公开(公告)号：US20100067189A1

公开(公告)日：2010-03-18

申请号：US12211152

申请日：2008-09-16

Applicant: Cheng-Shen Hung

Inventor： Cheng-Shen Hung

IPC: H05K7/00

CPC classification number: G06F1/1632

Abstract: A light docking station applied to at least one portable electronic device, including: a bottom board module, a casing module, a circuit module, a first input/output module, a second input/output module, and a retaining module. The casing module has a casing mating with the bottom board module. The circuit module is disposed inside the casing of the casing module. The first input/output module is disposed on the casing of the casing module and electrically connected between the circuit module and a plurality of different peripherals. The second input/output module is disposed on the casing of the casing module and electrically connected between the circuit module and an external connector of the portable electronic device. The retaining module is disposed on a top side of the casing in order to mate with two retaining grooves that are disposed on a bottom side of the portable electronic device.

Abstract translation: 应用于至少一个便携式电子设备的光对接站包括：底板模块，壳体模块，电路模块，第一输入/输出模块，第二输入/输出模块和保持模块。 壳体模块具有与底板模块配合的壳体。 电路模块设置在壳体模块的壳体的内部。 第一输入/输出模块设置在壳体模块的壳体上，并且电连接在电路模块和多个不同的外围设备之间。 第二输入/输出模块设置在壳体模块的壳体上并电连接在电路模块和便携式电子设备的外部连接器之间。 保持模块设置在壳体的顶侧，以便与设置在便携式电子设备的底侧上的两个保持槽配合。

公开(公告)号：US20090026567A1

公开(公告)日：2009-01-29

申请号：US12149111

申请日：2008-04-28

Applicant: Shou-Lung Chen ,  Li-Cheng Shen

Inventor： Shou-Lung Chen ,  Li-Cheng Shen

IPC: H01L21/50 ,  H01L31/02

CPC classification number: H01L27/14618 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method for fabricating an image sensor package is disclosed, comprising: providing a wafer having a plurality of image sensor integrated circuits, each of which has a photosensitive active region and at least one first bonding pad; joining a transparent protecting material to the wafer wherein the photosensitive active region of the image sensor integrated circuit is covered by the transparent protecting material; forming a plurality of through holes in the transparent protecting material, the through holes being correspondingly to the first bonding pad of the wafer to expose the first bonding pad; and dicing the wafer to form a plurality of image sensor integrated circuit components. The method for fabricating an image sensor package of the present invention decreases the defects of the photosensitive active region and reduces the size of the package structure.

Abstract translation: 公开了一种用于制造图像传感器封装的方法，包括：提供具有多个图像传感器集成电路的晶片，每个图像传感器集成电路具有光敏有源区和至少一个第一焊盘; 将透明保护材料连接到晶片，其中图像传感器集成电路的光敏有源区域被透明保护材料覆盖; 在所述透明保护材料中形成多个通孔，所述通孔对应于所述晶片的所述第一焊盘，以暴露所述第一焊盘; 并切割晶片以形成多个图像传感器集成电路部件。 本发明的图像传感器封装的制造方法减少了光敏有源区的缺陷，并减小了封装结构的尺寸。

公开(公告)号：US20080099903A1

公开(公告)日：2008-05-01

申请号：US11849371

申请日：2007-09-04

Applicant: Li-Cheng Shen

Inventor： Li-Cheng Shen

IPC: H01L23/02 ,  H01L21/00

CPC classification number: H01L23/5389 ,  H01L21/568 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3025 ,  H01L2924/00

Abstract: An embedded chip package includes a substrate, a semiconductor structure, an encapsulating material layer and a plurality of conductive vias. Herein the substrate includes at least a dielectric layer and at least a patterned circuit layer disposed on the dielectric layer. The semiconductor structure is disposed on the substrate and has a plurality of electrical bonding pads, and the electrical bonding pads contact the dielectric layer. The encapsulating material layer is disposed on the substrate and around the semiconductor structure. In addition, a plurality of conductive vias is disposed in the substrate to electrically connect the patterned circuit layer to the electrical bonding pads.

Abstract translation: 嵌入式芯片封装包括衬底，半导体结构，封装材料层和多个导电通孔。 这里，衬底包括至少介电层和至少设置在电介质层上的图案化电路层。 半导体结构设置在基板上并具有多个电接合焊盘，电接合焊盘与电介质层接触。 封装材料层设置在基板上并围绕半导体结构。 此外，在衬底中设置多个导电通孔以将图案化电路层电连接到电接合焊盘。

公开(公告)号：US20070108629A1

公开(公告)日：2007-05-17

申请号：US11652088

申请日：2007-01-11

Applicant: Shu-Ming Chang ,  Lee-Cheng Shen ,  Wei-Chung Lo

Inventor： Shu-Ming Chang ,  Lee-Cheng Shen ,  Wei-Chung Lo

IPC: H01L23/48

CPC classification number: H01L23/3114 ,  H01L23/525 ,  H01L24/02 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/0233 ,  H01L2224/0235 ,  H01L2224/0236 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00

Abstract: A wafer level chip scale packaging structure and the method of fabricating the same are provided to form a sacrificial layer below the bump using a normal semiconductor process. The bump is used to connect the signals between the Si wafer and the PCB. The interface between the sacrificial layer and the adjacent layers is the weakest part in the whole structure. When the stress applied to the bump is overloaded, the interface between the sacrificial layer and the adjacent layers will crash to remove the stress generated by different thermal expansion coefficients of the Si wafer and the PCB. The sacrificial layer would help avoid the crash occurring to the bump to protect the electrical conduction between the Si wafer and the PCB.

