ELECTRIC COMPONENT MOUNTING SYSTEM AND ELECTRIC COMPONENT MOUNTING METHOD
    51.
    发明申请
    ELECTRIC COMPONENT MOUNTING SYSTEM AND ELECTRIC COMPONENT MOUNTING METHOD 有权
    电气组件安装系统和电气组件安装方法

    公开(公告)号:US20100071195A1

    公开(公告)日:2010-03-25

    申请号:US11813872

    申请日:2006-01-20

    Abstract: To provide an electronic component mounting system and an electronic component mounting method which can prevent a mounting failure due to positional error in a height direction of a substrate and ensure mounting quality.The electronic component mounting system includes a plurality of electronic component mounting devices connected to one another and mounts an electronic component on a substrate to manufacture a mounting substrate. A print test device for testing the substrate after solder printing measures a height position of a height measurement point set on the upper surface of the substrate 4 by a height measuring machine 22 and outputs a measurement result as substrate height data. In a component placing step using an electronic component placing device, a control parameter for controlling a component placing operation of the placing head 32 is updated. Accordingly, it is possible to correct a variation of the height position of an individual substrate and to prevent a mounting failure due to positional error in the height direction of the substrate.

    Abstract translation: 提供一种能够防止由于基板的高度方向上的位置误差引起的安装故障并确保安装质量的电子部件安装系统和电子部件安装方法。 电子部件安装系统包括彼此连接的多个电子部件安装装置,并将电子部件安装在基板上以制造安装基板。 用于在焊接印刷之后测试基板的印刷测试装置通过高度测量机22测量设置在基板4的上表面上的高度测量点的高度位置,并输出测量结果作为基板高度数据。 在使用电子部件放置装置的部件放置步骤中,更新用于控制放置头32的部件放置操作的控制参数。 因此,可以校正单个基板的高度位置的变化,并且可以防止由于基板的高度方向上的位置误差引起的安装故障。

    SCREEN PRINTING APPARATUS AND SCREEN PRINTING METHOD
    52.
    发明申请
    SCREEN PRINTING APPARATUS AND SCREEN PRINTING METHOD 有权
    屏幕打印设备和画面打印方法

    公开(公告)号:US20080289518A1

    公开(公告)日:2008-11-27

    申请号:US12123959

    申请日:2008-05-20

    Abstract: In supply of feedback data to improve a positional deviation quantity and a deviation state of a soldering paste printed on individual substrates held on the carrier, a plurality of average values of individual positional deviation for each of the individual substrates are obtained, and then, if the deviation value ΔM indicating a difference between the maximum value Mmax and the minimum value Mmin of the plurality of average values M of individual positional deviation is less than or equal to the tolerance value Δ(t), an intermediate value of the maximum value Mmax and the minimum value Mmin is obtained, and the positioning parameters of the mask plate and the carrier are corrected based on the intermediate value (Mmax+Mmin)/2.

    Abstract translation: 在提供反馈数据以改善印刷在保持在载体上的各个基板上的焊膏的位置偏差量和偏移状态时,获得每个单独基板的单独位置偏差的多个平均值,然后,如果 指示各个位置偏差的多个平均值M的最大值Mmax与最小值Mmin之间的差的偏差值DeltaM小于或等于公差值Delta(t),最大值Mmax的中间值 并且获得最小值Mmin,并且基于中间值(Mmax + Mmin)/ 2来校正掩模板和载体的定位参数。

