Abstract:
A semiconductor memory has a memory cell array, a boosted voltage generator to generate a boosted voltage and a decoder to select memory cells in said memory cell array in response to an address signal. The voltage generator is activated in response to input of a first command, and kept active for a period of repeated input of a second command to control for the voltage generator, following the first command. The semiconductor memory may be provided with a regular operation mode in which the voltage generator is controlled to be in an active or inactive state by means of a first command signal in response to a predetermined signal, and a successive operation mode in which the voltage generator is kept active by a second command signal in response to another predetermined signal.
Abstract:
There is disclosed a semiconductor integrated circuit device comprising a memory cell array, row decoder, sense amplifier, column gate with two or more stages connected in series, column gate driving circuit, data latch, multiplexer, and address control circuit, and the multiplexer sequentially selects data corresponding to a predetermined address from a plurality of data latched by the data latch. The address control circuit reverses a driving signal for driving at least one stage of the column gate with two or more stages connected in series and selects the columns designated by the next selected plurality of addresses, while the multiplexer sequentially selects the data corresponding to the predetermined address.
Abstract:
According to one embodiment, a semiconductor memory device includes a plurality of blocks in a memory cell, each of the blocks acting as an erasure unit of data, the block including a plurality of pages, each of the pages including a plurality of memory cell transistors, each of the memory cell transistors being configured to be an erasure state or a first retention state based on a threshold voltage of the memory cell transistor, and a controller searching data in the block with respect to, writing a first flag denoting effective into a prescribed page of the block with the erasure state, and writing the first flag denoting non-effective into a prescribed page of the block with the first retention state, reading out the prescribed page of the block with the first retention state, and determining that the block is writable when the first flag denotes effective.
Abstract:
A memory device includes a memory chip that stores data, and an external controller that controls the memory chip. The memory chip includes multiple memory cells configured to store data of two or more bits; and an internal controller that executes a program operation for page data including a lower and an upper page program operation, and executes a read operation for page data including a lower and an upper page read operation. The external controller includes an error correction unit that performs error correction encoding on data to be programmed into the memory cell array and performs error correction decoding on data. The internal controller outputs the read page data from the memory cell array to the external controller, regardless of whether the upper page program operation is complete or not, in the upper page read operation.
Abstract:
A nonvolatile semiconductor memory that includes a memory cell array including a plurality of electrically writable memory cells; a plurality of word lines and a plurality of bit lines connected to the plurality of memory cells; and a data reading and programming control section. The data reading and programming control section includes: an adjacent memory cell data reading section; an adjacent memory cell data memory section; a reading voltage level control section; a data reading section for reading the data from a first memory cell at a plurality of reading voltages corresponding to a plurality of predetermined reading voltage verify levels controlled using the reading voltage level control section; and a data determining section for determining which data of 4-value data is programmed in the first memory cell based on the data which is read by the data reading section.
Abstract:
When performing a word line leak test to determine a leak state of the word lines, the control circuit applies, from the voltage control circuit to the word lines connected to the memory cell array written with test pattern data, voltages corresponding to the test pattern data. Thereafter, it switches the transfer transistors to a nonconductive state, thereby setting the word lines in a floating state. After a lapse of a certain time from switching of the transfer transistors to a nonconductive state, it activates the sense amplifier circuit to perform a read operation in the memory cell array. Then it compares a result of the read operation with an expectation value corresponding to the test pattern data.
Abstract:
A nonvolatile semiconductor device includes a first flash memory device; a second flash memory device in which data programming and/or reading is faster than in said first flash memory device; an address conversion table which correlates a logical address of a memory cell to a physical address designating said memory cell of said first and/or said second flash memory; an interface part which accepts an access request to a memory cell, an address conversion table search part which searches a physical address an access part which accesses a memory cell a counting part which counts the number of times a physical address has been accessed and generates an access count value of said physical address; a comparison part which compares whether said access count value of said physical address is more than a threshold or not; and a transmitting part which transmits data to said second flash memory device.
Abstract:
A nonvolatile semiconductor memory that includes a memory cell array including a plurality of electrically writable memory cells; a plurality of word lines and a plurality of bit lines connected to the plurality of memory cells; and a data reading and programming control section. The data reading and programming control section includes: an adjacent memory cell data reading section; an adjacent memory cell data memory section; a reading voltage level control section; a data reading section for reading the data from a first memory cell at a plurality of reading voltages corresponding to a plurality of predetermined reading voltage verify levels controlled using the reading voltage level control section; and a data determining section for determining which data of 4-value data is programmed in the first memory cell based on the data which is read by the data reading section.
Abstract:
A nonvolatile semiconductor memory device comprises: a memory cell array configured by a plurality of first and second lines and a plurality of memory cells, each of the memory cells being selected by the first and second lines and being configured to store multiple-bit data in a nonvolatile manner; a data bus configured to transmit write data to be written to the plurality of memory cells, the write data being configured by a plurality of unit data; a column selection unit configured by a plurality of data latches, each of the data latches being configured to directly receive the unit data inputted from the data bus and to retain the unit data; and a control unit configured to control activation/non-activation of the data latches. During a programming operation, for each unit data inputted to the column selection unit, the control unit activates one of the data latches corresponding to a certain one of the memory cells where the unit data is to be stored.
Abstract:
The height H of several kinds of basic cell are made the same and several kinds of macro cell which have a length which is an integral multiplication of the height H of this basic cell, are prepared, the basic cell and macro cell are mixed and the circuit of a peripheral circuit is designed. A M0 wire of a first wiring layer which is formed on a semiconductor substrate is used as a wire used within a macro cell. The basic cell and the macro cell are connected by a M1 wire of a second wiring layer which is formed on the first wiring layer and a M2 wire M2 of a third wiring layer. The transistor layout of basic cells and macro cells is designed and verified in advance and stored in a cell library, and auto routing by a standard method may be carried out.