Abstract translation: 提供晶片级芯片级封装结构及其制造方法，以使用正常的半导体工艺在凸块下方形成牺牲层。 该凸块用于连接Si晶圆和PCB之间的信号。 牺牲层和相邻层之间的界面是整个结构中最薄弱的部分。 当施加到凸块的应力过载时，牺牲层和相邻层之间的界面将崩溃以消除由Si晶片和PCB的不同热膨胀系数产生的应力。 牺牲层将有助于避免碰撞发生的碰撞以保护Si晶片和PCB之间的电导通。

公开(公告)号：US07214606B2

公开(公告)日：2007-05-08

申请号：US10798053

申请日：2004-03-11

Applicant: Yam Mo Wong ,  Chee Wai Siew ,  Wei Liu ,  Zuo Cheng Shen

Inventor： Yam Mo Wong ,  Chee Wai Siew ,  Wei Liu ,  Zuo Cheng Shen

IPC: H01L21/44 ,  H01L23/48 ,  B23K31/02

CPC classification number: H01L24/48 ,  H01L24/45 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48455 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48997 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: The invention provides a wire bond bonding a wire to a connection pad of an electronic device, and a method of forming the wire bond. A first stitch bond is formed on the connection pad, and a second stitch bond is next formed on the connection pad that is contiguous with the first stitch bond.

Abstract translation: 本发明提供一种将电线连接到电子设备的连接焊盘上的引线键合以及形成引线接合的方法。 在连接焊盘上形成第一缝合接头，接下来形成与第一针迹接合的连接焊盘上的第二缝合。

公开(公告)号：US07101585B2

公开(公告)日：2006-09-05

申请号：US10825445

申请日：2004-04-15

Applicant: Cheng Shen ,  Thomas J. Wagner

Inventor： Cheng Shen ,  Thomas J. Wagner

IPC: A23J1/00 ,  A23J1/14

CPC classification number: A23L2/68 ,  A23L2/66

Abstract: This invention is directed to a process for preparing a stable suspension of an acid beverage, wherein a hydrated protein stabilizing agent (A) and a flavoring material (B) are combined as a preblend (I) and combined with either a slurry of a homogenized protein material (C) or a homogenized preblend (II) of a hydrated protein stabilizing agent (A) and a slurry of a protein material (C) to form a blend and pasteurizing and homogenizing the blend wherein the homogenization of the blend is carried out in two stages comprising a high pressure stage of from 8000–30,000 pounds per square inch and a low pressure stage of from 300–1000 pounds per square inch; wherein the acid beverage composition has a pH of from 3.0 to 4.5.

Abstract translation: 本发明涉及一种制备酸性饮料的稳定悬浮液的方法，其中水合蛋白质稳定剂（A）和调味料（B）作为预混物（I）组合，并与均化的 蛋白质材料（C）或水合蛋白质稳定剂（A）的均质预混物（II）和蛋白质材料（C）的浆料形成共混物并巴氏消毒和均化混合物，其中进行共混物的均化 在两个阶段包括8000-30,000磅/平方英寸的高压阶段和300-1000磅/平方英寸的低压阶段; 其中所述酸性饮料组合物具有3.0至4.5的pH。

公开(公告)号：US07093060B2

公开(公告)日：2006-08-15

申请号：US10605161

申请日：2003-09-12

Applicant: Chien-Hsing Liu ,  Xin-Cheng Shen ,  Zheng-Zian Li

Inventor： Chien-Hsing Liu ,  Xin-Cheng Shen ,  Zheng-Zian Li

IPC: G06F12/00

CPC classification number: G06F13/4291

Abstract: The present invention provides a method as well as an architecture for a host equipped with a CPU-level processing capability to access a Non-Volatile Random Access Memory (NVRAM) and at least a controller via a simple 3-wire/4-wire mechanism. The data stored in the NVRAM are shared with the controller and the host. More importantly, a multi-access mechanism further having a pragmatic bit determines the pragmatic bit for either the controller or the NVRAM. With the method of the present invention, computer system resources can be fully utilized, and thereby, peripheral devices can be easily added to the system in an inexpensive and highly efficient way.

