Abstract:
A memory chip and method for operating the same are provided. The memory chip includes a number of pads. The method includes inputting a number of first test signals to the pads respectively, wherein the first test signals corresponding to two physically-adjacent pads are complementary; inputting a number of second test signals, respectively successive to the first test signals, to the pads, wherein the first test signal and the second test signal corresponding to each of the pads are complementary; and outputting expected data from the memory chip if the first test signals and the second test signals are successfully received by the memory chip.
Abstract:
A sense amplifying method, applied in a memory having a memory cell and a reference cell, includes: charging the memory cell and the reference cell to have a cell current and a reference current, respectively; duplicating the cell current and the reference current to respectively generate a mirrored cell current via a first current path and a mirrored reference current via a second current path and equalizing a first voltage drop generated as the mirrored cell current flows by the first current path and a second voltage drop generated as the mirrored reference current flows by the second current path; and removing the equalization of the first voltage drop and the second voltage drop and adjusting first voltage drop and the second voltage drop according to a first current flowing by the first current path and a second current flowing by the second current path.
Abstract:
A semiconductor structure comprising an SRAM/inverter cell and a method for forming the same are provided, wherein the SRAM/inverter cell has an improved write margin. The SRAM/inverter cell includes a pull-up PMOS device comprising a gate dielectric over the semiconductor substrate, a gate electrode on the gate dielectric wherein the gate electrode comprises a p-type impurity and an n-type impurity, and a stressor formed in a source/drain region. The device drive current of the pull-up PMOS device is reduced due to the counter-doping of the gate electrode.
Abstract:
A memory chip and method for operating the same are provided. The memory chip includes a number of pads. The method includes inputting a number of first test signals to the pads respectively, wherein the first test signals corresponding to two physically-adjacent pads are complementary; inputting a number of second test signals, respectively successive to the first test signals, to the pads, wherein the first test signal and the second test signal corresponding to each of the pads are complementary; and outputting expected data from the memory chip if the first test signals and the second test signals are successfully received by the memory chip.
Abstract:
A method for ensuring normal operation at an Early Power-On Self Test stage of a computer device is proposed. The method is applied to the computer devices having a timing function. A largest execution time for at least an Early POST program is preset, and the actual execution time of the Early POST program is counted when the computer device is activated. If the execution time of the POST program is greater than the largest execution time, the computer devices will then be restarted, the POST program will be re-executed, and the timing process of the POST program will be performed again, until execution time of every Early POST programs is smaller or equal to the corresponding preset largest execution time. Upon which, the timing will be terminated, and the computer devices will be able to enter into the stage of Later POST. This method ensures any Early POST program causing the system to hang to be cleared by automatically restarting the computer system, so that users will not experience system hangs during the Early POST stage.
Abstract:
A monitoring system and method utilizing System Management Interrupt is proposed. The monitoring system is applicable to electronic facilities for monitoring and recording operational status of the electronic facilities. According to the operational status, the electronic facility generates System Management Interrupt (SMI) related data, and execute a specific program (a SMI Handler) stored in a first data storage area of the data storage unit that allows the SMI related data to be stored in a second data storage area of the data storage unit. Base on the stored SMI related data, a system software tester will be able to analyze abnormal situations occurred in the electronic facilities.
Abstract:
A method of manufacturing a MOS transistor is provided. A gate insulation layer and a conductive layer are sequentially formed over a substrate. A pre-amorphization implantation is carried out to amorphize the conductive layer. The conductive layer and the gate insulation layer are patterned to form a gate structure. A first spacer is formed on the sidewall of the gate structure. A second pre-amorphization implantation is carried out to amorphize a portion of the substrate. A doped source/drain extension region is formed in the substrate on each side of the first spacer. A second spacer is formed on the sidewall of the first spacer and then a doped source/drain region is formed in the substrate on each side of the second spacer. A solid phase epitaxial process is carried out to convert the doped source/drain extension region and the doped source/drain region into a source/drain terminal. In the pre-amorphization implantations, dopants having an ionic radius greater than the germanium ion are used.
Abstract:
A method of manufacturing a MOS transistor is provided. A gate insulation layer and a conductive layer are sequentially formed over a substrate. A pre-amorphization implantation is carried out to amorphize the conductive layer. The conductive layer and the gate insulation layer are patterned to form a gate structure. A first spacer is formed on the sidewall of the gate structure. A second pre-amorphization implantation is carried out to amorphize a portion of the substrate. A doped source/drain extension region is formed in the substrate on each side of the first spacer. A second spacer is formed on the sidewall of the first spacer and then a doped source/drain region is formed in the substrate on each side of the second spacer. A solid phase epitaxial process is carried out to convert the doped source/drain extension region and the doped source/drain region into a source/drain terminal. In the pre-amorphization implantations, dopants having an ionic radius greater than the germanium ion are used.
Abstract:
A sucker structure includes a disk body having a rim portion, a supporting base formed on an upper portion of the disk body, a flexible snapping member mounted on an upper portion of the supporting base, and a drawing strip having a first end portion attached to the rim portion of the disk body and a second end portion attached to one distal end of the snapping member.
Abstract:
A method for fabricating a semiconductor device is disclosed. A dummy gate feature is formed between two active gate features in an inter-layer dielectric (ILD) over a substrate. An isolation structure is in the substrate and the dummy gate feature is over the isolation structure. Source/drain (S/D) features are formed at edges of the active gate features in the substrate for forming transistor devices. The disclosed method provides an improved method for reducing parasitic capacitance among the transistor devices. In an embodiment, the improved formation method is achieved by introducing species into the dummy gate feature to increase the resistance of the dummy gate feature.