    Polishing apparatus
    55.
    发明申请

    公开(公告)号:US20070087663A1

    公开(公告)日:2007-04-19

    申请号:US11602336

    申请日:2006-11-21

    CPC classification number: B24B47/22 B24B37/30 B24B49/16 H01L21/30625

    Abstract: A polishing apparatus has a polishing table (12) with a polishing surface (10) attached thereon, and a top ring (20) for pressing a workpiece (W) against the polishing surface (10). The top ring (20) has a housing (40) and a retainer ring (44) vertically movable in the housing (40) for holding an outer circumferential edge of the workpiece (W). The polishing apparatus includes a vertically moving mechanism operable to vertically move the top ring (20), a bracket (28) vertically movable together with the top ring (20), a stopper (32) adjustable in vertical position to prevent downward movement of the bracket (28), and a sensor (36) for detecting a distance between the stopper (32) and the bracket (28). The polishing apparatus also includes a control unit (34) operable to adjust the stopper (32) in vertical position when the retainer ring (44) is brought into contact with the polishing surface (10) while a lower surface of the housing (40) of the top ring (20) is located at a predetermined height from the polishing surface (10) so that the distance between the stopper (32) and the bracket (28) is equal to a difference between a height of the lower surface of the housing (40) from the polishing surface (10) at the time of polishing and the predetermined height.

    Quinolizinone compound and use thereof as HIV integrase inhibitor
    56.
    发明申请
    Quinolizinone compound and use thereof as HIV integrase inhibitor 有权
    喹诺酮酮化合物及其作为HIV整合酶抑制剂的用途

    公开(公告)号:US20060084665A1

    公开(公告)日:2006-04-20

    申请号:US11230330

    申请日:2005-09-20

    CPC classification number: C07D471/04 A61K31/4745 A61K31/519 C07D455/02

    Abstract: A pharmaceutical agent having an anti-HIV action, particularly, a pharmaceutical agent having an integrase inhibitory action, is provided. The present invention relates to a quinolizinone compound represented by the following formula [I] wherein each symbol is as defined in the specification, a pharmaceutically acceptable salt thereof, and an anti-HIV agent containing same as an active ingredient. The compound of the present invention has an HIV integrase inhibitory action and is useful as an anti-HIV agent for the prophylaxis or therapy of AIDS. Moreover, by a combined use with other anti-HIV agents such as protease inhibitors, reverse transcriptase inhibitors and the like, the compounds can become a more effective anti-HIV agent. Since the compound has a high inhibitory activity specific for integrases, the compound can provide a safe pharmaceutical agent for human with a fewer side effects.

    Abstract translation: 提供具有抗HIV作用的药剂,特别是具有整合酶抑制作用的药剂。 本发明涉及由下式[I]表示的喹嗪酮化合物,其中各符号如说明书中所定义,其药学上可接受的盐和含有作为活性成分的抗HIV剂。 本发明的化合物具有HIV整合酶抑制作用,可用作预防或治疗AIDS的抗HIV剂。 此外,通过与其它抗HIV剂如蛋白酶抑制剂,逆转录酶抑制剂等的组合使用,化合物可以成为更有效的抗HIV剂。 由于化合物对整合酶具有高的抑制活性,所以化合物可以为人体提供安全的药剂,副作用较少。

    Wooden nail-like connector, compressed bamboo material, and method of manufacturing the connector and the material
    57.
    发明申请
    Wooden nail-like connector, compressed bamboo material, and method of manufacturing the connector and the material 审中-公开
    木钉形连接器,压缩竹材料,以及制造连接器和材料的方法

    公开(公告)号:US20060060263A1

    公开(公告)日:2006-03-23

    申请号:US10545374

    申请日:2003-08-28

    Applicant: Masafumi Inoue

    Inventor: Masafumi Inoue

    CPC classification number: B27J1/00 B27M3/00 F16B15/00

    Abstract: A method is disclosed for manufacturing bamboo nails. The method includes horizontally laying down small bamboo plates, obtained by cutting a bamboo piece radially from the center axis thereof, in a press. The small bamboo plates are then pressed perpendicularly to the fibers to produce a compressed flat plate. Finally, the compressed flat plate is cut in the shape of a multangular column. Thus the strength of a wooden material is increased.

