Abstract:
A heat sink assembly having rotatable fins includes a housing, a first heat dissipating device, a rod, an elastic member and a lever. The housing includes a first sidewall having a first hole, a first sliding hole and a stop portion, and a second sidewall having a second hole and a second sliding hole. The first heat dissipating device is in the housing and has a third hole, a first protrusion sliding in the first sliding hole, and a second protrusion sliding in the second sliding hole. The rod passes through the first, second and third holes. The first heat dissipating device rotates between a first position and a second position with the rod of being a rotating center. A first end of the elastic member connects with the stop portion, and a second end thereof connects with the first protrusion. The lever moves with the second protrusion.
Abstract:
Contamination due to deposited particulate matter has been greatly reduced in single wafer sputter-etchers by coating the full interior of the sputtering shield with a layer of an arc-sprayed material such as aluminum, said layer being possessed of a high degree of surface roughness. The method for forming the coating of arc-sprayed aluminum is described and data comparing particulate contaminant count and product yield before and after the adoption of the present invention, are presented.
Abstract:
The present invention relates to offer a method to improve the property of films comprising a release film and a protective film. After separating from the release film, the protective film is bonded with TAC (Triacetyl Cellulose) film and then processed by relative coating, such as anti-reflecting coating, anti-glaring coating and surface hardening treatment, drying in an oven and separated the protective film from the TAC film. The present invention prevents the material consuming, which resulted from crack, snap and bend of the film in the process; and furthermore, practice costs is not too much and no additional expensive apparatus or treatment is necessary for a simplified procedure of the method.
Abstract:
A vacuum collector includes a filter housing, a filter member disposed in the filter housing, and a sweeping device disposed in the filter member for sweeping the filter member, to sweep of dirt from the filter member, and to allow the dirt to be removed from the filter member and to be collected. The sweeping device includes one or more flaps rotatably disposed in the filter member with such as a shaft for engaging with the filter member to sweep of dirt from the filter member when the flap is rotated relative to the filter member. One or more resiliently blades may be attached to the flap for engaging with the filter member.
Abstract:
A high voltage output level shifter, which has an input stage circuit, a current mirror and a current path switch. The input stage circuit has a first switch and a second switch. The current mirror has a third switch and a fourth switch. The first switch, the current path switch and the third switch form a current path such that the current path has a direct current when the third switch is turned on, and the fourth switch produces a current for the current mirror to turn off the current path switch, so that the direct current cannot be produced.
Abstract:
A polishing head with a floating knife-edge mechanism includes a base, a retaining ring secured to the base defining a pocket area beneath the base, and a lower assembly floating within the pocket area via a diaphragm seal. The lower assembly includes a disk-shaped support plate having a plurality of apertures distributed in a center region of the support plate, a clamp ring used to secure the diaphragm seal along a rim region of the support plate, and the floating knife-edge mechanism positioned between the rim region and the center region of the support plate.
Abstract:
The uniformity of material removal, as well as contamination due to deposited particulate matter, has been reduced in single wafer sputter-etchers by providing an improved gas baffle. Said gas baffle presents a smooth surface to the incoming sputtering gas so that it disperses uniformly throughout the sputtering chamber, thereby avoiding local fluctuations in pressure which, in turn, can lead to local differences in material removal rate as well as to particulate contamination of the surface that is being etched. The design of the baffle is described along with a method for attaching it to the inside of the sputtering shield.
Abstract:
A golf bombarding testing machine, which is mainly composed of a golf shooting apparatus, a club holding device, a ball-head holding device, a vibration-reducing device, a ball cage and a machine frame. By the club holding device or the ball-head holding device to fix the club or the ball-head, and by the application of the golf shooting apparatus to shoot out a golf which then hits the ball-head of the said club will reach the double functions of quick test for the ball-head or the connection strength between the club and the ball-head. Furthermore, by the installation of the vibration-reducing device, may greatly reduce the club's vibration caused by the hit on the ball-head and conduct the next test of hitting as soon as possible to increase the number of test in an unit time period.
Abstract:
The present invention relates to a textile ink-jet printing-purpose disperse dye micro-emulsion agent, which uses dispersing agents such as sodium polynaphthalene formaldehyde sulfonates, surfactants such as POE NP ether, and silicone derivative emulsion-type defoaming agents and bactericidal fungicidal agents for ink-jet CMYK four-color disperse dyes forming a stable dye micro-emulsion through micro-jetting homogenized emulsifier. This invention focuses on the disperse dyes suitable for polymers, applying a low-cost environmentally protective micro-emulsion agent in the ink protection technology so that the O/W model becomes a stable and homogenized system. This gives the textile ink-jet printing-purpose disperse dye micro-emulsion agent, with a dye particle diameter lying below 300 nm and high storage stability, rinse, sublimation, and light fastness over 4.
Abstract:
A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.