Abstract translation: 本发明提供一种方法以及用于主机的架构，其具有通过简单的3线/ 4线机制访问非易失性随机存取存储器（NVRAM）和至少控制器的CPU级处理能力 。 存储在NVRAM中的数据与控制器和主机共享。 更重要的是，进一步具有实用位的多访问机制确定了控制器或NVRAM的实际位。 利用本发明的方法，可以充分利用计算机系统资源，从而可以以便宜和高效的方式将外围设备轻易地添加到系统中。

公开(公告)号：US20050233053A1

公开(公告)日：2005-10-20

申请号：US10825445

申请日：2004-04-15

Applicant: Cheng Shen ,  Thomas Wagner

Inventor： Cheng Shen ,  Thomas Wagner

IPC: A23K1/00 ,  A23L2/66 ,  A23L2/68

CPC classification number: A23L2/68 ,  A23L2/66

Abstract: This invention is directed to a process for preparing a stable suspension of an acid beverage, wherein a hydrated protein stabilizing agent (A) and a flavoring material (B) are combined as a preblend (I) and combined with either a slurry of a homogenized protein material (C) or a homogenized preblend (II) of a hydrated protein stabilizing agent (A) and a slurry of a protein material (C) to form a blend and pasteurizing and homogenizing the blend wherein the homogenization of the blend is carried out in two stages comprising a high pressure stage of from 8000-30,000 pounds per square inch and a low pressure stage of from 300-1000 pounds per square inch; wherein the acid beverage composition has a pH of from 3.0 to 4.5.

Abstract translation: 本发明涉及一种制备酸性饮料的稳定悬浮液的方法，其中水合蛋白质稳定剂（A）和调味料（B）作为预混物（I）组合，并与均化的 蛋白质材料（C）或水合蛋白质稳定剂（A）的均质预混物（II）和蛋白质材料（C）的浆料形成共混物并巴氏消毒和均化混合物，其中进行共混物的均化 在两个阶段包括8000-30,000磅/平方英寸的高压阶段和300-1000磅/平方英寸的低压阶段; 其中所述酸性饮料组合物具有3.0至4.5的pH。

公开(公告)号：US20050233051A1

公开(公告)日：2005-10-20

申请号：US10825501

申请日：2004-04-15

Applicant: Cheng Shen

Inventor： Cheng Shen

IPC: A23L1/30 ,  A23L2/66 ,  C12C1/00

CPC classification number: A23L2/66 ,  A23L33/115

Abstract: This invention is directed to an acid beverage composition, comprising; (A) a hydrated protein stabilizing agent; (B) a protein material; (C) a triglyceride comprising a vegetable oil triglyceride, a genetically modified vegetable oil triglyceride or a synthetic triglyceride oil of the formula  wherein R1, R2 and R3 are aliphatic groups and contain from about 7 up to about 23 carbon atoms; and (D) a flavoring material comprising a fruit juice, a vegetable juice, glucono delta lactone, phosphoric acid or the sodium salts or acids of citric acid, malic acid, tartaric acid, lactic acid and ascorbic acid; wherein the acid beverage composition has a pH of from 3.0 to 4.5. Also disclosed is a process for preparing an acid beverage composition.

Abstract translation: 本发明涉及酸饮料组合物，其包含： （A）水合蛋白质稳定剂; （B）蛋白质材料; （C）含有植物油甘油三酸酯，转基因植物油甘油三酸酯或下式的合成甘油三酯油的甘油三酯其中R 1，R 2和R 2， 3个脂族基团并且含有约7个至约23个碳原子; 和（D）包含果汁，蔬菜汁，葡萄糖酸内酯，磷酸或柠檬酸，苹果酸，酒石酸，乳酸和抗坏血酸的钠盐或酸的调味料; 其中所述酸性饮料组合物具有3.0至4.5的pH。 还公开了一种制备酸性饮料组合物的方法。

公开(公告)号：US20050169639A1

公开(公告)日：2005-08-04

申请号：US10847192

申请日：2004-05-17

Applicant: Li-Cheng Shen

Inventor： Li-Cheng Shen

IPC: G02B6/42 ,  H04B10/12 ,  G02B6/36

CPC classification number: G02B6/4212

Abstract: An optoelectronic transmission module. In the optoelectronic transmission module, a light transmissive element has first and second ends and top and bottom surfaces, a circuit board transmits electrical signals and has first and second openings. The circuit board is conformably extended from the top surface of the light transmissive element to the bottom surface such that the first and second openings are aligned with the first and second ends respectively. Two light transducers, each having a light transmitter/detector optically aligned with one of the first and second ends of the light transmissive element, wherein the light transducers transmit/receive light signals through the light transmissive element and the light transmitter/detector thereof. Two electrical interconnections are disposed on the circuit board and neighbored with the two ends of the light transmissive element respectively to interconnect the electrical signals.

Abstract translation: 光电传输模块。 在光电传输模块中，透光元件具有第一端和第二端以及顶表面和底表面，电路板传输电信号并具有第一和第二开口。 电路板从透光元件的顶表面顺从地延伸到底表面，使得第一和第二开口分别与第一和第二端对准。 两个光换能器，每个具有与透光元件的第一和第二端之一光学对准的光发射器/检测器，其中光换能器通过透光元件和其光发射器/检测器发射/接收光信号。 两个电互连设置在电路板上并分别与透光元件的两端相邻以互连电信号。