    Abstract translation: 披露制造竹钉的方法。 该方法包括水平放置通过在压机中从其中心轴线径向切割竹片而获得的小竹板。 然后将小竹板垂直于纤维压制以产生压缩的平板。 最后,将压缩平板切割成多角柱形。 因此,木材的强度增加。

    Compressor with compact screw connected housing and adjustable mounting means
    58.
    发明授权
    Compressor with compact screw connected housing and adjustable mounting means 失效
    压缩机紧凑螺丝连接外壳和可调安装方式

    公开(公告)号:US06957950B2

    公开(公告)日:2005-10-25

    申请号:US10356624

    申请日:2003-02-03

    CPC classification number: F04B39/121 F04B27/1081

    Abstract: According to the invention, a compressor having a threaded screw connection portion formed directly on a fitting portion of the housing is provided. Since no through bolt or the like for connecting two-parts of the housing is used, the diameter of the housing can be reduced. However, in a case that a suction port and discharge port do not align with an external mounting structure, a mounting means able to slide on the housing and adjust the positions of mounting brackets at least in the direction of rotation is added.

    Abstract translation: 根据本发明,提供一种压缩机,其具有直接形成在壳体的装配部分上的螺纹连接部分。 由于不使用用于连接壳体的两部分的通过螺栓等,因此可以减小壳体的直径。 然而,在吸入口和排出口不与外部安装结构对准的情况下,增加了能够在壳体上滑动并且至少沿旋转方向调节安装支架的位置的安装装置。

    Data processing system
    59.
    发明申请
    Data processing system 失效
    数据处理系统

    公开(公告)号:US20050193156A1

    公开(公告)日:2005-09-01

    申请号:US11037092

    申请日:2005-01-19

    CPC classification number: G06F9/4812

    Abstract: This invention provides a data processing system capable of performing an interrupt exception handling routine as many times as the number of times of occurrence of a request event for the same interrupt exception handling routine if the request event occurs a plurality of times. A software interrupt counter or a hardware interrupt counter for retaining the number of times of occurrence of an interrupt request generation event counts up when a software processing which generates a software interrupt or a hardware event that generates a hardware interrupt occurs, and counts down when a CPU performs a processing for removing the interrupt request. If the value of the software interrupt counter and the value of the hardware interrupt counter are not zero, a software interrupt request signal and a hardware interrupt request signal to the CPU are asserted.

    Abstract translation: 本发明提供一种能够执行中断异常处理程序的数据处理系统,如果请求事件发生多次,则能够执行相同中断异常处理例程的请求事件发生次数的次数多次。 当产生软件中断的软件处理或产生硬件中断的硬件事件发生时,软件中断计数器或用于保持中断请求生成事件发生次数的硬件中断计数器递增计数,当一个 CPU执行删除中断请求的处理。 如果软件中断计数器的值和硬件中断计数器的值不为零,则向CPU发出软件中断请求信号和硬件中断请求信号。

    Polishing apparatus
    60.
    发明授权
    Polishing apparatus 失效
    抛光设备

    公开(公告)号:US06409576B1

    公开(公告)日:2002-06-25

    申请号:US09626124

    申请日:2000-07-26

    CPC classification number: H01L21/67219 B24B37/013 B24B37/345 B24B49/12

    Abstract: A polishing apparatus for polishing a surface of a workpiece has a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning a polished surface of the workpiece, a rotating mechanism for rotating the workpiece during cleaning or after cleaning, and a sensor for detecting a reference position of the workpiece. The polishing apparatus further having a controller for controlling the rotating mechanism to stop the workpiece against rotation to align the reference position with a predetermined position based on a detecting signal from the sensor, and a film thickness measuring device for measuring a thickness of a polished surface layer of the aligned workpiece.

    Abstract translation: 用于抛光工件表面的抛光装置具有用于抛光工件表面的抛光部分,用于清洁工件的抛光表面的清洁部分,用于在清洁期间或清洁之后使工件旋转的旋转机构,以及传感器 用于检测工件的基准位置。 所述研磨装置还具有控制器,所述控制器用于控制所述旋转机构,以基于来自所述传感器的检测信号,使所述工件停止旋转,以使所述基准位置与预定位置对准;以及膜厚测量装置,用于测量抛光表面的厚度 对齐的工件的层。

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