output path and includes a carrying portion, a metallic sensing portion and a metallic air plate portion that are respectively positioned on the carrying portion and have different electrode polarities, so as to detect obstruction of the air output path. The airflow detection device can be applied to products located in remote areas, mountain areas, or other places where maintenance workers cannot inspect the products frequently for the state of their dust screens or ventilation holes, and can help warn of conditions such as ventilation hole obstruction to avoid product overheating due to dust or dirt accumulation on dust screens or ventilation hole obstruction, adverse impacts on product performance, service live or stability, or system crash.

    NETWORK SWITCH
    59.
    发明公开
    NETWORK SWITCH 审中-公开

    公开(公告)号:US20230239255A1

    公开(公告)日:2023-07-27

    申请号:US17741897

    申请日:2022-05-11

    Inventor: JIAN LI

    CPC classification number: H04L49/405 H04L49/111

    Abstract: A network switch displays a state signal of network connection ports by a combination of LEDs and includes a signal management unit, a control unit, switch members, and the LEDs. The signal management unit receives the state signal from the network connection ports and transmits data to the control unit to control each of the switch members and correspondingly output to control each of the LEDs. The state signal includes that a first state data outputs an active/inactive state via a first control signal, a second state data and a third state data output a link-down/up state and a connection speed state via a second control signal, so that the LEDs displays different states of the network connection ports based on a combination of each of the first control signal and each of the second control signal.

    ALUMINUM OR COPPER FOIL HEAT DISSIPATOR AND ELECTRONIC DEVICE HAVING THE SAME

    公开(公告)号:US20230189481A1

    公开(公告)日:2023-06-15

    申请号:US17706004

    申请日:2022-03-28

    Inventor: TZU-CHIH LIN

    CPC classification number: H05K7/20454

    Abstract: An electronic device having an aluminum or copper foil heat dissipator includes a casing, an electronic structure disposed in the casing, and an aluminum or copper foil heat dissipator. A surface of the electronic structure has a heat source element. The aluminum or copper foil heat dissipator is a 3D aluminum or copper foil structure formed by stamping and includes a bottom, a surrounding portion, and a 3D space formed between the bottom and the surrounding portion. The bottom is thermal conductively coupled to the heat source element. A surface of the aluminum or copper foil heat dissipator is partially/entirely thermal conductively coupled to an inner surface of the casing. With the characteristics of aluminum or copper foil that is easy to expand into a 3D shape during processing and could closely fit the inner surface, the heat generated by the heat source element could be dissipated from the 3D aluminum or copper foil with a large contact area, achieving better heat dissipation effect.

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